EPF10K30ATC144-1N

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 12288 1728 144-LQFP

Quantity 1,827 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30ATC144-1N – FLEX-10KA Field Programmable Gate Array (FPGA), 102 I/O, 144-LQFP

The EPF10K30ATC144-1N is a FLEX-10KA family FPGA from Intel, delivered in a 144-pin LQFP package. It combines a logic array and embedded memory resources to enable System-on-a-Programmable-Chip (SOPC) integration and megafunction implementation for embedded designs.

Designed for commercial applications, this device provides reconfigurable logic, on-chip RAM, and a broad set of system features to support embedded logic functions, peripheral interfacing and board-level integration within a 0 °C to 70 °C operating range.

Key Features

  • Logic Capacity — 1,728 logic elements and 216 logic array blocks (LABs) provide a balanced array for general-purpose logic implementation.
  • Embedded Memory — 12,288 bits of on-chip RAM (EABs available within the FLEX 10K family) for efficient storage of state, buffers and megafunctions.
  • Gate Scale — Up to 69,000 maximum system gates to accommodate complex logic and mixed-function designs.
  • I/O and Interfaces — 102 user I/O pins with per-pin control options provided by the FLEX 10K family architecture for flexible board-level interfacing.
  • Supply and Power — Single-supply operation at 3.0 V to 3.6 V to match common 3.3 V system rails; device is RoHS compliant.
  • Package and Mounting — 144-LQFP (supplier device package: 144-TQFP, 20×20 mm) in a surface-mount form factor suitable for compact board layouts.
  • System Features — Family-level capabilities include in-circuit reconfigurability (ICR) and IEEE-1149.1 JTAG boundary-scan support for board test and configuration management.
  • Commercial Grade — Specified for 0 °C to 70 °C operation and classified as commercial grade for mainstream embedded applications.

Typical Applications

  • Embedded Control — Implement control logic, glue functions and custom peripherals using the device’s logic elements and on-chip RAM.
  • Interface Bridging — Use the flexible I/O and configurable logic to bridge or adapt between parallel and serial interfaces on mixed-signal boards.
  • Prototyping and Development — Leverage in-circuit reconfigurability and JTAG support for rapid firmware iterations and board-level validation.
  • SOPC Integration — Integrate megafunctions and memory blocks to consolidate multiple functions into a single programmable chip for reduced BOM and simplified layouts.

Unique Advantages

  • Balanced Logic and Memory — 1,728 logic elements paired with 12,288 bits of embedded RAM enable compact implementations of control and buffering functions without external memory.
  • Scalable Gate Budget — Up to 69,000 system gates supports designs that need headroom for additional logic or future feature expansion.
  • Flexible I/O Count — 102 user I/O pins give designers room to connect multiple peripherals and interfaces directly to the FPGA.
  • Board-Level Testability — JTAG boundary-scan support simplifies manufacturing test and in-system programming workflows.
  • Surface-Mount Packaging — 144-LQFP / 144-TQFP (20×20) package provides a compact footprint for space-constrained PCBs while remaining accessible for hand and automated assembly.
  • Commercial Availability — Commercial-grade temperature range and RoHS compliance make the device suitable for mainstream electronic products and assemblies.

Why Choose EPF10K30ATC144-1N?

The EPF10K30ATC144-1N positions itself as a flexible, reconfigurable building block for embedded and board-level designs that require a balance of logic density and embedded RAM in a compact surface-mount package. Its combination of 1,728 logic elements, approximately 12 Kbits of on-chip memory, and 102 I/O pins provides practical integration for SOPC-style implementations and peripheral interfacing within commercial temperature ranges.

Choose this FPGA when you need proven family-level system features—such as in-circuit reconfigurability and JTAG boundary-scan—combined with a 3.0 V to 3.6 V supply profile and a compact 144-LQFP footprint for production-friendly assemblies.

Request a quote or submit a purchasing inquiry to obtain pricing and availability for EPF10K30ATC144-1N.

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