EPF10K30AQI240-3N

IC FPGA 189 I/O 240QFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 189 12288 1728 240-BFQFP

Quantity 1,160 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case240-BFQFPNumber of I/O189Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30AQI240-3N – FLEX-10KA® Field Programmable Gate Array (FPGA) IC — 1,728 logic elements, 12,288-bit RAM, 189 I/O, 240‑BFQFP

The EPF10K30AQI240-3N is a FLEX‑10KA family FPGA providing a balance of logic density, embedded memory and I/O capability in a 240‑pin BFQFP surface‑mount package. It is engineered for system‑level integration where reconfigurable logic, on‑chip RAM and substantial I/O count are required.

Targeted at industrial applications and embedded systems, this device supports System‑on‑a‑Programmable‑Chip (SOPC) integration, in‑circuit reconfigurability and a 3.0–3.6 V supply range, enabling flexible deployment across a variety of embedded designs.

Key Features

  • Logic Capacity — 1,728 logic elements delivering approximately 69,000 system gates for implementing a broad range of custom logic and control functions.
  • Embedded Memory — 12,288 total RAM bits (approximately 0.012 Mbits) of on‑chip memory for FIFOs, buffers and small data stores without external RAM.
  • High I/O Count — 189 user I/O pins to support dense peripheral interfaces, bus bridging and multiple signal domains.
  • Power — Operates from 3.0 V to 3.6 V supply, compatible with 3.3 V system domains.
  • Package & Mounting — 240‑BFQFP (supplier package 240‑PQFP 32×32) surface‑mount package for board‑level integration where pin count and thermal considerations are balanced.
  • Industrial Temperature Range — Specified for operation from −40 °C to 85 °C for deployment in industrial environments.
  • Reconfigurability & Test — Supports in‑circuit reconfigurability and includes JTAG boundary‑scan test functionality for programming, debug and production test.
  • Family‑Level System Features — FLEX‑10K family features such as MultiVolt I/O support, low‑skew global clocks, dedicated carry and cascade chains, and options for reduced clock delay (ClockLock/ClockBoost) are part of the device architecture.
  • RoHS Compliant — Meets RoHS requirements for lead‑free assembly.

Typical Applications

  • Industrial Control — Motor control, PLC logic expansion and real‑time I/O aggregation where industrial temperature operation and reprogrammability are needed.
  • Embedded Systems & SOPC — On‑board integration of custom processing, glue logic and memories to reduce BOM and simplify system architecture.
  • Protocol Bridging & Interface Logic — Implement protocol converters, bus interfaces or parallel/serial bridging leveraging the high I/O count and embedded RAM.
  • Prototyping and In‑Circuit Reconfigurable Designs — Hardware prototyping and designs requiring field updates via in‑circuit reconfiguration and JTAG programming.

Unique Advantages

  • Balanced Integration: Combines 1,728 logic elements with 12,288 bits of on‑chip RAM to implement control logic and small data buffers without immediate need for external memory.
  • High I/O Density: 189 user I/O pins enable multiple peripheral connections and complex board interfaces while keeping a compact package footprint.
  • Industrial Reliability: Specified for −40 °C to 85 °C operation to meet common industrial temperature requirements.
  • Reconfigurable and Testable: In‑circuit reconfigurability plus JTAG boundary‑scan support simplifies development, in‑field updates and production test flows.
  • Flexible Clocking and Arithmetic Support: Family features such as low‑skew global clocks and dedicated carry/cascade chains accelerate implementation of timing‑sensitive and arithmetic functions.
  • RoHS Compliance: Supports lead‑free manufacturing and regulatory compliance for modern assembly processes.

Why Choose EPF10K30AQI240-3N?

The EPF10K30AQI240-3N is positioned as a capable mid‑density FLEX‑10KA FPGA that brings together sufficient logic resources, embedded memory and generous I/O in a 240‑pin BFQFP package for industrial and embedded designs. Its combination of reconfigurability, JTAG test support and industrial temperature rating makes it a practical choice for applications that require field updates, production testability and reliable operation across a wide temperature range.

Designers seeking to reduce board complexity while retaining flexibility benefit from the device’s on‑chip RAM and logic resources, and from family‑level features that aid timing and arithmetic implementations. The EPF10K30AQI240-3N is suited to teams building SOPC solutions, interface logic, or mid‑range embedded controllers where long‑term maintainability and BOM efficiency are priorities.

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