EPF10K30ETC144-2X

The EPF10K30ETC144-2X is a FLEX 10K family field programmable gate array offered by Intel. This surface-mount FPGA provides a mid-range fabric optimized for system-level integration, combining programmable logic with embedded memory to implement custom logic, glue functions, and megafunctions on a single device.

With 1,728 logic elements, 24,576 bits of on-chip RAM, and 102 user I/O pins in a 144-LQFP package, the device is suited to commercial embedded designs that require in-system reconfigurability and flexible I/O in a compact footprint.

Key Features

• Logic Capacity — 1,728 logic elements provide the programmable logic resources for custom combinational and sequential functions.
• Embedded Memory — 24,576 bits of total RAM for on-chip storage and megafunction implementations.
• I/O Density — 102 user I/O pins enable multiple peripheral interfaces and board-level connectivity.
• Gate Count — Listed device gate count of 119,000 for system-level resource planning.
• Supply & Power — Operates from a 2.375 V to 2.625 V supply range suitable for matched system power rails.
• Package & Mounting — 144-LQFP (surface mount) package (supplier package 144-TQFP 20×20) for compact PCB designs.
• Temperature Range — Commercial operating range from −40 °C to 85 °C for typical embedded environments.
• Standards & Compliance — RoHS-compliant component for environmental regulation alignment.
• FLEX 10K Family Capabilities — As part of the FLEX 10K family, supports embedded arrays for megafunctions, in-circuit reconfigurability, IEEE 1149.1 JTAG boundary-scan, FastTrack interconnect, dedicated carry and cascade chains, and programmable I/O options such as tri-state and programmable slew-rate control.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) Integration — Implements embedded megafunctions and memory-rich blocks to consolidate system logic and reduce external components.
• Board-Level Glue Logic — Provides custom interface logic and protocol adaptation using the device’s programmable fabric and 102 I/O pins.
• In-Circuit Reconfigurable Prototyping — Supports in-circuit reconfigurability and JTAG-based configuration for iterative hardware development and field updates.
• Memory-Intensive Logic — Uses on-chip RAM for FIFOs, buffering, and other localized storage needs in embedded designs.

Unique Advantages

• Balanced Logic and Memory — 1,728 logic elements paired with 24,576 bits of RAM enable mixed logic-plus-memory implementations without immediate need for external RAM.
• Compact, Surface-Mount Packaging — 144-LQFP package supports space-constrained PCB layouts while providing a substantial I/O count.
• Family-Level System Features — FLEX 10K family attributes such as FastTrack routing, dedicated carry chains, and ClockLock/ClockBoost options enable predictable timing and optimized arithmetic performance.
• Design and Test Support — Built-in IEEE 1149.1 JTAG boundary-scan for device testing and in-system configuration enhances board-level testability and deployment flexibility.
• Regulatory and Environmental — RoHS-compliance supports designs targeting regulated markets and helps simplify environmental qualification.

Why Choose EPF10K30ETC144-2X?

The EPF10K30ETC144-2X delivers a practical balance of logic capacity, embedded memory, and I/O in a compact 144-LQFP package, making it suitable for commercial embedded projects that require on-chip RAM, flexible I/O, and in-circuit reconfigurability. Its alignment with FLEX 10K family features—such as family-level routing and clock options, JTAG boundary-scan, and dedicated arithmetic chains—provides predictable integration paths for system designers.

Choose this device when you need a mid-range, RoHS-compliant FPGA that supports system consolidation, iterative development via in-circuit reconfiguration, and reliable board-level testability for commercial embedded applications.

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