EPF10K30ETC144-1X

The EPF10K30ETC144-1X is a FLEX-10KE field programmable gate array (FPGA) IC from Intel designed for commercial embedded logic applications. As a member of the FLEX 10K family, it combines programmable logic resources and on-chip RAM to support mid-density custom logic, protocol bridging, and embedded control functions.

This surface-mount device provides 1,728 logic elements, 24,576 bits of total RAM, and 102 user I/O pins in a 144-pin LQFP package, offering a compact, reconfigurable platform for commercial embedded designs operating at a supply voltage of 2.375 V to 2.625 V and an operating temperature range of 0 °C to 70 °C.

Key Features

• Logic Capacity — 1,728 logic elements (LEs) and 216 logic array blocks, providing a mid-density programmable fabric for custom logic functions.
• On-chip RAM — 24,576 total RAM bits of embedded memory to support buffer, FIFO, and small data-structure implementations without added external memory.
• I/O Count and Flexibility — 102 user I/O pins to interface with peripherals and external devices; the FLEX 10K series datasheet documents I/O capabilities such as individual tri-state control, open-drain options, and programmable output slew-rate control.
• Gate Equivalent — Approximately 119,000 gates (logic and RAM) for sizing system-level logic functions.
• Package and Mounting — 144-LQFP (supplier device package listed as 144-TQFP, 20 × 20) in a surface-mount form factor for compact board layouts.
• Power and Thermal — Supply voltage 2.375 V to 2.625 V and commercial operating temperature range 0 °C to 70 °C, suitable for standard commercial environments.
• Series-Level System Features — The FLEX 10K family datasheet documents series capabilities such as in-circuit reconfigurability, JTAG boundary-scan test circuitry (IEEE 1149.1), low-skew clock distribution and dedicated carry/cascade chains for efficient arithmetic and high-fan-in logic.
• Regulatory — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, sensor interfaces, and peripheral glue logic where a compact reconfigurable device reduces board complexity.
• Protocol Bridging and Interface Conversion — Use the device’s logic and on-chip RAM to implement protocol translators and buffering between subsystems with moderate I/O requirements.
• Prototyping and Development — Rapidly iterate hardware designs that require reprogrammable logic and embedded memory for validation and proof-of-concept builds.
• Peripheral Integration — Consolidate discrete logic, small FIFOs, and interface functions into a single programmable device to simplify BOM and PCB routing.

Unique Advantages

• Balanced logic and memory — 1,728 logic elements combined with 24,576 bits of on-chip RAM supports integrated logic-plus-storage implementations that reduce external component count.
• Mid-density I/O capability — 102 user I/O pins enable connection to multiple peripherals while remaining suitable for compact board designs.
• Compact surface-mount package — 144-LQFP / 144-TQFP (20 × 20) delivers a small footprint option for space-constrained commercial applications.
• Series-level configurability and test — Family features such as in-circuit reconfigurability and JTAG boundary-scan (per the FLEX 10K datasheet) simplify development, programming, and production test flows.
• Commercial operating range — Defined supply voltage and temperature specifications make the device appropriate for standard commercial electronics.
• Environmentally compliant — RoHS compliance supports environmental and regulatory requirements for commercial products.

Why Choose EPF10K30ETC144-1X?

The EPF10K30ETC144-1X is positioned for designers who need a mid-density programmable logic device with integrated RAM and a moderate I/O count in a compact surface-mount package. Its combination of 1,728 logic elements and 24,576 bits of embedded memory enables consolidation of logic and small-data storage functions to reduce board-level complexity.

As a FLEX 10K family device, it benefits from documented series capabilities such as in-circuit reconfigurability, JTAG boundary-scan, and vendor-provided design tools and place-and-route support (as noted in the series datasheet), offering a practical path from development to production for commercial embedded designs.

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