EPF10K30EQC208-2X
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP |
|---|---|
| Quantity | 1,949 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 119000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K30EQC208-2X – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP
The EPF10K30EQC208-2X is a FLEX-10KE family field programmable gate array designed for commercial embedded and custom-logic applications. It combines 1,728 logic elements and 24,576 bits of on-chip RAM with 147 user I/O pins in a 208-pin BFQFP package to deliver flexible system integration for a wide range of designs.
This device targets designers who need in-system programmability, moderate logic density and on-chip memory for tasks such as custom control, data buffering and peripheral interfacing while operating within a 2.375 V to 2.625 V supply range and a 0 °C to 70 °C commercial temperature window.
Key Features
- Logic Capacity — 1,728 logic elements and 216 logic array blocks provide configurable logic resources for implementing custom digital functions.
- On‑Chip Memory — 24,576 bits of embedded RAM are available for FIFOs, small buffers and state storage without immediate need for external memory.
- Gate Count — 119,000 gates offering a measure of overall device complexity for system-level partitioning and integration.
- I/O Resources — 147 general-purpose I/O pins to interface with sensors, peripherals and external devices in varied system topologies.
- Configuration and Test — Supports in-circuit reconfigurability via external configuration device or JTAG; built-in JTAG boundary-scan test circuitry is available for board-level test and debug.
- Interconnect and Arithmetic Support — Family-level features include dedicated carry and cascade chains plus flexible routing to accelerate arithmetic and high‑fan‑in logic implementations.
- Package and Mounting — 208-BFQFP (supplier: 208-PQFP 28×28) surface-mount package for conventional PCB assembly.
- Supply and Operating Range — Core/supply range listed as 2.375 V to 2.625 V with a commercial operating temperature of 0 °C to 70 °C.
- Compliance — RoHS-compliant for environmental regulatory considerations.
Typical Applications
- Commercial Embedded Systems — Implement control logic, protocol handling and custom peripheral interfaces using the device’s logic elements and on-chip RAM.
- Prototyping & Custom IP — Rapidly iterate and evaluate custom logic functions and small-scale system-on-chip concepts with in-circuit reconfigurability and JTAG access.
- Communications & Peripherals — Buffering, packet parsing or glue logic between chips using available RAM and plentiful I/O pins.
- User Interfaces and Control — Drive custom UI logic, input scanning and control-state machines leveraging the device’s logic resources and I/O flexibility.
Unique Advantages
- Balanced Logic and Memory — 1,728 logic elements paired with 24,576 bits of RAM allow compact implementation of control logic plus embedded buffering without immediate external memory.
- High I/O Count in a Compact Package — 147 user I/Os in a 208-pin BFQFP package support multiple peripherals while fitting standard PCB footprints.
- In-System Reconfigurability — Supports reconfiguration via external configuration device or JTAG, enabling firmware updates and design iteration without board swaps.
- Testability — Integrated IEEE 1149.1 JTAG boundary-scan circuitry simplifies board-level testing and debug during development and manufacturing.
- Regulatory Readiness — RoHS compliance supports deployment in regions and products requiring lead‑free components.
Why Choose EPF10K30EQC208-2X?
The EPF10K30EQC208-2X delivers a practical combination of logic density, embedded RAM and I/O capability in a commercially rated FLEX-10KE FPGA package. Its feature set supports designers who require reconfigurable logic, on-chip memory and board-level testability for commercial embedded products, prototypes and interface bridging functions.
With Intel (Altera) FLEX-10K family design heritage, this part is aimed at teams needing straightforward FPGA integration with clear thermal and supply bounds, RoHS compliance and support for in-system configuration and JTAG-based test flows.
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