EPF10K30EFC484-1

The EPF10K30EFC484-1 is a FLEX 10K family FPGA from Intel designed for embedded programmable logic and system-level integration. It provides reconfigurable logic, embedded memory, and a high I/O count in a compact 484-ball BGA package for commercial applications.

This device targets designs that require on-chip memory and configurable logic for functions such as interface bridging, protocol handling, custom peripherals, and system-on-a-programmable-chip (SOPC) integration. The part combines 1,728 logic elements with 24,576 bits of embedded RAM and 220 user I/O pins to support dense, I/O-rich implementations.

Key Features

• Logic Capacity — 1,728 logic elements provide the core programmable resources for implementing custom logic and control functions.
• On-chip Memory — 24,576 total RAM bits of embedded memory for FIFOs, small buffers, and megafunctions.
• I/O and Interfacing — 220 user I/O pins support complex, multi‑signal interfaces and external device connectivity.
• Gate Count — Documented device gate resource of 119,000 gates for system-level logic and RAM combined.
• Package & Mounting — 484-ball BBGA package (supplier package 484-FBGA, 23×23); surface-mount package suitable for space-efficient PCB layouts.
• Supply & Operating Conditions — Voltage supply range 2.375 V to 2.625 V and commercial operating temperature range 0 °C to 70 °C.
• Reconfigurability & Test — Supports in-circuit reconfigurability and built-in JTAG boundary-scan test (per FLEX 10K family features).
• Clocking & Performance Options — Family-level features include low-skew clock distribution and optional ClockLock/ClockBoost functionality (as provided by FLEX 10K family documentation).
• Compliance — RoHS compliant; commercial grade device.

Typical Applications

• Interface Bridging — Implement protocol translators and custom interface logic using the device's high I/O count and embedded memory for buffering.
• Embedded Peripherals — Create custom peripherals and control logic for commercial electronic products that benefit from reconfigurability and on-chip RAM.
• Prototyping & Development — Use as a reprogrammable platform for validating control logic, timing, and I/O function before committing to fixed silicon.
• Data Path & Buffering — Implement small FIFOs, handshaking logic, and packet buffering using the on-chip RAM and dedicated carry/cascade structures described for the FLEX 10K family.

Unique Advantages

• Balanced Logic and Memory: 1,728 logic elements paired with 24,576 bits of embedded RAM let you implement both control logic and local data storage on a single device.
• High I/O Density: 220 user I/O pins enable direct connection to multiple external interfaces, reducing the need for external glue logic.
• Compact, Board‑Efficient Package: 484-ball BGA (23×23) provides a high pin count in a space-conscious footprint for compact commercial designs.
• System-level Flexibility: Family-level features such as in-circuit reconfigurability and JTAG boundary-scan simplify development, testing, and field updates.
• Commercial Temperature Suitability: Specified for 0 °C to 70 °C operation, making it suitable for a wide range of commercial electronic products.
• RoHS Compliant: Meets RoHS requirements for regulated material content in commercial assemblies.

Why Choose EPF10K30EFC484-1?

The EPF10K30EFC484-1 combines the FLEX 10K family’s embedded programmable logic approach with a practical balance of logic elements, embedded RAM, and a large I/O count—delivered in a compact 484-BBGA package. It is well suited to designers and OEMs building commercial products that require reconfigurable logic, on-chip buffering, and dense I/O connectivity.

Backed by the FLEX 10K family tool and documentation support, this device offers a dependable platform for implementing SOPC-style integration, interface logic, and custom peripherals while maintaining development and test flexibility through in-circuit reconfiguration and JTAG support.

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