EPF10K30EFC256-3

The EPF10K30EFC256-3 is a FLEX-10KE family field programmable gate array (FPGA) in a 256-ball BGA package designed for commercial embedded logic applications. It combines a programmable logic array with embedded memory to support custom digital functions and system-on-a-programmable-chip (SOPC) integration.

This device provides 1,728 logic elements, approximately 24,576 bits of on-chip RAM, and 176 user I/Os, making it suitable for designs that require moderate logic density, on-chip memory, and a significant number of I/O signals within a compact surface-mount footprint.

Key Features

• Logic Capacity — 1,728 logic elements and a listed gate count of 119,000, providing the combinational and sequential resources for custom logic implementation.
• Embedded Memory — Approximately 24,576 bits of total on-chip RAM to support buffers, FIFOs, and small embedded data structures without external memory.
• I/O Density — 176 user I/O pins to support multiple peripheral interfaces and board-level connectivity in a single device.
• Package & Mounting — 256-ball Fine-pitch BGA (256-FBGA, 17×17) surface-mount package for space-efficient PCB integration.
• Power Supply — Operates from a core/primary supply range of 2.375 V to 2.625 V, allowing integration into power-conscious designs.
• Commercial Temperature Grade — Rated for operation from 0 °C to 70 °C for standard commercial applications.
• Standards & Family Features — As a member of the FLEX 10K family, the series provides embedded array capability for megafunctions, in-circuit reconfigurability options, and IEEE 1149.1 (JTAG) boundary-scan support as described in the FLEX 10K family documentation.
• Compliance — RoHS compliant, supporting lead-free manufacturing and assembly flows.

Typical Applications

• Embedded Control & SOPC Integration — Implement custom peripheral logic, glue functions, and control engines where on-chip RAM and moderate logic density simplify system design.
• Interface Bridging — Bridge multiple digital buses or act as protocol adaptation logic using the device’s 176 I/Os to consolidate board-level signals.
• Prototyping & Development — Use in development platforms and proof-of-concept boards where reprogrammability and accessible I/O counts accelerate design iteration.
• Memory-Buffered Logic — Ideal for functions that require embedded RAM for buffering, lookup tables, or small FIFOs integrated with programmable logic.

Unique Advantages

• Balanced Logic and Memory: Combines 1,728 logic elements with ~24,576 bits of embedded RAM to support mixed logic-plus-buffering functions without external memory.
• High I/O Count in Compact Package: 176 user I/Os in a 256-FBGA (17×17) package reduce board-level routing complexity while maintaining density.
• Family-Level Integration Features: As part of the FLEX 10K family, benefits include embedded array megafunction support, in-circuit reconfigurability options, and JTAG boundary-scan for testability and iterative development.
• RoHS Compliance: Conforms to RoHS requirements to support lead-free production processes.
• Commercial Temperature Rating: Specified for 0 °C to 70 °C operation to match standard commercial product environments.

Why Choose EPF10K30EFC256-3?

The EPF10K30EFC256-3 offers a practical balance of programmable logic, embedded memory, and I/O density in a compact 256-BGA package for commercial embedded designs. Its FLEX 10K family heritage brings series-level capabilities—such as embedded array support and JTAG testability—that help streamline integration of custom logic and small memory structures on a single chip.

This device is well suited for engineers and procurement teams targeting mid-density FPGA solutions that require reprogrammability, a substantial number of I/Os, and on-chip RAM, all within a surface-mount, RoHS-compliant package.

Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for EPF10K30EFC256-3. Our team can help evaluate fit for your design and provide procurement support.