EPF10K30EQC208-3N

The EPF10K30EQC208-3N is a FLEX-10KE field programmable gate array (FPGA) from Intel designed for embedded programmable logic applications. It pairs a dedicated logic array with embedded memory to enable system-level integration of custom logic, I/O management and specialized megafunctions.

Targeted at commercial applications, the device delivers a balanced combination of logic density, on-chip RAM and flexible I/O in a 208-BFQFP surface-mount package, supporting designs that require reconfigurable logic and on-board memory resources.

Key Features

• Logic Density  1,728 logic elements and 216 LABs provide up to 119,000 gates of implementable logic for glue logic, state machines and custom datapaths.
• Embedded Memory  24,576 total RAM bits of on-chip memory to support FIFOs, small buffers and table storage without external RAM.
• I/O and Package  147 user I/O pins in a 208-BFQFP (supplier package: 208-PQFP 28×28) surface-mount package, simplifying board-level routing and footprint planning.
• Power and Supply  Operates from a supply range of 2.375 V to 2.625 V, suitable for systems designed around that core rail.
• Commercial Temperature Range  Rated for 0 °C to 70 °C operating temperature for standard commercial applications.
• Family-Level System Features  FLEX 10K family features include in-circuit reconfigurability (ICR) via external configuration device or JTAG, built-in JTAG boundary-scan, dedicated carry and cascade chains, and low-skew clock distribution trees for reliable timing across the device.
• Standards and Compliance  RoHS compliant and supplied in a tested surface-mount package for modern assembly processes.

Typical Applications

• Embedded Control  Implement custom control logic, state machines and peripheral interfaces using the device’s logic array and embedded memory.
• Interface Bridging  Use the FPGA to bridge and translate between parallel or serial interfaces, leveraging plentiful I/O and on-chip memory for buffering.
• Prototyping and Development  Ideal for proof-of-concept and early-stage hardware development where reconfigurable logic and in-system reprogramming accelerate design iteration.
• Glue Logic for Systems  Replace multiple discrete logic components with a single reprogrammable device to reduce BOM complexity and board area.

Unique Advantages

• Balanced Logic and Memory:  Combines 1,728 logic elements with 24,576 bits of on-chip RAM to implement both control and small data-store functions without additional external memory.
• Flexible I/O Count and Packaging:  147 I/O pins in a 208-BFQFP footprint support moderate pin-count designs while maintaining a compact board profile.
• In-System Reconfigurability:  Support for in-circuit reconfiguration and JTAG boundary-scan enables iterative development and field updates.
• Design Ecosystem Compatibility:  Part of the FLEX 10K family, which is supported by established development tools and megafunction libraries, streamlining implementation and verification.
• Commercial-Grade Reliability:  Rated for 0 °C to 70 °C operation and supplied RoHS compliant for standard commercial deployments.

Why Choose EPF10K30EQC208-3N?

The EPF10K30EQC208-3N positions itself as a practical FPGA choice for commercial embedded designs that require a combination of moderate logic capacity, on-chip RAM and flexible I/O in a compact 208-BFQFP package. Its family-level features—such as JTAG boundary-scan, in-circuit reconfigurability and dedicated arithmetic/cascade resources—support efficient implementation of control logic, interface bridging and prototyping tasks.

This device suits engineers and designers seeking a reprogrammable, vendor-supported solution from Intel for mid-density logic and memory integration while keeping BOM complexity and board area under control.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the EPF10K30EQC208-3N. Our team can help evaluate fit for your design and provide ordering options.