EPF10K30EQC208-1

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP

Quantity 1,564 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K30EQC208-1 – FLEX-10KE® FPGA, 1,728 Logic Elements, 208-BFQFP

The EPF10K30EQC208-1 is a FLEX-10KE family field programmable gate array (FPGA) IC from Intel, offering embedded programmable logic and on-chip memory for system-level integration. With 1,728 logic elements, approximately 24,576 bits of embedded RAM and 147 user I/Os in a 208-pin BFQFP package, this device is suited to embedded logic, I/O interfacing and mid-density custom logic implementations.

Targeted at commercial applications, the device combines reconfigurable logic and embedded memory to support integration of megafunctions, I/O-rich interfaces and system-level functions where compact package and surface-mount mounting are required.

Key Features

  • Core Logic — 1,728 logic elements (LEs) implemented across 216 logic array blocks (LABs) for mid-density programmable logic integration.
  • Embedded Memory — Approximately 0.025 Mbits (24,576 bits) of on-chip RAM to support buffers, FIFOs and small embedded data structures without external memory.
  • I/O Density — 147 user I/O pins enabling a broad range of peripheral and bus interfacing options.
  • Package & Mounting — 208-BFQFP (supplier package listed as 208-PQFP, 28×28) in a surface-mount form factor for PCB space efficiency and standard assembly processes.
  • Power & Temperature — Device supply range specified at 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 70 °C.
  • System Features (FLEX 10K family) — Family-level capabilities include embedded arrays for megafunction implementation, in-circuit reconfigurability via external configuration device or JTAG, and on-chip JTAG boundary-scan (IEEE 1149.1) support for board-level testability.
  • Programmable I/O Controls — Family features include individual tri-state output enable control, open-drain option and programmable output slew-rate control to help manage signal integrity and bus behavior.
  • Compliance — RoHS Compliant; commercial grade device intended for non-automotive applications.

Typical Applications

  • Embedded Control — Custom control logic, protocol handling and glue logic in embedded systems where moderate logic density and on-chip RAM reduce external component count.
  • Interface and I/O Management — GPIO aggregation, bus bridging and peripheral interfacing using the device’s 147 I/Os and programmable I/O features.
  • Prototyping and Development — FPGA prototyping of system functions and megafunctions that benefit from reconfigurability and built-in boundary-scan for development and test.
  • Communications Logic — Implementation of mid-rate packet processing, custom protocol handling or control plane functions that require a balance of logic and embedded RAM.

Unique Advantages

  • Balanced Logic and Memory: 1,728 logic elements paired with approximately 24,576 bits of embedded RAM provide a practical mix of resources for mid-density designs.
  • High I/O Count: 147 user I/Os enable rich peripheral connectivity and reduce the need for external I/O expanders.
  • Reconfigurability and Testability: In-circuit reconfigurability and built-in JTAG boundary-scan simplify field updates and board-level testing.
  • Surface-Mount, Space-Efficient Package: 208-BFQFP (28×28 PQFP style) supports standard PCB assembly while maximizing pin count in a compact footprint.
  • Regulatory and Environmental Compliance: RoHS compliant construction supports lead-free assembly and regulatory requirements for commercial electronics.
  • Commercial Temperature Qualification: Rated for 0 °C to 70 °C, suitable for a wide range of commercial electronic products and development platforms.

Why Choose EPF10K30EQC208-1?

The EPF10K30EQC208-1 positions itself as a practical, mid-density FLEX-10KE FPGA option for designers seeking a balance of logic, embedded memory and I/O in a compact, surface-mount package. Its reconfigurable architecture and family-level system features support megafunction integration and board-level testability, making it appropriate for embedded controllers, interface logic and prototype-to-production designs in commercial environments.

With RoHS compliance and a clear specification set (supply range, pin count, logic elements and on-chip RAM), this part provides a predictable building block for designs that require reprogrammable logic and moderate embedded memory without moving to larger, higher-cost devices.

Request a quote or submit an inquiry to receive pricing and availability for EPF10K30EQC208-1 and to discuss suitability for your design requirements.

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