EPF10K30AQI240-3

IC FPGA 189 I/O 240QFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 189 12288 1728 240-BFQFP

Quantity 740 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case240-BFQFPNumber of I/O189Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30AQI240-3 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 189 12288 1728 240-BFQFP

The EPF10K30AQI240-3 is an Intel FLEX-10KA family field programmable gate array (FPGA) offering embedded programmable logic for system-level integration. It combines a logic array and embedded memory resources to implement custom logic, interface glue, and megafunctions for industrial applications.

This device provides a balanced mix of logic and on-chip RAM with 1,728 logic elements, 216 LABs, 12,288 bits of embedded RAM and up to 189 user I/O pins. It is supplied in a 240-pin BFQFP surface-mount package and rated for industrial temperature operation.

Key Features

  • Core Logic 1,728 logic elements and 216 LABs deliver approximately 69,000 gates of usable logic for implementing combinational and sequential functions.
  • Embedded Memory 12,288 total RAM bits suitable for on-chip data buffering, small FIFOs, and state storage for control logic and megafunctions.
  • I/O and Interfaces Up to 189 user I/O pins with per-pin control options typical of the FLEX 10K family, enabling flexible interfacing to external peripherals and buses.
  • Configurable Power Designed for operation from 3.0 V to 3.6 V, supporting common 3.3 V system rails.
  • System and Test Built-in JTAG boundary-scan circuitry (IEEE Std. 1149.1) and support for in-circuit reconfigurability facilitate board-level test and field updates without consuming user logic.
  • Clocking and Timing Family features include low-skew clock distribution and options such as ClockLock™/ClockBoost™ for controlled clock behavior and reduced skew where required.
  • Package & Mounting 240-BFQFP / 240-PQFP (32×32) surface-mount package balances pin count and board area for medium-density FPGA deployments.
  • Industrial Reliability Specified operating temperature range of −40 °C to 85 °C and RoHS compliance for industrial-grade applications.

Typical Applications

  • Industrial Control Implement control logic, sensor interfacing, and custom timing functions for PLCs, motor controllers, and factory automation where industrial temperature operation is required.
  • Embedded Systems Use on-chip RAM and logic to build system-on-programmable-chip (SOPC) components such as protocol handlers, custom peripherals, and glue logic for embedded products.
  • Interface & Protocol Bridging Leverage flexible I/O and dedicated routing to create interface translators, bus bridges, and glue logic between legacy and modern peripherals.
  • In-field Reconfigurable Designs Support in-circuit reconfiguration for field-upgradeable logic, allowing iterative feature updates without board replacements.

Unique Advantages

  • Balanced Logic-to-Memory Ratio: 1,728 logic elements paired with 12,288 bits of embedded RAM provide the capacity to implement both control-oriented logic and on-chip data storage without external memory in many designs.
  • High I/O Count in a Compact Package: 189 user I/Os in a 240-pin BFQFP package give board designers flexibility to connect multiple peripherals while conserving board area.
  • Industrial Temperature Rating: Specified −40 °C to 85 °C operation supports deployment in harsh or temperature-variable environments common to industrial applications.
  • Test and Field Update Support: Built-in JTAG boundary-scan and in-circuit reconfigurability simplify manufacturing test, debugging, and field firmware updates.
  • Vendor Ecosystem: Part of the FLEX 10K family, enabling reuse of family-level design approaches and megafunctions to accelerate development.

Why Choose EPF10K30AQI240-3?

The EPF10K30AQI240-3 is positioned for engineers needing a reliable, industrial-rated FPGA with a practical mix of logic, embedded RAM, and I/O in a 240-pin surface-mount package. Its embedded memory and logic resources make it suitable for control, interface, and mid-density programmable logic applications where in-field reconfigurability and board-level testability are important.

Choose this device when you require a compact, reconfigurable building block that integrates control logic and buffering on-chip, supports standard 3.3 V system rails, and meets industrial temperature requirements while remaining RoHS compliant.

Request a quote or submit an RFQ to obtain pricing and lead-time information for EPF10K30AQI240-3.

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