EPF10K30EQC208-1N

The EPF10K30EQC208-1N is a FLEX-10KE embedded programmable logic device (PLD) in a 208-BFQFP surface-mount package. Built for mid-range logic integration, it combines 1,728 logic elements with 24,576 bits of embedded RAM to enable system-on-a-programmable-chip (SOPC) implementations and specialized megafunctions.

Designed for commercial applications, the device offers flexible I/O behavior, in-circuit reconfigurability and a compact 208-pin package, making it suitable for embedded control, interface bridging, and custom logic tasks where integration and reconfigurability are priorities.

Key Features

• Logic Capacity  Approximately 1,728 logic elements and up to 119,000 system gates provide mid-range programmable logic resources for custom control and glue-logic functions.
• Embedded Memory (EABs)  24,576 bits of total RAM available in embedded array blocks (EABs) support dual-port memory implementations and on-chip buffering for data-intensive functions.
• I/O Flexibility  147 user I/O pins (surface-mount) support mixed-signal interfacing needs and enable broad connectivity within constrained board space.
• Power and Voltage  Operates with an internal supply in the 2.375 V to 2.625 V range and includes MultiVolt™ I/O capabilities described in the FLEX-10KE family material for flexible interfacing options.
• Package and Mounting  208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for compact PCB integration.
• Commercial Temperature Grade  Rated for 0 °C to 70 °C operation to meet commercial application environments.
• System Features  Series-level features include in-circuit reconfigurability via external configuration devices or JTAG boundary-scan, dedicated carry and cascade chains for high-speed arithmetic and high-fan-in logic, and low-skew clock distribution options.
• Standards and Testability  Built-in JTAG (IEEE Std. 1149.1) boundary-scan test circuitry supports board-level test without consuming additional device logic; device is RoHS compliant.
• Design Tool Support  FLEX-10KE family devices are supported by the associated software tool flows and megafunction libraries referenced in the family datasheet for design entry, place-and-route, and simulation.

Typical Applications

• Embedded Control  Custom motor control, system controllers, and appliance logic where moderate logic capacity and embedded RAM enable compact, reconfigurable designs.
• Interface Bridging  Protocol adaptation and glue-logic between peripherals—leverages flexible I/O and programmable logic to implement custom interface logic.
• Memory and Buffering  On-chip EABs support dual-port memory and buffering functions for data path staging, FIFOs, and small embedded memory controllers.
• Prototyping and Development  Mid-density FPGA resource set for validating custom logic, algorithm acceleration, and system integration before production-scale deployment.

Unique Advantages

• Highly integrated mid-range logic: 1,728 logic elements with up to 119,000 system gates and embedded RAM reduce the need for external glue logic and memory components.
• Flexible on-chip memory: 24,576 bits of embedded RAM and dual-port EAB capability simplify implementation of local buffers and megafunctions without sacrificing logic resources.
• Configurable I/O behavior: MultiVolt I/O family features and 147 user I/Os enable diverse interface choices while maintaining a single-device solution.
• Reconfigurability and test support: In-circuit reprogramming and IEEE 1149.1 JTAG boundary-scan support ease iterative development and board-level testing.
• Compact packaging: 208-BFQFP surface-mount package balances pin count and board area for space-constrained designs.
• RoHS compliant, commercial grade: Suitable for commercial electronics with specified supply and temperature ranges to match typical embedded applications.

Why Choose EPF10K30EQC208-1N?

The EPF10K30EQC208-1N positions itself as a practical mid-density programmable logic device for designers who need a balance of logic elements, embedded memory, and flexible I/O in a compact surface-mount package. Its embedded RAM, reconfigurability options and series-level system features make it a fit for SOPC-style integration, interface adaptation, and prototyping tasks.

For teams targeting commercial applications with defined supply and temperature windows, this device delivers reprogrammable logic, on-chip memory, and testability features that help reduce BOM complexity and accelerate time-to-market while remaining compliant with RoHS requirements.

Request a quote or submit a product inquiry for availability and pricing for EPF10K30EQC208-1N. Our team can provide lead-time and purchasing information to support your design timeline.