EPF10K30EQI208-2N
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP |
|---|---|
| Quantity | 138 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 119000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K30EQI208-2N – FLEX-10KE Field Programmable Gate Array (FPGA) IC, 1728 Logic Elements, 208-BFQFP
The EPF10K30EQI208-2N is a FLEX-10KE family field programmable gate array (FPGA) manufactured by Intel. It combines a logic array and embedded memory to enable customizable digital logic and system-level integration for industrial applications.
With 1,728 logic elements, 216 LABs, and 24,576 bits of embedded RAM, this device is suited for mid-density FPGA designs that require a balance of logic capacity, on-chip memory and flexible I/O connectivity over an industrial operating range.
Key Features
- Logic Capacity — 1,728 logic elements across 216 LABs provide programmable logic resources for combinational and sequential functions.
- Embedded Memory — 24,576 total RAM bits of on-chip memory for buffering, state storage and small data structures.
- I/O Density — 147 user I/O pins to interface with sensors, peripherals and external logic.
- Gate Scale — Documented with 119,000 gates for system-level gate-count planning.
- Voltage Supply — Operates from 2.375 V to 2.625 V to match target board power rails.
- Industrial Temperature — Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
- Package & Mounting — 208‑BFQFP (supplier package 208‑PQFP, 28×28) in a surface-mount form factor for board-level integration.
- Reconfigurability & Test — Family-level features include in-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan test support for programming and board test.
- Architectural Features — FLEX 10K family attributes such as embedded arrays for megafunctions, dedicated carry and cascade chains, and low-skew clock distribution are available at the family level for system design.
- RoHS Compliant — Conforms to RoHS requirements for lead‑free assemblies.
Typical Applications
- Industrial Control — Implement motor control logic, sensor interfacing and real-time I/O aggregation within industrial automation systems using the device’s logic and I/O resources.
- Embedded System Integration (SOPC) — Use the device’s programmable logic and embedded RAM to implement system-on-a-programmable-chip (SOPC) architectures and custom peripheral functions.
- Interface Bridging & Protocol Conversion — Deploy as a flexible interface hub for protocol translation and signal conditioning across diverse digital interfaces, leveraging its 147 I/O pins.
- Prototyping & Small-Scale Production — Mid-density logic and on-chip memory make this part suitable for design validation, prototyping and production runs within industrial temperature ranges.
Unique Advantages
- Balanced Logic and Memory: The combination of 1,728 logic elements and 24,576 bits of embedded RAM supports both control logic and local data storage without external memory for many mid-density designs.
- Industrial Temperature Rating: −40 °C to 85 °C qualification supports deployment in harsher operating environments.
- Flexible I/O Count: 147 user I/O pins provide the connectivity needed for multi-sensor or multi-peripheral applications, reducing the need for external multiplexers.
- Surface-Mount BFQFP Package: The 208‑BFQFP (28×28) package simplifies PCB routing for QFP-based layouts and supports standard surface-mount assembly processes.
- Reconfigurability and Test Support: In-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan enable field updates and board-level testability.
- Regulatory & Assembly Friendly: RoHS compliance eases use in lead-free manufacturing flows.
Why Choose EPF10K30EQI208-2N?
The EPF10K30EQI208-2N positions itself as a practical mid-density FPGA option for designers who need a compact, reconfigurable IC with a clear balance of logic, embedded memory and I/O. Its industrial temperature rating and surface-mount BFQFP package make it suitable for embedded and control applications where environmental robustness and board-level integration are critical.
Designed for projects that benefit from on-chip RAM, dedicated architectural chains and family-level system features such as JTAG programming and reconfigurability, this FLEX-10KE device is appropriate for engineers targeting flexible, maintainable designs with documented vendor-supported development flows at the family level.
Request a quote or submit an RFQ to receive pricing, lead-time and availability information for the EPF10K30EQI208-2N. Our team will respond with the details you need to evaluate this device for your next design.

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