EPF10K30AQI208-3
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP |
|---|---|
| Quantity | 1,200 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 69000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K30AQI208-3 – FLEX-10KA FPGA, 1,728 logic elements, 147 I/O, 208-BFQFP
The EPF10K30AQI208-3 is a FLEX-10KA field programmable gate array (FPGA) supplied in a 208-BFQFP surface-mount package. It provides 1,728 logic elements, approximately 12,288 bits of embedded RAM and 147 user I/O, delivering mid-density programmable logic for embedded and industrial designs.
As a member of the FLEX 10K family, this device inherits series-level capabilities such as embedded arrays for megafunctions, JTAG boundary-scan, and in-circuit reconfigurability. The part is specified for industrial operation with a 3 V to 3.6 V supply range and an operating temperature of -40 °C to 85 °C.
Key Features
- Core Logic — 1,728 logic elements providing implementation capacity corresponding to the device's 69,000 gates figure for mid-density designs.
- Embedded Memory — Approximately 12,288 bits of on-chip RAM for small buffers, FIFOs or state storage in embedded applications.
- I/O Count & Controls — 147 user I/O pins to connect multiple peripherals and interfaces; benefits from FLEX 10K family I/O capabilities such as tri-state control and programmable output slew-rate (series feature).
- Package & Mounting — 208-BFQFP (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for standard PCB assembly.
- Power — Operates from a 3 V to 3.6 V supply range compatible with 3.3 V system domains.
- Industrial Temperature & Compliance — Specified for -40 °C to 85 °C operation and RoHS compliant.
- FLEX 10K Family Capabilities — Includes series-level features such as embedded arrays for implementing megafunctions, JTAG boundary-scan for test, FastTrack interconnect, dedicated carry and cascade chains, and in-circuit reconfigurability.
Typical Applications
- Industrial Control — Implement custom control logic, I/O aggregation and sensor interfacing in industrial automation equipment using the part's industrial temperature rating and abundant I/O.
- Embedded System Glue Logic — Bridge peripherals, implement protocol conversion, or consolidate discrete logic functions within embedded controllers thanks to the mid-density logic and available RAM.
- Communications & Interface Bridging — Realize custom interface logic and buffering for serial/parallel links and legacy interfaces using flexible I/O and embedded memory.
- Test & Measurement — Build programmable signal routing, timing control and boundary-scan test capability for instrumentation and verification systems.
Unique Advantages
- Mid-density, practical capacity: 1,728 logic elements and a 69,000-gate-equivalent capacity fit applications that require more than simple PLDs but less than high-end FPGAs.
- Substantial I/O count: 147 user I/O pins allow connections to multiple sensors, actuators and peripheral devices without external multiplexing.
- Industrial-ready: Rated for -40 °C to 85 °C and RoHS compliant, suitable for deployed systems in industrial environments.
- Embedded memory for local buffering: Approximately 12,288 bits of on-chip RAM enable small data storage, FIFOs and state machines without external memory.
- Board-level integration: 208-BFQFP surface-mount package balances pin density and board assembly ease for compact designs.
- Testability and reconfigurability: Family-level JTAG boundary-scan and in-circuit reconfigurability improve manufacturing test flows and field updates.
Why Choose EPF10K30AQI208-3?
The EPF10K30AQI208-3 positions itself as a practical, industrial-grade FPGA for designers who need reliable mid-density programmable logic with a broad I/O complement and on-chip memory. Its FLEX 10K family heritage brings series-level features—such as embedded array megafunction support, boundary-scan test, and in-circuit reconfiguration—that streamline development and deployment.
This device is well suited to embedded and industrial applications that require flexible logic implementation, significant peripheral connectivity, and operation across extended temperatures. For teams seeking a proven FPGA footprint with design-toolchain support consistent with the FLEX 10K family, the EPF10K30AQI208-3 delivers a balanced combination of capacity, connectivity and industrial robustness.
Request a quote or submit a procurement inquiry for EPF10K30AQI208-3 to receive pricing and availability information for your project.

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