EPF10K30EQC208-2

The EPF10K30EQC208-2 is an Intel FLEX-10KE family FPGA offering a mid-density programmable logic solution with on-chip RAM and a broad set of I/O. It delivers 1,728 logic elements and approximately 24,576 bits of embedded RAM in a surface-mount 208-BFQFP package targeted at commercial-temperature applications.

Designed for system integration tasks that require flexible logic, embedded memory and multiple I/O, this device suits control, interface bridging and general-purpose digital designs where compact package and configurable logic are priorities.

Key Features

• Logic Capacity  1,728 logic elements and 216 logic array blocks (LABs) provide a balanced mix of logic resources for mid-range programmable designs.
• Embedded Memory  Total on-chip RAM of 24,576 bits supports local storage for buffering, small LUTs and state machines without external memory.
• I/O Density  147 user I/O pins enable flexible interfacing to buses, peripherals and sensors in a single-chip solution.
• Package & Mounting  208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for PCB space-efficient implementations.
• Power  Specified supply voltage range of 2.375 V to 2.625 V for integration into low-voltage commercial power domains.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 70 °C and RoHS-compliant material status.
• Family-Level Architecture  Part of the FLEX 10K family, which includes embedded array blocks for megafunctions, in-circuit reconfigurability options and JTAG boundary-scan support as documented in the family datasheet.

Typical Applications

• Interface Bridging  Use the 147 I/O pins and programmable logic to implement protocol translation, glue logic and bus bridging between subsystems.
• Control and Sequencing  Implement finite-state machines, timing controllers and peripheral management for appliances and instrumentation.
• Embedded Memory Functions  Leverage the on-chip RAM for small FIFOs, look-up tables and buffering in data-paths and signal processing pipelines.
• Prototyping and Development  A mid-density FPGA option for validating logic architectures and iterating system designs in commercial-temperature applications.

Unique Advantages

• Mid-density Logic with Embedded RAM  Combines 1,728 logic elements and 24,576 bits of RAM to reduce the need for external components and simplify board design.
• High I/O Count  147 user I/Os provide direct connectivity options that minimize intermediate interfaces and lower component count.
• Compact Surface-Mount Package  208-BFQFP footprint offers a balance between pin count and board area for denser PCBs.
• Commercial-Grade Specification  Specified operating range (0 °C to 70 °C) and RoHS compliance make the device suitable for standard commercial electronics and manufacturing flows.
• Family-Level Design Support  As a member of the FLEX 10K family, the device benefits from documented architectural features that support in-circuit reconfigurability and boundary-scan testing.

Why Choose EPF10K30EQC208-2?

The EPF10K30EQC208-2 positions itself as a practical mid-density FPGA for designers who need a combination of programmable logic, embedded RAM and ample I/O in a surface-mount 208-pin package. Its specification set—1,728 logic elements, ~24.6kbits of on-chip RAM, 147 I/Os and a commercial temperature rating—matches a wide range of control, interface and prototyping requirements.

For teams targeting compact, integrated digital designs with predictable supply and temperature domains, this FLEX-10KE device delivers the core resources and family-level features to streamline development and reduce BOM complexity.

Request a quote or submit your procurement inquiry to receive pricing and availability for EPF10K30EQC208-2.