EPF10K30EQC208-2X

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP

Quantity 1,949 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K30EQC208-2X – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP

The EPF10K30EQC208-2X is a FLEX-10KE family field programmable gate array designed for commercial embedded and custom-logic applications. It combines 1,728 logic elements and 24,576 bits of on-chip RAM with 147 user I/O pins in a 208-pin BFQFP package to deliver flexible system integration for a wide range of designs.

This device targets designers who need in-system programmability, moderate logic density and on-chip memory for tasks such as custom control, data buffering and peripheral interfacing while operating within a 2.375 V to 2.625 V supply range and a 0 °C to 70 °C commercial temperature window.

Key Features

  • Logic Capacity — 1,728 logic elements and 216 logic array blocks provide configurable logic resources for implementing custom digital functions.
  • On‑Chip Memory — 24,576 bits of embedded RAM are available for FIFOs, small buffers and state storage without immediate need for external memory.
  • Gate Count — 119,000 gates offering a measure of overall device complexity for system-level partitioning and integration.
  • I/O Resources — 147 general-purpose I/O pins to interface with sensors, peripherals and external devices in varied system topologies.
  • Configuration and Test — Supports in-circuit reconfigurability via external configuration device or JTAG; built-in JTAG boundary-scan test circuitry is available for board-level test and debug.
  • Interconnect and Arithmetic Support — Family-level features include dedicated carry and cascade chains plus flexible routing to accelerate arithmetic and high‑fan‑in logic implementations.
  • Package and Mounting — 208-BFQFP (supplier: 208-PQFP 28×28) surface-mount package for conventional PCB assembly.
  • Supply and Operating Range — Core/supply range listed as 2.375 V to 2.625 V with a commercial operating temperature of 0 °C to 70 °C.
  • Compliance — RoHS-compliant for environmental regulatory considerations.

Typical Applications

  • Commercial Embedded Systems — Implement control logic, protocol handling and custom peripheral interfaces using the device’s logic elements and on-chip RAM.
  • Prototyping & Custom IP — Rapidly iterate and evaluate custom logic functions and small-scale system-on-chip concepts with in-circuit reconfigurability and JTAG access.
  • Communications & Peripherals — Buffering, packet parsing or glue logic between chips using available RAM and plentiful I/O pins.
  • User Interfaces and Control — Drive custom UI logic, input scanning and control-state machines leveraging the device’s logic resources and I/O flexibility.

Unique Advantages

  • Balanced Logic and Memory — 1,728 logic elements paired with 24,576 bits of RAM allow compact implementation of control logic plus embedded buffering without immediate external memory.
  • High I/O Count in a Compact Package — 147 user I/Os in a 208-pin BFQFP package support multiple peripherals while fitting standard PCB footprints.
  • In-System Reconfigurability — Supports reconfiguration via external configuration device or JTAG, enabling firmware updates and design iteration without board swaps.
  • Testability — Integrated IEEE 1149.1 JTAG boundary-scan circuitry simplifies board-level testing and debug during development and manufacturing.
  • Regulatory Readiness — RoHS compliance supports deployment in regions and products requiring lead‑free components.

Why Choose EPF10K30EQC208-2X?

The EPF10K30EQC208-2X delivers a practical combination of logic density, embedded RAM and I/O capability in a commercially rated FLEX-10KE FPGA package. Its feature set supports designers who require reconfigurable logic, on-chip memory and board-level testability for commercial embedded products, prototypes and interface bridging functions.

With Intel (Altera) FLEX-10K family design heritage, this part is aimed at teams needing straightforward FPGA integration with clear thermal and supply bounds, RoHS compliance and support for in-system configuration and JTAG-based test flows.

Request a quote or contact sales to discuss availability, lead times and pricing for EPF10K30EQC208-2X. Provide your project details to get tailored support for procurement and deployment.

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