EPF10K30ATI144-2N
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 12288 1728 144-LQFP |
|---|---|
| Quantity | 136 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 102 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 69000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K30ATI144-2N – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 12288 1728 144-LQFP
The EPF10K30ATI144-2N is an Intel FLEX-10KA family field programmable gate array (FPGA) supplied in a 144‑LQFP surface-mount package. It integrates 1,728 logic elements across 216 LABs and approximately 12,288 bits of on-chip RAM, making it suited for embedded logic, glue logic, and control functions in industrial applications.
Designed for 3.3 V-class systems with a 3.0–3.6 V supply range and an industrial operating temperature range of −40 °C to 85 °C, this device offers flexible I/O count and system-level features for mid-density FPGA designs where reliability and integration are priorities.
Key Features
- Core Logic 1,728 logic elements implemented across 216 LABs provide mid-range programmable logic resources for custom digital designs.
- On-Chip Memory Approximately 12,288 bits of embedded RAM for FIFOs, small buffers, and state storage directly accessible by your logic.
- Gate Capacity Device gate capacity reported as 69,000 gates, enabling integration of substantial logic and control functions on a single device.
- I/O and Packaging 102 user I/O pins in a 144‑LQFP package (surface mount, 20 mm × 20 mm footprint per supplier package ID), balancing board-space efficiency and accessible I/O.
- Power and Voltage Operates from 3.0 V to 3.6 V, aligning with common 3.3 V digital systems and allowing straightforward power supply integration.
- Industrial Grade Temperature Rated for −40 °C to 85 °C operation, suitable for industrial environments requiring extended temperature coverage.
- Family System Features FLEX 10K family features include embedded array blocks for efficient memory and megafunction implementation, JTAG boundary-scan (IEEE 1149.1) support, and options such as ClockLock and ClockBoost for clock distribution control.
- Board-Level and Compliance Surface-mount package and RoHS compliance support modern PCB assembly and environmental requirements.
Typical Applications
- Industrial Control Implement custom control logic, timing, and peripheral bridging in industrial automation equipment with the device’s industrial temperature rating and integrated RAM.
- Embedded Systems Use the on-chip RAM and 1,728 logic elements to implement protocol bridges, buffering, and application-specific processing in embedded designs.
- Interface and Glue Logic Deploy as a compact logic hub for combining multiple peripherals, managing I/O, and providing programmable protocol handling.
- Prototyping and OEM Integration Mid-density resources and flexible I/O make the device suitable for prototype platforms and production OEM designs that need reconfigurable logic.
Unique Advantages
- Balanced Mid-Range Integration: 1,728 logic elements and 12,288 bits of RAM provide a strong balance of logic and embedded memory for common mid-density FPGA tasks.
- Industrial Reliability: Rated for −40 °C to 85 °C operation, supporting deployment in demanding environments without additional thermal qualification specified.
- Flexible 3.3 V Operation: 3.0–3.6 V supply compatibility allows straightforward integration into typical 3.3 V digital systems.
- Compact, Assembly-Friendly Package: 144‑LQFP surface-mount package provides a compact footprint with accessible I/O for PCB layout and manufacturing.
- Series-Level System Features: FLEX 10K family capabilities such as embedded array blocks, JTAG boundary-scan, and clock management options reduce external component needs and simplify system design.
- Regulatory and Assembly Support: RoHS compliance and standard surface-mount packaging align with modern manufacturing and environmental requirements.
Why Choose EPF10K30ATI144-2N?
The EPF10K30ATI144-2N delivers a practical combination of logic resources, embedded memory, and industrial temperature performance in a compact 144‑LQFP footprint. It is positioned for engineers seeking a mid-density, reconfigurable solution that integrates control, buffering, and interface logic without increasing PCB footprint or BOM complexity.
This device is well suited to industrial and embedded system designers who require predictable power and temperature characteristics, moderate I/O, and the FLEX 10K family’s system-level features such as JTAG and embedded array support. Its combination of integration and proven family capabilities supports scalable designs and long-term maintenance across product lifecycles.
Request a quote or submit a procurement inquiry to evaluate EPF10K30ATI144-2N for your next mid-density FPGA application.

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