EPF10K30AQC240-1N

The EPF10K30AQC240-1N is a FLEX-10KA family field-programmable gate array supplied in a 240-BFQFP surface-mount package. It combines a logic array and embedded memory resources to implement glue logic, custom peripherals, and system-level functions for commercial embedded designs.

Designed for 3.0–3.6 V systems and commercial temperature operation (0 °C to 70 °C), this device is targeted at applications that require moderate density logic, abundant I/O, and in-system configurability.

Key Features

• Logic Capacity — 1,728 logic elements organized across 216 logic array blocks (LABs), enabling implementation of medium-complexity logic and state machines.
• Embedded Memory — Approximately 0.0123 Mbits (12,288 bits) of on-chip RAM provided by embedded array blocks for FIFOs, buffers, and small tables.
• Gate Density — Up to 69,000 maximum system gates for mixed logic-and-memory designs.
• I/O — 189 user I/O pins, suitable for multiple peripheral interfaces and parallel connections.
• Package & Mounting — 240-BFQFP package (supplier device package: 240-PQFP 32×32) with surface-mount mounting type for PCB assembly.
• Power Supply & Temperature — Operates from 3.0 V to 3.6 V and rated for commercial grade operation from 0 °C to 70 °C.
• Family System Features — FLEX 10K family capabilities include embedded array blocks (EABs) for efficient memory/megafunction implementation, in-circuit reconfigurability via external configuration device or JTAG, and JTAG boundary-scan compliant with IEEE 1149.1.
• Interconnect & Arithmetic Support — FastTrack continuous routing structure, dedicated carry and cascade chains for efficient arithmetic and high fan-in logic implementation.
• Regulatory — RoHS compliant.

Typical Applications

• Peripheral Bridging and Interface Conversion — Use the device’s abundant I/O and embedded memory to implement protocol adapters, bus bridges, and parallel-to-serial interfaces.
• Custom Control and Glue Logic — Implement system control, sequencing, and glue logic between processors, sensors, and peripherals using the device’s logic elements and LAB structure.
• Embedded Memory Functions — Employ on-chip RAM for FIFOs, small data buffers, and lookup tables in communication and data-acquisition tasks.
• Prototyping and Low-to-Mid Density FPGA Designs — Suitable for development platforms and production designs that require reconfigurable logic with moderate gate counts and plentiful I/O.

Unique Advantages

• Balanced Logic and Memory — 1,728 logic elements paired with 12,288 bits of embedded RAM provide a well-rounded resource mix for control logic plus local storage without external memory for small datasets.
• High I/O Count — 189 user I/O pins enable direct connections to multiple peripherals, sensors, or buses, reducing the need for external I/O expanders.
• In-System Reconfigurability — Supports in-circuit reconfiguration and JTAG boundary-scan for flexible development workflows and firmware updates in the field.
• Deterministic Interconnect — FastTrack routing and dedicated carry/cascade chains simplify implementation of arithmetic, counters, and high-fan-in logic while helping timing predictability.
• Standard Commercial Footprint — 240-pin PQFP/BFQFP package fits common production assembly processes and PCB layouts for compact boards.
• Regulatory Compliance — RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose EPF10K30AQC240-1N?

The EPF10K30AQC240-1N positions itself as a flexible, medium-density FPGA solution for commercial embedded designs that need a mix of logic, embedded RAM, and extensive I/O in a compact 240-pin surface-mount package. Its family-level features—such as embedded array blocks, dedicated arithmetic chains, in-circuit reconfigurability, and JTAG support—make it suitable for applications where design iteration, on-board configurability, and moderate gate counts are important.

Choose this device when you need scalable logic resources, straightforward I/O integration, and the ability to implement custom peripherals or glue logic without moving to higher-cost, higher-density FPGA families.

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