EPF10K30EFC484-3

The EPF10K30EFC484-3 is a FLEX 10K family FPGA optimized for commercial embedded logic applications. It integrates 1,728 logic elements, approximately 24,576 bits of embedded RAM and 220 user I/O pins in a compact 484‑BBGA surface‑mount package for board‑level integration.

Built on the FLEX 10K architecture, the device targets system designers who need programmable logic with on‑chip memory, flexible I/O and family‑level system features to implement customized logic, memory and peripheral interfacing functions.

Key Features

• Core architecture FLEX 10K family device providing 1,728 logic elements and approximately 119,000 gates for implementing custom digital logic.
• Embedded memory Approximately 24,576 bits of on‑chip RAM to support buffering, state machines and small embedded data structures.
• I/O and interfacing 220 user I/O pins enable broad peripheral connectivity and board‑level interfacing options.
• Configuration and debug Family features include in‑circuit reconfigurability options and IEEE‑1149.1 JTAG boundary‑scan support for device configuration and test.
• Performance‑oriented routing FLEX 10K family interconnect and dedicated arithmetic/cascade chains support efficient implementation of adders, counters and high‑fan‑in logic.
• Power and supply Device operates from a supply range of 2.375 V to 2.625 V to meet target board power architectures.
• Package and mounting 484‑BBGA package (supplier package 484‑FBGA, 23×23) in a surface‑mount form factor for space‑efficient PCB layouts.
• Commercial temperature grade Specified for 0 °C to 70 °C operating temperature range; RoHS compliant.

Typical Applications

• Embedded control Implement custom state machines, protocol handling and control logic where compact programmable logic and on‑chip RAM are needed.
• Interface bridging Use the device to bridge peripherals or translate between different board interfaces using its high I/O count and flexible routing.
• Memory buffering and small FIFOs Leverage the on‑chip RAM for buffering, small FIFO implementations and temporary data storage in tight footprint systems.
• System prototyping Ideal for rapid hardware prototyping and proof‑of‑concept systems that require reconfigurability and boundary‑scan test support.

Unique Advantages

• Integrated logic and RAM: Combines 1,728 logic elements with on‑chip RAM to reduce external memory needs and simplify board BOM.
• High pin count in compact package: 220 I/Os in a 484‑BBGA package enable dense connectivity while preserving PCB real estate.
• Flexible configuration and test: Built‑in JTAG and in‑circuit configuration options streamline development, programming and manufacturing test flows.
• Deterministic routing support: FLEX 10K family interconnect and dedicated chains support efficient implementation of arithmetic and high‑fan‑in logic for predictable timing.
• RoHS compliant commercial-grade device: Meets RoHS requirements and is specified for a 0 °C to 70 °C operating range for commercial applications.

Why Choose EPF10K30EFC484-3?

The EPF10K30EFC484-3 pairs the FLEX 10K family architecture with a practical combination of logic density, embedded RAM and high I/O count in a compact BGA package—making it suited for commercial embedded designs that demand programmable logic, in‑system configurability and board‑level density. Its supply and temperature specifications align with standard commercial systems, and family features such as JTAG and flexible interconnect help reduce development time.

This device is appropriate for engineers and teams building mid‑range programmable solutions where integration, reconfigurability and predictable routing are priorities, and where long‑term support from the FLEX 10K product family and tools is advantageous.

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