EPF10K30EQC208-3

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP

Quantity 1,102 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level6 (Time on Label)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K30EQC208-3 – FLEX-10KE Field Programmable Gate Array (FPGA), 1728 Logic Elements, 24,576 bits RAM, 147 I/O, 208-BFQFP

The EPF10K30EQC208-3 is an Intel FLEX-10KE family FPGA provided in a 208-pin BFQFP package. It combines a dedicated logic array and embedded memory blocks for implementing custom logic and on-chip megafunctions, making it suitable for commercial embedded designs that require reconfigurable logic and moderate on-chip memory.

Key capabilities exposed for system designers include 1,728 logic elements, approximately 24,576 bits of embedded RAM, 147 user I/O pins, and support for in-circuit reconfigurability and boundary-scan. The device targets applications where integration of custom logic, memory, and flexible I/O in a compact surface-mount package is required.

Key Features

  • Logic Capacity — 1,728 logic elements and 216 logic array blocks provide the programmable logic resources for implementing custom functions and control logic.
  • On-Chip Memory — Approximately 24,576 bits of embedded RAM available for data buffering, state storage, and memory-mapped megafunctions.
  • I/O and Connectivity — 147 user I/O pins enable wide interfacing options for peripherals, sensors, and external logic in a single-package solution.
  • Package and Mounting — 208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for PCB-mounted embedded systems.
  • Power and Supply — Core supply specified at 2.375 V to 2.625 V; suitable for designs that require this core-voltage range.
  • Operating Conditions — Commercial-grade device with an operating temperature range of 0 °C to 70 °C.
  • Family-Level System Features — FLEX 10K family capabilities include in-circuit reconfigurability (ICR), built-in JTAG boundary-scan compliant with IEEE 1149.1 for device-level test, and architecture features such as dedicated carry and cascade chains plus FastTrack interconnect for predictable routing delays.
  • Clock and Timing Options — Family options such as ClockLock and ClockBoost are supported for reduced clock skew and clock multiplication (refer to device documentation for specific availability).
  • Manufacturing and Compliance — RoHS compliant and provided as a commercially graded Intel device.

Typical Applications

  • Embedded Control and Logic — Implement custom control state machines, peripheral glue logic, and timing-critical functions using the device’s logic elements and dedicated arithmetic/cascade chains.
  • On-Board Memory Functions — Use the embedded RAM blocks for buffering, small FIFOs, or table storage where moderate on-chip memory reduces external memory requirements.
  • Interface Bridging and I/O Expansion — Leverage 147 user I/O pins to bridge between serial/peripheral interfaces, expand digital I/O, or perform protocol adaptation within a compact package.
  • Prototyping and System Integration — Reconfigurable logic and JTAG boundary-scan make the device suitable for prototype development and iterative hardware/software integration in commercial products.

Unique Advantages

  • Balanced Logic and Memory — 1,728 logic elements combined with 24,576 bits of embedded RAM provide a practical balance for control-centric designs that also need on-chip data storage.
  • Compact, Surface-Mount Packaging — 208-pin BFQFP (28×28 PQFP form) offers a dense pin count in a widely used surface-mount package for space-constrained PCBs.
  • Comprehensive Family-Level Capabilities — FLEX 10K family features such as FastTrack interconnect, dedicated carry/cascade chains, and JTAG boundary-scan help simplify implementation of arithmetic operations, high-fan-in logic, and device testability.
  • Reconfigurability — In-circuit reconfigurability supports design iteration and field updates without changing PCB hardware.
  • Commercial Availability — Commercial grade device specification and RoHS compliance facilitate integration into mainstream embedded product lines.

Why Choose EPF10K30EQC208-3?

The EPF10K30EQC208-3 is positioned for commercial embedded designs that require a mix of reconfigurable logic, on-chip RAM, and substantial I/O in a single, surface-mount package. Its FLEX-10KE family architecture provides system-level features—such as in-circuit reconfigurability and JTAG boundary-scan—alongside routing and arithmetic structures that simplify implementation of common digital functions.

This device is a practical choice for engineers building compact, reprogrammable systems that need reliable logic capacity, modest embedded memory, and flexible interfacing, backed by Intel’s FLEX 10K family capabilities and RoHS compliance.

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