EPF10K30BC356-3
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 246 12288 1728 356-LBGA |
|---|---|
| Quantity | 302 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 246 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 69000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K30BC356-3 – FLEX-10K Field Programmable Gate Array (FPGA), 246 I/O, 12,288-bit RAM, 1,728 Logic Elements, 356-LBGA
The EPF10K30BC356-3 is a FLEX-10K family field programmable gate array (FPGA) from Intel designed for system-level programmable logic integration. It combines a dedicated logic array and embedded memory resources to support megafunctions and general-purpose logic in a single, reconfigurable device.
With 1,728 logic elements, 12,288 bits of embedded RAM, 246 user I/O pins and support for 5.0 V supply operation, this device targets commercial embedded applications that require mid-range density, flexible I/O, and in-circuit reconfigurability.
Key Features
- Logic Capacity — 1,728 logic elements and up to 69,000 gates (maximum system gates reported), enabling mid-density logic integration for control, glue logic and custom datapaths.
- Embedded Memory — 12,288 total RAM bits (approximately 0.012 Mbits) to implement FIFOs, small buffers and memory-based megafunctions without external RAM.
- I/O and Interfaces — 246 user I/O pins for flexible peripheral interfacing and system connectivity on a single device.
- Power Supply — 5.0 V device with a specified supply range of 4.75 V to 5.25 V suitable for existing 5 V system rails.
- Package and Mounting — 356-ball fine-pitch BGA (356-LBGA, 35 × 35 mm) surface-mount package for compact board integration and high pin density.
- Operating Range — Commercial temperature grade with an operating range of 0 °C to 70 °C.
- RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing.
- Family-Level Capabilities — FLEX 10K family features from the datasheet: embedded arrays for efficient memory and specialized logic, in-circuit reconfigurability, JTAG boundary-scan, optimized interconnect and dedicated carry/cascade chains for arithmetic and high-fan-in logic.
Typical Applications
- System Integration / SOPC — Implement system-on-a-programmable-chip functions by combining logic and embedded memory for control subsystems and glue logic.
- PCI and Peripheral Interfaces — Suitable for designs that require robust I/O counts and family-level support for PCI local bus integration as described in the FLEX 10K family documentation.
- Embedded Control and Signal Processing — Mid-density logic and on-chip RAM support custom control state machines, data buffering and modest signal processing tasks.
- In-Circuit Reconfigurable Designs — Use in designs that benefit from reconfiguration in-system via external configuration devices or JTAG boundary-scan.
Unique Advantages
- Balanced mid-range density: 1,728 logic elements and 12,288 bits of RAM provide a practical balance of logic and embedded memory for many commercial embedded designs.
- High I/O count: 246 user I/Os enable broad peripheral connectivity and flexible board-level integration without adding multiple devices.
- Compact, high-pin package: The 356-LBGA package offers high pin density in a compact footprint to maximize PCB area efficiency.
- 5 V system compatibility: Supported supply range of 4.75 V to 5.25 V aligns with 5.0 V system rails common in many legacy and commercial applications.
- Reconfigurability and testability: Family features include in-circuit reconfigurability and JTAG boundary-scan for flexible deployment and improved board-level test access.
- Standards and tool support at the family level: FLEX 10K family documentation identifies software design support and automatic place-and-route tools for development and integration.
Why Choose EPF10K30BC356-3?
The EPF10K30BC356-3 positions itself as a practical, mid-density FPGA option for commercial embedded designs that need a mix of logic, on-chip RAM and a large number of I/Os in a compact BGA package. Its 5 V supply compatibility, reconfiguration options and family-level capabilities make it suitable for designs that require flexible integration and in-system programmability.
Choose this device when you need a commercially graded FPGA with clear, verifiable specifications for logic elements, embedded memory, I/O capacity and package density—backed by family-level design tools and test features documented for the FLEX 10K series.
Request a quote or submit an inquiry to check pricing and availability for the EPF10K30BC356-3 and to discuss how it can fit into your next embedded design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018