EPF10K30AQC240-2N
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 189 12288 1728 240-BFQFP |
|---|---|
| Quantity | 12 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 189 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 69000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K30AQC240-2N – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 189 12288 1728 240-BFQFP
The EPF10K30AQC240-2N is a FLEX-10KA family FPGA in a 240-pin BFQFP package designed for commercial embedded applications. It provides a balance of logic capacity, embedded RAM, and I/O density for consolidating glue logic, control functions, and custom peripherals on a single programmable device.
Built on the FLEX 10K architecture, the device combines a logic array and embedded array blocks to deliver configurable logic resources, on-chip memory, and flexible I/O for system-level integration and reprogrammability.
Key Features
- Logic Capacity — 1,728 logic elements organized across 216 LABs to implement combinational and sequential logic functions.
- On-chip Memory — 12,288 bits of embedded RAM for data buffering, small FIFOs, and register storage.
- I/O Density — 189 user I/O pins to support parallel interfaces, buses, and multiple control signals.
- Gate Capacity — 69,000 gates (as specified) for system-level logic consolidation.
- Supply Voltage — Operates from 3.0 V to 3.6 V to match common 3.3 V system rails.
- Package & Mounting — 240-BFQFP (supplier device package: 240-PQFP, 32×32) in a surface-mount form factor suitable for dense PCB layouts.
- Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
- In-circuit Reconfigurability & Test — Supports in-circuit reconfiguration via external configuration device or JTAG, and includes JTAG boundary-scan test (IEEE Std. 1149.1-1990) functionality as part of the FLEX 10K family.
- Family-level Interconnect & Performance Features — FLEX 10K family features such as dedicated carry and cascade chains, low-skew clock distribution, and continuous routing (FastTrack interconnect) are part of the device architecture described for this family.
- Compliance — RoHS compliant.
Typical Applications
- Commercial Embedded Systems — Implement control logic, protocol handling, and custom peripherals in consumer and commercial products where commercial-grade temperature range is acceptable.
- Prototyping and Development — Use the device for rapid prototyping of system functions and for validating custom logic before production.
- Interface Bridging and Glue Logic — Consolidate multiple discrete logic functions and bus interfacing into a single programmable device to simplify board design.
- Custom Control and Sequencing — Implement state machines, control paths, and timing-critical logic using the device’s logic elements and clocking resources.
Unique Advantages
- Balanced Logic and Memory — With 1,728 logic elements and 12,288 bits of embedded RAM, the device supports moderate-density designs that require both logic and on-chip storage.
- High I/O Count — 189 user I/O pins enable integration of multiple peripheral interfaces without external multiplexing.
- Reconfigurability — In-circuit reconfiguration and JTAG support enable firmware-driven updates and boundary-scan testability for production diagnostics.
- Standard 3.3 V Support — Operates from 3.0 V to 3.6 V to align with common 3.3 V system domains.
- Compact Surface-Mount Package — 240-pin BFQFP (32×32 PQFP equivalent) allows a dense footprint while providing ample I/O and routing options.
- RoHS Compliant — Meets RoHS requirements for lead-free manufacturing processes.
Why Choose EPF10K30AQC240-2N?
The EPF10K30AQC240-2N offers a practical mix of logic elements, embedded RAM, and high I/O count in a commercial-grade FLEX-10KA device. It is positioned for developers and integrators who need a reprogrammable platform to consolidate control logic, interface glue, and small on-chip memory in space-constrained, surface-mount applications.
Supported by FLEX 10K family architectural features—such as dedicated carry/cascade chains, low-skew clock distribution, and in-circuit reconfigurability—this device provides a scalable option for mid-density programmable designs where vendor-supported tools and family-level capabilities are important for long-term development and maintenance.
If you would like pricing or availability information, submit a request for a quote and include your required quantity and delivery timeframe.

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