EPF10K30ETC144-1N

The EPF10K30ETC144-1N is a FLEX 10K family field programmable gate array (FPGA) in a 144-LQFP surface-mount package, manufactured by Intel. It provides 1,728 logic elements and 24,576 bits of embedded RAM with 102 user I/O pins, making it suitable for commercial embedded logic, interface bridging, and mid-density programmable logic tasks. As a member of the FLEX 10K family, it supports family-level features such as embedded arrays for implementing megafunctions and in-circuit reconfigurability.

Key Features

• Logic Capacity — 1,728 logic elements (LEs) and approximately 119,000 gates of logic capacity, enabling mid-density combinational and sequential logic designs.
• On‑Chip Memory — 24,576 total RAM bits of embedded memory for local buffers, FIFOs, and small data structures.
• I/O and Interfaces — 102 user I/O pins supporting flexible pin control for peripheral interfacing and custom buses.
• Package & Mounting — 144-LQFP (supplier device package listed as 144-TQFP 20×20) in a surface-mount form factor for compact PCB layouts.
• Power — Core/operating supply range specified as 2.375 V to 2.625 V to match system power rails.
• Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 70 °C.
• Standards & Test — RoHS compliant; FLEX 10K family documentation notes built-in JTAG boundary-scan (IEEE 1149.1) for board-level testability.
• Family-Level Architecture — FLEX 10K family features such as embedded arrays for megafunctions, FastTrack interconnect, dedicated carry and cascade chains, and low-skew clock distribution are documented in the FLEX 10K datasheet.

Typical Applications

• Interface Bridging and Glue Logic — Implement protocol conversion, bus glue logic, and custom peripheral interfaces using the device’s I/O and logic resources.
• Embedded Memory Functions — Use the on‑chip RAM for small buffers, FIFOs, or lookup tables in embedded control and data-path applications.
• Control and Sequencing — Implement state machines, control logic, and timing-critical glue in commercial electronic products.
• Prototyping and Development — Mid-density programmable resource for prototype systems or for designs that require reconfigurability and incremental feature updates.

Unique Advantages

• Balanced Logic and Memory — Combination of 1,728 logic elements and 24,576 bits of embedded RAM supports mixed control and data-path functions without large external memory needs.
• Compact, Board‑Ready Package — 144-LQFP surface-mount package offers a compact footprint for space-constrained commercial designs.
• Flexible I/O Count — 102 user I/O pins enable multiple peripheral connections and custom interface designs.
• Family-Level Integration Features — FLEX 10K family architecture provides features such as embedded arrays for megafunctions, dedicated carry/cascade chains, and low-skew clocking to simplify implementation of arithmetic and timing-sensitive logic (as described in the FLEX 10K datasheet).
• Testability and Reconfigurability — Built-in JTAG boundary-scan and support for in‑circuit reconfigurability help streamline board test and updates.
• Regulatory and Assembly Ready — RoHS compliant and supplied in a standard surface-mount package for modern manufacturing flows.

Why Choose EPF10K30ETC144-1N?

The EPF10K30ETC144-1N offers a practical combination of mid-range logic resources, embedded RAM, and flexible I/O in a compact 144-LQFP package, making it a good fit for commercial embedded systems that require reconfigurable logic and on-chip memory. As part of Intel’s FLEX 10K family, it benefits from documented architecture features—such as embedded arrays for megafunctions, dedicated carry/cascade chains, and provisions for JTAG boundary-scan—that support integration, testability, and iterative development.

Choose this device when your design needs a surface-mount, commercial-grade FPGA with moderate logic density, built-in RAM, and a balance of I/O and package size for board-level integration and prototyping.

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