EPF10K30EFI256-2
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 176 24576 1728 256-BGA |
|---|---|
| Quantity | 226 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 119000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K30EFI256-2 – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 176 24576 1728 256-BGA
The EPF10K30EFI256-2 is an Intel FLEX-10KE family field programmable gate array (FPGA) supplied in a 256-ball BGA package. It delivers 1,728 logic elements and approximately 24,576 bits of embedded RAM paired with 176 user I/O pins, making it suitable for compact, reconfigurable logic and embedded-system integration.
Designed for industrial-grade applications, this device combines on-chip memory, a substantial I/O count, and reprogrammable logic capacity to support control, interface, and custom processing functions in a single programmable device.
Key Features
- Logic Capacity 1,728 logic elements and 216 logic array blocks (LABs) provide reconfigurable logic resources for combinational and sequential designs.
- On-chip Memory Approximately 24,576 bits of embedded RAM enable storage for FIFOs, small buffers, and state memory without external devices.
- I/O and Connectivity 176 user I/O pins support a broad range of external interfaces and parallel signals, enabling dense board-level integration.
- Package and Mounting 256-BGA (256-FBGA, 17×17) surface-mount package optimizes board area while providing a robust ball-grid footprint for high-density designs.
- Industrial Grade and Temperature Rated for industrial operation with an operating temperature range of −40°C to 85°C for reliable performance in extended-temperature environments.
- Power Supply Device supply specified at 2.375 V to 2.625 V to match target board power rails.
- Series-level Capabilities FLEX 10K family features include embedded arrays for megafunctions, JTAG boundary-scan (IEEE Std. 1149.1) for test and configuration, and architecture-level features such as dedicated carry and cascade chains for efficient arithmetic and high-fan-in logic.
- Compliance RoHS-compliant construction supports environmentally conscious designs and manufacturing processes.
Typical Applications
- Industrial Control Reconfigurable logic and industrial temperature rating suit motor control, PLC subsystems, and factory automation interfaces requiring robust operation.
- Embedded Systems Use as a programmable glue logic or subsystem controller to integrate custom peripherals, timing logic, and memory buffering within compact embedded platforms.
- Communication Interfaces High I/O count allows implementation of parallel interfaces, protocol bridging, and custom bus logic for networking and telecom equipment.
- Prototyping and Product Development The FPGA’s reprogrammability and on-chip RAM make it suitable for iterative hardware development, algorithm validation, and proof-of-concept designs.
Unique Advantages
- Reconfigurable Integration: Combines programmable logic and embedded RAM to reduce external component count and simplify system architecture.
- Industrial Reliability: Specified for −40°C to 85°C operation and RoHS compliance to meet industrial supply-chain and environmental requirements.
- Compact, High-density Packaging: 256-FBGA (17×17) package maximizes board density while providing a reliable BGA interconnect for complex layouts.
- Generous I/O Resources: 176 I/O pins enable direct interfacing to multiple peripherals and buses without external expanders.
- Family Ecosystem Support: Built on the FLEX 10K architecture which includes JTAG boundary-scan and family design tools and megafunction support for faster design implementation.
Why Choose EPF10K30EFI256-2?
The EPF10K30EFI256-2 positions itself as a flexible, industrial-grade FPGA option when you need moderate logic capacity, meaningful on-chip RAM, and substantial I/O in a compact BGA package. Its combination of 1,728 logic elements, approximately 24,576 bits of embedded memory, and 176 user I/Os provides a balanced solution for embedded and control-oriented designs.
This device is well suited for engineers and procurement teams seeking a reprogrammable component that supports in-system configuration, board-level density, and industrial operating conditions. Leveraging FLEX 10K family capabilities helps streamline integration of custom logic, reduce BOM complexity, and accelerate development cycles.
Request a quote or submit a procurement inquiry to evaluate EPF10K30EFI256-2 for your next design.

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