EPF10K30EFC256-1

IC FPGA 176 I/O 256FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 176 24576 1728 256-BGA

Quantity 549 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K30EFC256-1 – FLEX-10KE® FPGA — 1,728 logic elements, 24,576 RAM bits, 176 I/O, 256-BGA

The EPF10K30EFC256-1 is a FLEX-10KE family field programmable gate array (FPGA) provided in a 256-ball fine-pitch BGA package. It delivers a moderate-density programmable logic resource set intended for embedded and system-level designs that require on-chip memory, flexible I/O, and in-system reconfigurability.

Built for commercial applications, this device combines 1,728 logic elements, approximately 24,576 bits of embedded RAM, and 176 user I/O pins in a compact surface-mount package, offering a balance of integration and board-area efficiency for SOPC-style integration and custom logic functions.

Key Features

  • Logic Capacity — 1,728 logic elements and 216 logic array blocks (LABs) provide a scalable logic fabric for mid-density designs.
  • On-chip Memory — Approximately 24,576 bits of embedded RAM for FIFO, buffering, and small embedded storage needs without external memory.
  • I/O Count and Flexibility — 176 user I/O pins with per-pin options including tri-state enable and open-drain capability for flexible interfacing to external peripherals.
  • Package and Mounting — 256-ball FBGA (17×17) package in a surface-mount form factor for compact PCB integration and high pin density.
  • Power Supply — Designed to operate from a supply voltage range of 2.375 V to 2.625 V to match system power requirements.
  • Operating Range and Grade — Commercial grade device rated for 0 °C to 70 °C ambient operation.
  • Design and Test Support — Includes IEEE Std. 1149.1 JTAG boundary-scan test (BST) circuitry for board-level test and in-circuit configuration.
  • Series-Level Architecture Features — FLEX 10K family features such as embedded array blocks (EABs) for megafunctions, dedicated carry and cascade chains, FastTrack interconnect routing, configurable clock distribution, and options for ClockLock/ClockBoost to assist timing and clock management.
  • Compliance — RoHS-compliant manufacturing.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) — Integrate custom logic, memory megafunctions, and peripheral interfacing on a single programmable device for compact embedded systems.
  • Embedded Control and Processing — Implement control logic, state machines, and small data buffers using on-chip RAM and dedicated arithmetic chains.
  • Peripheral Interface and Bus Logic — Implement custom bus glue logic, protocol adapters, and PCI-related interfaces using flexible I/O and in-circuit reconfigurability.
  • Prototyping and Evaluation — Mid-density FPGA resource set in a compact BGA package suitable for prototype boards and product evaluation where board space is constrained.

Unique Advantages

  • Balanced Integration: 1,728 logic elements combined with on-chip RAM reduce the need for external components, simplifying BOM and board routing.
  • High I/O Density in a Compact Package: 176 user I/Os in a 256-FBGA (17×17) package enable numerous external interfaces while conserving PCB area.
  • In-system Reconfigurability and Test: JTAG BST support and in-circuit reconfiguration options streamline development, testing, and field updates.
  • Flexible Clock and Arithmetic Support: Dedicated carry and cascade chains plus family clock features assist implementation of high-performance adders, counters, and multi-clock designs.
  • Commercial Temperature and Low-Voltage Operation: Commercial-grade rating (0 °C to 70 °C) and a 2.375 V–2.625 V supply window match many standard embedded system requirements.
  • RoHS Compliant: Manufactured to comply with RoHS directives for environmental and regulatory considerations.

Why Choose EPF10K30EFC256-1?

The EPF10K30EFC256-1 positions itself as a mid-density FLEX-10KE FPGA option for designers who need a compact, reconfigurable logic device with a meaningful mix of logic elements, embedded RAM, and a high I/O count. Its 256-FBGA package and surface-mount mounting make it suitable for space-conscious boards while preserving the flexibility of on-chip resources.

This device is well suited for engineering teams building embedded systems, bus/interface logic, and SOPC-style integrations that benefit from in-circuit reconfigurability, boundary-scan test support, and a proven family architecture with dedicated arithmetic and routing features.

Request a quote or submit a purchase inquiry through your preferred procurement channel to evaluate EPF10K30EFC256-1 for your next design.

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