EPF10K30EFC256-1
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 176 24576 1728 256-BGA |
|---|---|
| Quantity | 549 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 119000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K30EFC256-1 – FLEX-10KE® FPGA — 1,728 logic elements, 24,576 RAM bits, 176 I/O, 256-BGA
The EPF10K30EFC256-1 is a FLEX-10KE family field programmable gate array (FPGA) provided in a 256-ball fine-pitch BGA package. It delivers a moderate-density programmable logic resource set intended for embedded and system-level designs that require on-chip memory, flexible I/O, and in-system reconfigurability.
Built for commercial applications, this device combines 1,728 logic elements, approximately 24,576 bits of embedded RAM, and 176 user I/O pins in a compact surface-mount package, offering a balance of integration and board-area efficiency for SOPC-style integration and custom logic functions.
Key Features
- Logic Capacity — 1,728 logic elements and 216 logic array blocks (LABs) provide a scalable logic fabric for mid-density designs.
- On-chip Memory — Approximately 24,576 bits of embedded RAM for FIFO, buffering, and small embedded storage needs without external memory.
- I/O Count and Flexibility — 176 user I/O pins with per-pin options including tri-state enable and open-drain capability for flexible interfacing to external peripherals.
- Package and Mounting — 256-ball FBGA (17×17) package in a surface-mount form factor for compact PCB integration and high pin density.
- Power Supply — Designed to operate from a supply voltage range of 2.375 V to 2.625 V to match system power requirements.
- Operating Range and Grade — Commercial grade device rated for 0 °C to 70 °C ambient operation.
- Design and Test Support — Includes IEEE Std. 1149.1 JTAG boundary-scan test (BST) circuitry for board-level test and in-circuit configuration.
- Series-Level Architecture Features — FLEX 10K family features such as embedded array blocks (EABs) for megafunctions, dedicated carry and cascade chains, FastTrack interconnect routing, configurable clock distribution, and options for ClockLock/ClockBoost to assist timing and clock management.
- Compliance — RoHS-compliant manufacturing.
Typical Applications
- System-on-a-Programmable-Chip (SOPC) — Integrate custom logic, memory megafunctions, and peripheral interfacing on a single programmable device for compact embedded systems.
- Embedded Control and Processing — Implement control logic, state machines, and small data buffers using on-chip RAM and dedicated arithmetic chains.
- Peripheral Interface and Bus Logic — Implement custom bus glue logic, protocol adapters, and PCI-related interfaces using flexible I/O and in-circuit reconfigurability.
- Prototyping and Evaluation — Mid-density FPGA resource set in a compact BGA package suitable for prototype boards and product evaluation where board space is constrained.
Unique Advantages
- Balanced Integration: 1,728 logic elements combined with on-chip RAM reduce the need for external components, simplifying BOM and board routing.
- High I/O Density in a Compact Package: 176 user I/Os in a 256-FBGA (17×17) package enable numerous external interfaces while conserving PCB area.
- In-system Reconfigurability and Test: JTAG BST support and in-circuit reconfiguration options streamline development, testing, and field updates.
- Flexible Clock and Arithmetic Support: Dedicated carry and cascade chains plus family clock features assist implementation of high-performance adders, counters, and multi-clock designs.
- Commercial Temperature and Low-Voltage Operation: Commercial-grade rating (0 °C to 70 °C) and a 2.375 V–2.625 V supply window match many standard embedded system requirements.
- RoHS Compliant: Manufactured to comply with RoHS directives for environmental and regulatory considerations.
Why Choose EPF10K30EFC256-1?
The EPF10K30EFC256-1 positions itself as a mid-density FLEX-10KE FPGA option for designers who need a compact, reconfigurable logic device with a meaningful mix of logic elements, embedded RAM, and a high I/O count. Its 256-FBGA package and surface-mount mounting make it suitable for space-conscious boards while preserving the flexibility of on-chip resources.
This device is well suited for engineering teams building embedded systems, bus/interface logic, and SOPC-style integrations that benefit from in-circuit reconfigurability, boundary-scan test support, and a proven family architecture with dedicated arithmetic and routing features.
Request a quote or submit a purchase inquiry through your preferred procurement channel to evaluate EPF10K30EFC256-1 for your next design.

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