EPF10K30ETC144-2

The EPF10K30ETC144-2 is a FLEX-10KE family field programmable gate array (FPGA) from Intel, offered in a 144-LQFP surface-mount package. It combines a logic array and embedded memory to support System-on-a-Programmable-Chip (SOPC) integration for commercial embedded and interface applications.

With 1,728 logic elements across 216 logic array blocks, 24,576 bits of embedded RAM and 102 user I/Os, this device is suited to designs that require reconfigurable logic, embedded memory and flexible I/O in a compact LQFP form factor.

Key Features

• Logic Capacity 1,728 logic elements organized in 216 logic array blocks provide programmable logic for control, glue logic and custom processing functions.
• Embedded Memory 24,576 bits of on-chip RAM for buffering, small lookup tables and state storage.
• I/O Count 102 user I/O pins to interface with peripherals, sensors and external logic.
• Supply and Temperature Specified supply range 2.375 V to 2.625 V and commercial operating temperature range 0 °C to 70 °C.
• Package & Mounting 144-LQFP (144-TQFP 20×20) surface-mount package for board-level integration in space-conscious designs.
• System-Level Features (family) FLEX 10K family features include embedded array blocks for megafunctions, in-circuit reconfigurability and JTAG boundary-scan support, enabling SOPC-style integration and flexible system debug.
• Regulatory RoHS compliant.

Typical Applications

• Embedded control and logic Implement application-specific control functions, protocol bridging or glue logic where reprogrammability and compact packaging are required.
• Interface and peripheral functions Use the device’s 102 I/Os to implement custom I/O expansion, signal conditioning, or peripheral interfacing in commercial systems.
• Memory-assisted logic Leverage the 24,576 bits of embedded RAM for small buffers, FIFOs or lookup tables in data-path or control applications.
• Prototyping and development Reconfigurable logic and JTAG support make the part useful for prototype designs and iterative hardware development.

Unique Advantages

• Balanced logic and memory The combination of 1,728 logic elements and 24,576 bits of embedded RAM supports mixed logic-plus-memory functions without external SRAM for many compact designs.
• High I/O density in LQFP 102 user I/Os in a 144-LQFP package deliver ample external connectivity while preserving board-space efficiency.
• Commercial temperature rating Designed for commercial applications with an operating range of 0 °C to 70 °C, matching typical office and consumer environments.
• Surface-mount package 144-LQFP surface-mount mounting simplifies PCB assembly for volume manufacturing and reflow processes.
• RoHS compliant Meets RoHS environmental requirements for lead-free manufacturing processes.

Why Choose EPF10K30ETC144-2?

The EPF10K30ETC144-2 offers a practical balance of logic density, embedded memory and I/O capability in a compact 144-LQFP package, making it a solid choice for commercial embedded designs that require on-chip reconfigurable logic and moderate memory. Its feature set supports SOPC-style integration and iterative development workflows while fitting into space- and cost-sensitive boards.

This device is well suited to engineers and product teams designing commercial embedded systems, interface logic, prototyping platforms and peripheral controllers who need a reprogrammable, RoHS-compliant FPGA with clearly defined electrical and thermal limits.

Request a quote or submit an inquiry to obtain pricing and availability for the EPF10K30ETC144-2.