EPF10K30EFC484-1
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 220 24576 1728 484-BBGA |
|---|---|
| Quantity | 173 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 220 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 119000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K30EFC484-1 – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 220 24576 1728 484-BBGA
The EPF10K30EFC484-1 is a FLEX 10K family FPGA from Intel designed for embedded programmable logic and system-level integration. It provides reconfigurable logic, embedded memory, and a high I/O count in a compact 484-ball BGA package for commercial applications.
This device targets designs that require on-chip memory and configurable logic for functions such as interface bridging, protocol handling, custom peripherals, and system-on-a-programmable-chip (SOPC) integration. The part combines 1,728 logic elements with 24,576 bits of embedded RAM and 220 user I/O pins to support dense, I/O-rich implementations.
Key Features
- Logic Capacity — 1,728 logic elements provide the core programmable resources for implementing custom logic and control functions.
- On-chip Memory — 24,576 total RAM bits of embedded memory for FIFOs, small buffers, and megafunctions.
- I/O and Interfacing — 220 user I/O pins support complex, multi‑signal interfaces and external device connectivity.
- Gate Count — Documented device gate resource of 119,000 gates for system-level logic and RAM combined.
- Package & Mounting — 484-ball BBGA package (supplier package 484-FBGA, 23×23); surface-mount package suitable for space-efficient PCB layouts.
- Supply & Operating Conditions — Voltage supply range 2.375 V to 2.625 V and commercial operating temperature range 0 °C to 70 °C.
- Reconfigurability & Test — Supports in-circuit reconfigurability and built-in JTAG boundary-scan test (per FLEX 10K family features).
- Clocking & Performance Options — Family-level features include low-skew clock distribution and optional ClockLock/ClockBoost functionality (as provided by FLEX 10K family documentation).
- Compliance — RoHS compliant; commercial grade device.
Typical Applications
- Interface Bridging — Implement protocol translators and custom interface logic using the device's high I/O count and embedded memory for buffering.
- Embedded Peripherals — Create custom peripherals and control logic for commercial electronic products that benefit from reconfigurability and on-chip RAM.
- Prototyping & Development — Use as a reprogrammable platform for validating control logic, timing, and I/O function before committing to fixed silicon.
- Data Path & Buffering — Implement small FIFOs, handshaking logic, and packet buffering using the on-chip RAM and dedicated carry/cascade structures described for the FLEX 10K family.
Unique Advantages
- Balanced Logic and Memory: 1,728 logic elements paired with 24,576 bits of embedded RAM let you implement both control logic and local data storage on a single device.
- High I/O Density: 220 user I/O pins enable direct connection to multiple external interfaces, reducing the need for external glue logic.
- Compact, Board‑Efficient Package: 484-ball BGA (23×23) provides a high pin count in a space-conscious footprint for compact commercial designs.
- System-level Flexibility: Family-level features such as in-circuit reconfigurability and JTAG boundary-scan simplify development, testing, and field updates.
- Commercial Temperature Suitability: Specified for 0 °C to 70 °C operation, making it suitable for a wide range of commercial electronic products.
- RoHS Compliant: Meets RoHS requirements for regulated material content in commercial assemblies.
Why Choose EPF10K30EFC484-1?
The EPF10K30EFC484-1 combines the FLEX 10K family’s embedded programmable logic approach with a practical balance of logic elements, embedded RAM, and a large I/O count—delivered in a compact 484-BBGA package. It is well suited to designers and OEMs building commercial products that require reconfigurable logic, on-chip buffering, and dense I/O connectivity.
Backed by the FLEX 10K family tool and documentation support, this device offers a dependable platform for implementing SOPC-style integration, interface logic, and custom peripherals while maintaining development and test flexibility through in-circuit reconfiguration and JTAG support.
Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for the EPF10K30EFC484-1.

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