EPF10K30EFI256-2

IC FPGA 176 I/O 256FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 176 24576 1728 256-BGA

Quantity 226 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K30EFI256-2 – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 176 24576 1728 256-BGA

The EPF10K30EFI256-2 is an Intel FLEX-10KE family field programmable gate array (FPGA) supplied in a 256-ball BGA package. It delivers 1,728 logic elements and approximately 24,576 bits of embedded RAM paired with 176 user I/O pins, making it suitable for compact, reconfigurable logic and embedded-system integration.

Designed for industrial-grade applications, this device combines on-chip memory, a substantial I/O count, and reprogrammable logic capacity to support control, interface, and custom processing functions in a single programmable device.

Key Features

  • Logic Capacity  1,728 logic elements and 216 logic array blocks (LABs) provide reconfigurable logic resources for combinational and sequential designs.
  • On-chip Memory  Approximately 24,576 bits of embedded RAM enable storage for FIFOs, small buffers, and state memory without external devices.
  • I/O and Connectivity  176 user I/O pins support a broad range of external interfaces and parallel signals, enabling dense board-level integration.
  • Package and Mounting  256-BGA (256-FBGA, 17×17) surface-mount package optimizes board area while providing a robust ball-grid footprint for high-density designs.
  • Industrial Grade and Temperature  Rated for industrial operation with an operating temperature range of −40°C to 85°C for reliable performance in extended-temperature environments.
  • Power Supply  Device supply specified at 2.375 V to 2.625 V to match target board power rails.
  • Series-level Capabilities  FLEX 10K family features include embedded arrays for megafunctions, JTAG boundary-scan (IEEE Std. 1149.1) for test and configuration, and architecture-level features such as dedicated carry and cascade chains for efficient arithmetic and high-fan-in logic.
  • Compliance  RoHS-compliant construction supports environmentally conscious designs and manufacturing processes.

Typical Applications

  • Industrial Control  Reconfigurable logic and industrial temperature rating suit motor control, PLC subsystems, and factory automation interfaces requiring robust operation.
  • Embedded Systems  Use as a programmable glue logic or subsystem controller to integrate custom peripherals, timing logic, and memory buffering within compact embedded platforms.
  • Communication Interfaces  High I/O count allows implementation of parallel interfaces, protocol bridging, and custom bus logic for networking and telecom equipment.
  • Prototyping and Product Development  The FPGA’s reprogrammability and on-chip RAM make it suitable for iterative hardware development, algorithm validation, and proof-of-concept designs.

Unique Advantages

  • Reconfigurable Integration: Combines programmable logic and embedded RAM to reduce external component count and simplify system architecture.
  • Industrial Reliability: Specified for −40°C to 85°C operation and RoHS compliance to meet industrial supply-chain and environmental requirements.
  • Compact, High-density Packaging: 256-FBGA (17×17) package maximizes board density while providing a reliable BGA interconnect for complex layouts.
  • Generous I/O Resources: 176 I/O pins enable direct interfacing to multiple peripherals and buses without external expanders.
  • Family Ecosystem Support: Built on the FLEX 10K architecture which includes JTAG boundary-scan and family design tools and megafunction support for faster design implementation.

Why Choose EPF10K30EFI256-2?

The EPF10K30EFI256-2 positions itself as a flexible, industrial-grade FPGA option when you need moderate logic capacity, meaningful on-chip RAM, and substantial I/O in a compact BGA package. Its combination of 1,728 logic elements, approximately 24,576 bits of embedded memory, and 176 user I/Os provides a balanced solution for embedded and control-oriented designs.

This device is well suited for engineers and procurement teams seeking a reprogrammable component that supports in-system configuration, board-level density, and industrial operating conditions. Leveraging FLEX 10K family capabilities helps streamline integration of custom logic, reduce BOM complexity, and accelerate development cycles.

Request a quote or submit a procurement inquiry to evaluate EPF10K30EFI256-2 for your next design.

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