EPF10K30EQI208-3

The EPF10K30EQI208-3 is an Intel FLEX-10KE field programmable gate array (FPGA) packaged in a 208-BFQFP surface-mount package. It combines a logic array with embedded array blocks to deliver flexible on-chip logic and memory for industrial embedded applications.

Designed for system-level integration, this device targets embedded systems and industrial designs that require reconfigurable logic, on-chip RAM, and a compact 208-pin footprint while operating across an industrial temperature range.

Key Features

• Core Logic  The device provides 1,728 logic elements and a typical equivalent of 30,000 gates with a maximum system gate capacity listed at 119,000, enabling implementation of mid-density logic designs.
• Embedded Memory (EABs)  Six embedded array blocks (EABs) provide a total of 24,576 bits of on-chip RAM; EABs support dual-port operation for efficient memory and megafunction implementation.
• I/O and Signaling  147 user I/O pins (surface-mount) support flexible interfacing in a compact package; family-level MultiVolt I/O options permit interfacing with multiple voltage domains.
• Package and Mounting  208-BFQFP package (supplier package: 208-PQFP, 28×28) with surface-mount mounting for compact PCB layouts and standard assembly processes.
• Power Supply  Internal/operating supply range specified at 2.375 V to 2.625 V, consistent with a 2.5-V core operating point.
• Temperature and Grade  Industrial grade device specified for an operating temperature range of −40 °C to 85 °C, suitable for industrial environments.
• Built-in Test and Configuration  Family-level JTAG boundary-scan (IEEE Std. 1149.1) circuitry is included for in-system test and configuration without consuming user logic.
• Performance and System Features  Family features include dual-port EAB capability, low-skew clock distribution, dedicated carry and cascade chains, and options such as ClockLock and ClockBoost for reducing clock delay and supporting clock multiplication.
• Standards and Compliance  Device is RoHS compliant and designed for fully tested functional delivery.

Typical Applications

• Industrial Control  Reconfigurable logic and on-chip RAM make the device suitable for industrial automation modules and control logic where temperature and reliability matter.
• Embedded Memory Functions  Dual-port EABs and 24,576 bits of embedded RAM support buffer, FIFO, and custom memory-mapped functions inside a single FPGA.
• Interface Bridging  Flexible I/O and programmable logic enable protocol conversion and interface glue logic in compact, PCB-constrained systems.
• Prototyping and System Integration  The FLEX-10KE architecture supports SOPC-style integration for integrating specialized logic functions and megafunctions during prototyping or system development.

Unique Advantages

• Compact, Mid-Density Integration: 1,728 logic elements with embedded RAM deliver a balance of logic and memory for mid-range designs without excessive board area.
• On-Chip Dual-Port Memory: Six EABs with dual-port capability simplify implementation of shared-memory and high-throughput data paths.
• Industrial Reliability: Specified for −40 °C to 85 °C operation and supplied in a surface-mount 208-BFQFP package suited to industrial assemblies.
• Flexible I/O and System-Level Features: MultiVolt I/O family support and low-skew clocking options allow easier interfacing and predictable timing across a range of system topologies.
• In-System Test and Configuration: Built-in IEEE 1149.1 JTAG boundary-scan provides testability and in-circuit reconfigurability without consuming user logic resources.
• RoHS Compliant: Meets lead-free environmental requirements for modern electronics production.

Why Choose EPF10K30EQI208-3?

The EPF10K30EQI208-3 positions itself as a versatile FLEX-10KE FPGA option for industrial embedded designs that need a compact package, a blend of logic and on-chip memory, and robust I/O capability. Its combination of 1,728 logic elements, six dual-port EABs, and support for in-system test/configuration makes it a practical choice where reconfigurability and system integration are priorities.

Engineers and procurement teams will find this device suitable for mid-density FPGA tasks that require industrial temperature operation, a 208-pin footprint, and a tested, RoHS-compliant implementation backed by the FLEX-10KE family feature set.

Request a quote or submit a pricing inquiry for the EPF10K30EQI208-3 to receive availability and lead-time details tailored to your project requirements.