EPF10K30EQC208-2N

The EPF10K30EQC208-2N is a FLEX-10KE family FPGA IC designed for mid-range programmable logic integration. It combines a logic array with embedded memory to support System-on-a-Programmable-Chip (SOPC) integration and megafunction implementation for control, glue logic, and embedded memory functions.

This surface-mount device provides 1,728 logic elements, approximately 24,576 bits of on-chip RAM, and 147 user I/O pins in a 208-BFQFP package, making it suited to compact embedded designs that require reconfigurable logic and on-chip memory within a commercial temperature range.

Key Features

• Core architecture FLEX-10K family architecture with separate embedded array and logic array to implement megafunctions (efficient memory and specialized logic) alongside general-purpose logic.
• Logic capacity 1,728 logic elements for implementing custom logic functions and control paths.
• On-chip memory 24,576 total RAM bits of embedded memory to support buffers, FIFOs, and other storage without external RAM.
• I/O and packaging 147 user I/O pins in a 208-BFQFP (208-PQFP, 28×28) surface-mount package to support multiple interfaces and board-level routing requirements.
• Power supply Operates from a 2.375 V to 2.625 V supply range, enabling defined supply planning for system integration.
• Reconfigurability and test In-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan support for programming and board-level test without consuming device logic.
• Clock and arithmetic support Built-in low-skew clock distribution, dedicated carry and cascade chains for high-speed arithmetic and high-fan-in logic.
• Signal control options Programmable output slew-rate control and open-drain/tri-state options for flexible I/O signaling and noise management.
• Temperature and grade Commercial grade operation specified from 0 °C to 70 °C.
• Environmental compliance RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• Embedded systems — Implement control, peripheral bridging, and custom logic in compact embedded devices using on-chip RAM and programmable logic.
• Interface and protocol bridging — Use the available I/O and reconfigurable logic to implement protocol conversion, glue logic, and custom interface timing.
• Prototyping and development — Mid-range logic capacity and JTAG reprogramming support rapid iteration for hardware prototypes and small-volume designs.
• Consumer electronics — Integrate control logic and temporary data storage for consumer applications that operate within commercial temperature limits.

Unique Advantages

• Balanced logic and memory — 1,728 logic elements paired with 24,576 bits of embedded RAM reduce the need for external memory in many designs.
• Wide I/O count in a compact package — 147 user I/Os in a 208-BFQFP footprint simplifies board-level integration for multi-interface designs.
• Reconfigurable for evolving requirements — In-circuit reconfigurability and JTAG support enable field updates and streamlined development cycles.
• Deterministic clocking and arithmetic support — Low-skew clock distribution and dedicated carry/cascade chains improve timing predictability for arithmetic and synchronous logic.
• Commercial-grade, RoHS-compliant — Specified for 0 °C to 70 °C operation and RoHS compliance for mainstream product designs.

Why Choose EPF10K30EQC208-2N?

The EPF10K30EQC208-2N delivers a practical combination of logic resources, embedded memory, and a high I/O count in a compact 208-BFQFP surface-mount package. It is targeted at designers who need mid-range programmable logic for SOPC integration, interface bridging, and embedded control within commercial-temperature applications.

With in-circuit reconfigurability, JTAG boundary-scan, and family-level design support, this FLEX-10KE device offers a reprogrammable platform that simplifies iterative development and integration while keeping board-level BOM and external memory requirements lower.

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