EPF10K30AQC208-3

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP

Quantity 769 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30AQC208-3 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP

The EPF10K30AQC208-3 is a FLEX 10KA family field programmable gate array (FPGA) device providing embedded programmable logic for system-level integration. It combines a logic array and embedded memory resources to implement general logic functions and megafunctions for embedded system designs.

Designed for commercial-grade applications, the device targets embedded systems and board-level designs that require on-chip memory, flexible I/O, and in‑circuit reconfigurability within a 208-pin surface-mount package.

Key Features

  • Logic Capacity  Provides 1,728 logic elements and 216 logic array blocks for implementing combinational and sequential logic.
  • Embedded Memory  Approximately 12,288 bits of embedded RAM to support on-chip storage and megafunction memory blocks.
  • I/O and Interfacing  147 user I/O pins with flexible I/O options; FLEX 10KA family supports MultiVolt I/O and 5.0‑V tolerant input pins as a family feature.
  • Gate Density  Documented device gate count: 69,000 gates (system gate metric included in product data).
  • Power and Voltage  Operates from 3.0 V to 3.6 V supply range compatible with 3.3 V systems; family-level features include low-power standby (typical <0.5 mA for most devices).
  • Configuration and Test  Supports in‑circuit reconfigurability via external configuration device or JTAG; includes JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1.
  • Clocking and Arithmetic Support  Family features include dedicated carry and cascade chains for efficient arithmetic and high‑fan‑in functions, plus low‑skew clock distribution.
  • Package and Mounting  208‑BFQFP (208‑PQFP, 28×28) surface-mount package; supplier device package listed as 208‑PQFP (28×28).
  • Operating Conditions  Commercial grade operation from 0 °C to 70 °C and RoHS compliant.

Typical Applications

  • Embedded System Integration  On‑chip logic and embedded RAM enable consolidation of glue logic, controllers, and custom functions for compact system designs.
  • Peripheral and Bus Interfaces  Flexible I/O and family-level PCI support make the device suitable for implementing bus bridges and peripheral interface logic.
  • Memory and Megafunction Implementation  Embedded RAM blocks support on‑device FIFO, buffer, and small memory megafunctions to reduce external memory dependence.
  • Prototyping and Custom Logic  Reconfigurability and JTAG support facilitate board-level prototyping and iterative logic development.

Unique Advantages

  • System-on-a-Programmable-Chip Integration:  Embedded arrays and logic array combine to implement both specialized memory megafunctions and general logic on a single device, reducing BOM counts.
  • Balanced Logic and Memory:  1,728 logic elements paired with ~12,288 bits of embedded RAM provide a balance of logic density and on‑chip storage for mixed workload designs.
  • Flexible I/O:  MultiVolt I/O support and 5.0‑V tolerant input capability (FLEX 10KA family feature) enable interfacing with a variety of board-level signaling standards.
  • In‑Circuit Reconfigurability and Test:  JTAG boundary-scan and in‑circuit reconfiguration options streamline programming, debug, and production test flow.
  • Commercial Package and Compliance:  208‑pin surface-mount BFQFP package and RoHS compliance support standard assembly and regulatory expectations for commercial products.
  • Clock and Arithmetic Optimizations:  Dedicated carry and cascade chains and low‑skew clock trees help simplify implementation of high-speed adders, counters, and wide combinational logic.

Why Choose EPF10K30AQC208-3?

The EPF10K30AQC208-3 delivers a practical combination of logic resources, embedded memory, and flexible I/O in a commercial-grade, 208‑pin surface-mount package. Its family-level features—embedded programmable arrays, MultiVolt I/O, in‑circuit reconfiguration, and JTAG—support system integration tasks where consolidating functionality on-chip reduces board complexity.

This device is suited for designers developing embedded systems, peripheral interfaces, and prototyping platforms that require deterministic on‑chip memory, reconfigurable logic, and standard commercial operating conditions. Its RoHS compliance and common package format make it straightforward to integrate into existing production flows.

If you would like pricing, availability, or a formal quote for EPF10K30AQC208-3, submit an inquiry or request a quote through your procurement process.

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