EPF10K30EFC256-1X

The EPF10K30EFC256-1X is a FLEX 10K family field programmable gate array (FPGA) in a 256-ball BGA package. It combines on-chip programmable logic with embedded memory to support flexible, reconfigurable digital designs for commercial embedded systems and electronic products.

With 1,728 logic elements, 216 LABs, approximately 24,576 bits of embedded RAM and 176 user I/O pins, this surface-mount FPGA targets mid-density logic integration where a balance of logic capacity, on-chip memory and I/O density is required.

Key Features

• Logic Capacity 1,728 logic elements and 216 LABs provide mid-range programmable logic resources suitable for glue logic, protocol bridges and custom control functions.
• On‑Chip Memory Approximately 24,576 bits of embedded RAM support frame buffers, small lookup tables and distributed data storage without external memory.
• I/O Density 176 user I/O pins enable multiple peripheral interfaces and sensor/actuator connections in a single device footprint.
• Package & Mounting 256-ball FBGA (17 × 17) in a surface-mount package offers high pin count in a compact board area for space-constrained designs.
• Power Supply Device supply range listed as 2.375 V to 2.625 V, enabling designs that require this nominal operating voltage.
• Operating Temperature Commercial-grade operation from 0 °C to 70 °C for typical commercial embedded and consumer environments.
• RoHS Compliant Environmentally compliant manufacturing status to support lead-free assembly and global environmental requirements.
• FLEX 10K Family Features As a member of the FLEX 10K family, the device benefits from series capabilities such as built-in JTAG boundary-scan (IEEE 1149.1), flexible interconnect architecture and dedicated fast carry/cascade chains described in the family datasheet.

Typical Applications

• Commercial Embedded Systems Implement glue logic, protocol bridging and custom control state machines while keeping board count and BOM low.
• Consumer Electronics Integrate interface logic and peripheral control in compact products where board space and I/O count are constrained.
• Communications Peripherals Support custom packet handling, interface conversion and buffering using on-chip RAM and distributed logic.
• Prototyping & Development Rapidly iterate hardware designs that require reconfigurable logic and moderate on-chip memory resources.

Unique Advantages

• Balanced Logic and Memory: 1,728 logic elements plus approximately 24,576 bits of embedded RAM enable integrated implementations that reduce external memory needs.
• High I/O Count in Compact Package: 176 user I/Os in a 256-FBGA (17 × 17) package deliver connectivity for sensors, peripherals and interfaces without a large PCB footprint.
• RoHS-Compliant Surface-Mount Form Factor: Surface-mount 256-BGA simplifies automated assembly and supports lead-free production processes.
• Commercial Temperature Range: Rated for 0 °C to 70 °C operation for reliable performance in standard commercial environments.
• Family-Level Design Support: Benefits from FLEX 10K family architecture and design tools documented in the series datasheet for consistent design flow and integration.

Why Choose EPF10K30EFC256-1X?

The EPF10K30EFC256-1X offers a practical combination of logic density, embedded RAM and I/O capacity in a compact 256-FBGA package for commercial embedded designs. It is well suited to engineers who need reconfigurable logic and moderate memory on-chip to simplify board-level design and reduce external components.

Choose this FLEX 10K family device when your project requires mid-range programmable logic, a high I/O count and RoHS-compliant surface-mount packaging backed by documented family-level features and design flow support.

Request a quote or submit a pricing request for EPF10K30EFC256-1X to receive availability and lead-time information tailored to your purchasing needs.