EPF10K30EFI256-3
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 176 24576 1728 256-BGA |
|---|---|
| Quantity | 231 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 119000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K30EFI256-3 – FLEX-10KE FPGA IC, 1,728 logic elements, 24,576 RAM bits, 176 I/O, 256-BGA
The EPF10K30EFI256-3 is an Intel FLEX-10KE embedded programmable logic device (FPGA) offering system-on-a-programmable-chip (SOPC) integration for industrial applications. Built around a dedicated logic array with embedded array blocks, it targets designs that require moderate logic density, on-chip RAM and flexible I/O in a compact surface-mount 256‑BGA package.
With 1,728 logic elements, 24,576 bits of embedded RAM and 176 user I/Os, this device is suited to industrial control, interface bridging and subsystem integration where deterministic I/O, configurable logic and on-board memory are required within a 2.375 V–2.625 V supply envelope and a −40 °C to 85 °C operating range.
Key Features
- Core Logic 1,728 logic elements (LEs) and a maximum system gate count shown as 119,000, providing configurable logic capacity for mid-density FPGA designs.
- Embedded Memory 24,576 total RAM bits and embedded array block (EAB) resources to implement dual-port memories and storage-intensive megafunctions.
- I/O Capability 176 user I/O pins with MultiVolt I/O options described for the FLEX 10KE family, enabling direct interfacing with multiple supply-voltage domains.
- Packaging & Mounting 256‑BGA (256‑FBGA, 17×17) surface-mount package for high-density board integration and reliable solder attachment.
- Power and Voltage Operates with an internal supply in the specified range of 2.375 V to 2.625 V for device core and system integration.
- Industrial Temperature Grade Specified operating temperature from −40 °C to 85 °C suitable for industrial-class deployments.
- System-Level Features Family-level features include in-circuit reconfigurability, JTAG boundary-scan test support, low-skew clock distribution and dedicated carry/cascade chains to accelerate arithmetic and wide-fan-in logic functions.
- Compliance & Environmental RoHS compliant, simplifying regulatory and supply-chain considerations for lead-free manufacturing.
Typical Applications
- Industrial Control Implement custom control logic, deterministic I/O handling and local data buffering using on-chip RAM and logic elements within an industrial temperature range.
- Interface Bridging Use the device’s flexible I/O and embedded memory to create protocol bridges, level translation and signal aggregation between subsystems.
- Embedded Subsystems Integrate megafunctions and small on-chip memories to consolidate peripheral logic and reduce board-level BOM in embedded products.
- PCI-Compatible Designs Leverage family-level PCI Local Bus support for 3.3‑V operation in applications that require bus interfacing or legacy PCI connectivity.
Unique Advantages
- Balanced mid-density resources: Combines 1,728 logic elements and 24,576 RAM bits to support compact logic and memory requirements without overprovisioning.
- Flexible I/O in a compact package: 176 user I/Os in a 256‑BGA footprint enable high pin-count designs in space-constrained boards.
- Industrial-ready thermal range: Specified −40 °C to 85 °C operation for deployment in industrial environments.
- On-board reconfigurability and test support: Built-in JTAG boundary-scan and in-circuit reconfiguration options ease manufacturing test and field updates.
- Regulatory-friendly: RoHS compliance supports lead-free process flows and environmental requirements.
Why Choose EPF10K30EFI256-3?
The EPF10K30EFI256-3 positions itself as a practical FPGA choice for engineers who need mid-range logic capacity, embedded memory and extensive I/O in an industrial-grade package. Its combination of 1,728 logic elements, 24,576 bits of RAM and 176 user I/Os offers a focused balance of performance and integration for embedded subsystems, interface logic and control applications.
Designed for systems where board space, reconfigurability and deterministic interfacing matter, this FLEX‑10KE device benefits from family-level features such as dual-port EABs, clock distribution options and boundary-scan support—providing a clear upgrade path within the FLEX‑10KE family and compatibility with established FPGA development flows.
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