EPF10K30EQC208-1
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP |
|---|---|
| Quantity | 1,564 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 119000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K30EQC208-1 – FLEX-10KE® FPGA, 1,728 Logic Elements, 208-BFQFP
The EPF10K30EQC208-1 is a FLEX-10KE family field programmable gate array (FPGA) IC from Intel, offering embedded programmable logic and on-chip memory for system-level integration. With 1,728 logic elements, approximately 24,576 bits of embedded RAM and 147 user I/Os in a 208-pin BFQFP package, this device is suited to embedded logic, I/O interfacing and mid-density custom logic implementations.
Targeted at commercial applications, the device combines reconfigurable logic and embedded memory to support integration of megafunctions, I/O-rich interfaces and system-level functions where compact package and surface-mount mounting are required.
Key Features
- Core Logic — 1,728 logic elements (LEs) implemented across 216 logic array blocks (LABs) for mid-density programmable logic integration.
- Embedded Memory — Approximately 0.025 Mbits (24,576 bits) of on-chip RAM to support buffers, FIFOs and small embedded data structures without external memory.
- I/O Density — 147 user I/O pins enabling a broad range of peripheral and bus interfacing options.
- Package & Mounting — 208-BFQFP (supplier package listed as 208-PQFP, 28×28) in a surface-mount form factor for PCB space efficiency and standard assembly processes.
- Power & Temperature — Device supply range specified at 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 70 °C.
- System Features (FLEX 10K family) — Family-level capabilities include embedded arrays for megafunction implementation, in-circuit reconfigurability via external configuration device or JTAG, and on-chip JTAG boundary-scan (IEEE 1149.1) support for board-level testability.
- Programmable I/O Controls — Family features include individual tri-state output enable control, open-drain option and programmable output slew-rate control to help manage signal integrity and bus behavior.
- Compliance — RoHS Compliant; commercial grade device intended for non-automotive applications.
Typical Applications
- Embedded Control — Custom control logic, protocol handling and glue logic in embedded systems where moderate logic density and on-chip RAM reduce external component count.
- Interface and I/O Management — GPIO aggregation, bus bridging and peripheral interfacing using the device’s 147 I/Os and programmable I/O features.
- Prototyping and Development — FPGA prototyping of system functions and megafunctions that benefit from reconfigurability and built-in boundary-scan for development and test.
- Communications Logic — Implementation of mid-rate packet processing, custom protocol handling or control plane functions that require a balance of logic and embedded RAM.
Unique Advantages
- Balanced Logic and Memory: 1,728 logic elements paired with approximately 24,576 bits of embedded RAM provide a practical mix of resources for mid-density designs.
- High I/O Count: 147 user I/Os enable rich peripheral connectivity and reduce the need for external I/O expanders.
- Reconfigurability and Testability: In-circuit reconfigurability and built-in JTAG boundary-scan simplify field updates and board-level testing.
- Surface-Mount, Space-Efficient Package: 208-BFQFP (28×28 PQFP style) supports standard PCB assembly while maximizing pin count in a compact footprint.
- Regulatory and Environmental Compliance: RoHS compliant construction supports lead-free assembly and regulatory requirements for commercial electronics.
- Commercial Temperature Qualification: Rated for 0 °C to 70 °C, suitable for a wide range of commercial electronic products and development platforms.
Why Choose EPF10K30EQC208-1?
The EPF10K30EQC208-1 positions itself as a practical, mid-density FLEX-10KE FPGA option for designers seeking a balance of logic, embedded memory and I/O in a compact, surface-mount package. Its reconfigurable architecture and family-level system features support megafunction integration and board-level testability, making it appropriate for embedded controllers, interface logic and prototype-to-production designs in commercial environments.
With RoHS compliance and a clear specification set (supply range, pin count, logic elements and on-chip RAM), this part provides a predictable building block for designs that require reprogrammable logic and moderate embedded memory without moving to larger, higher-cost devices.
Request a quote or submit an inquiry to receive pricing and availability for EPF10K30EQC208-1 and to discuss suitability for your design requirements.

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