EPF10K30ATC144-2

The EPF10K30ATC144-2 is a FLEX-10KA family Field Programmable Gate Array (FPGA) from Intel. It combines a logic array with embedded memory resources and built‑in system-level features to support embedded programmable logic and System-on-a-Programmable-Chip (SOPC) integration.

Designed for commercial embedded and system applications, the device offers 1,728 logic elements, 12,288 bits of on-chip RAM, 102 user I/O pins, and a 144‑pin LQFP surface-mount package. Key value comes from integration of logic, embedded memory, and flexible I/O in a compact, RoHS-compliant package.

Key Features

• Logic Capacity — 1,728 logic elements providing a compact logic fabric for custom digital functions.
• On-chip Memory — 12,288 total RAM bits for implementing buffers, FIFOs, or small embedded data stores.
• Gate Count — 69,000 gates as an indicator of system-level resource availability for mixed logic and memory designs.
• I/O — 102 user I/O pins to support peripheral interfaces and board-level connectivity.
• Package & Mounting — 144‑LQFP surface-mount package; supplier device package listed as 144‑TQFP (20 × 20 mm) for compact board integration.
• Power — Operates from a 3.0 V to 3.6 V supply range to match common 3.3 V system rails.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C for standard embedded/professional applications.
• Built-in Test — Includes JTAG boundary-scan (IEEE 1149.1) circuitry for board-level testing and in-circuit configuration support as described in the FLEX 10K family documentation.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Control — Implement custom control logic and peripheral glue in embedded systems using the device’s logic elements and on-chip RAM.
• Interface Bridging — Use the 102 I/O pins to connect and translate between multiple digital peripherals or bus interfaces on a compact PCB footprint.
• Prototyping & Custom ASIC Replacement — Leverage reconfigurability to prototype or replace small-scale ASIC functions with flexible firmware-updatable logic.

Unique Advantages

• Integrated Logic plus Memory: Combine 1,728 logic elements with 12,288 bits of embedded RAM to reduce external component count and simplify board design.
• Compact Surface-Mount Package: 144‑pin LQFP/TQFP packaging (20 × 20 mm) enables high-density board layouts while remaining compatible with surface-mount assembly.
• 3.3 V System Compatibility: Operates within a 3.0–3.6 V supply window, simplifying power design for common 3.3 V systems.
• Built-in Boundary-Scan: JTAG boundary-scan support aids board testability and in-circuit configuration workflows.
• RoHS Compliance: Environmentally compliant for modern electronics manufacturing requirements.
• Commercial Temperature Range: Suited for mainstream embedded and consumer applications with 0 °C to 70 °C operating range.

Why Choose EPF10K30ATC144-2?

The EPF10K30ATC144-2 delivers a balanced combination of logic resources, embedded RAM, and flexible I/O in a compact 144‑pin surface-mount package. It is well suited to designers who need reconfigurable logic for embedded control, interface bridging, or prototype ASIC replacement within standard commercial temperature environments.

With on-chip memory, JTAG boundary-scan support, and a 3.0–3.6 V supply range, this FLEX-10KA device provides practical integration and testability for short-run and production designs while maintaining RoHS compliance.

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