EPF10K30BC356-3

IC FPGA 246 I/O 356BGA
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 246 12288 1728 356-LBGA

Quantity 302 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case356-LBGANumber of I/O246Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30BC356-3 – FLEX-10K Field Programmable Gate Array (FPGA), 246 I/O, 12,288-bit RAM, 1,728 Logic Elements, 356-LBGA

The EPF10K30BC356-3 is a FLEX-10K family field programmable gate array (FPGA) from Intel designed for system-level programmable logic integration. It combines a dedicated logic array and embedded memory resources to support megafunctions and general-purpose logic in a single, reconfigurable device.

With 1,728 logic elements, 12,288 bits of embedded RAM, 246 user I/O pins and support for 5.0 V supply operation, this device targets commercial embedded applications that require mid-range density, flexible I/O, and in-circuit reconfigurability.

Key Features

  • Logic Capacity — 1,728 logic elements and up to 69,000 gates (maximum system gates reported), enabling mid-density logic integration for control, glue logic and custom datapaths.
  • Embedded Memory — 12,288 total RAM bits (approximately 0.012 Mbits) to implement FIFOs, small buffers and memory-based megafunctions without external RAM.
  • I/O and Interfaces — 246 user I/O pins for flexible peripheral interfacing and system connectivity on a single device.
  • Power Supply — 5.0 V device with a specified supply range of 4.75 V to 5.25 V suitable for existing 5 V system rails.
  • Package and Mounting — 356-ball fine-pitch BGA (356-LBGA, 35 × 35 mm) surface-mount package for compact board integration and high pin density.
  • Operating Range — Commercial temperature grade with an operating range of 0 °C to 70 °C.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing.
  • Family-Level Capabilities — FLEX 10K family features from the datasheet: embedded arrays for efficient memory and specialized logic, in-circuit reconfigurability, JTAG boundary-scan, optimized interconnect and dedicated carry/cascade chains for arithmetic and high-fan-in logic.

Typical Applications

  • System Integration / SOPC — Implement system-on-a-programmable-chip functions by combining logic and embedded memory for control subsystems and glue logic.
  • PCI and Peripheral Interfaces — Suitable for designs that require robust I/O counts and family-level support for PCI local bus integration as described in the FLEX 10K family documentation.
  • Embedded Control and Signal Processing — Mid-density logic and on-chip RAM support custom control state machines, data buffering and modest signal processing tasks.
  • In-Circuit Reconfigurable Designs — Use in designs that benefit from reconfiguration in-system via external configuration devices or JTAG boundary-scan.

Unique Advantages

  • Balanced mid-range density: 1,728 logic elements and 12,288 bits of RAM provide a practical balance of logic and embedded memory for many commercial embedded designs.
  • High I/O count: 246 user I/Os enable broad peripheral connectivity and flexible board-level integration without adding multiple devices.
  • Compact, high-pin package: The 356-LBGA package offers high pin density in a compact footprint to maximize PCB area efficiency.
  • 5 V system compatibility: Supported supply range of 4.75 V to 5.25 V aligns with 5.0 V system rails common in many legacy and commercial applications.
  • Reconfigurability and testability: Family features include in-circuit reconfigurability and JTAG boundary-scan for flexible deployment and improved board-level test access.
  • Standards and tool support at the family level: FLEX 10K family documentation identifies software design support and automatic place-and-route tools for development and integration.

Why Choose EPF10K30BC356-3?

The EPF10K30BC356-3 positions itself as a practical, mid-density FPGA option for commercial embedded designs that need a mix of logic, on-chip RAM and a large number of I/Os in a compact BGA package. Its 5 V supply compatibility, reconfiguration options and family-level capabilities make it suitable for designs that require flexible integration and in-system programmability.

Choose this device when you need a commercially graded FPGA with clear, verifiable specifications for logic elements, embedded memory, I/O capacity and package density—backed by family-level design tools and test features documented for the FLEX 10K series.

Request a quote or submit an inquiry to check pricing and availability for the EPF10K30BC356-3 and to discuss how it can fit into your next embedded design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up