EPF10K30EFI256-3

IC FPGA 176 I/O 256FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 176 24576 1728 256-BGA

Quantity 231 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits24576

Overview of EPF10K30EFI256-3 – FLEX-10KE FPGA IC, 1,728 logic elements, 24,576 RAM bits, 176 I/O, 256-BGA

The EPF10K30EFI256-3 is an Intel FLEX-10KE embedded programmable logic device (FPGA) offering system-on-a-programmable-chip (SOPC) integration for industrial applications. Built around a dedicated logic array with embedded array blocks, it targets designs that require moderate logic density, on-chip RAM and flexible I/O in a compact surface-mount 256‑BGA package.

With 1,728 logic elements, 24,576 bits of embedded RAM and 176 user I/Os, this device is suited to industrial control, interface bridging and subsystem integration where deterministic I/O, configurable logic and on-board memory are required within a 2.375 V–2.625 V supply envelope and a −40 °C to 85 °C operating range.

Key Features

  • Core Logic  1,728 logic elements (LEs) and a maximum system gate count shown as 119,000, providing configurable logic capacity for mid-density FPGA designs.
  • Embedded Memory  24,576 total RAM bits and embedded array block (EAB) resources to implement dual-port memories and storage-intensive megafunctions.
  • I/O Capability  176 user I/O pins with MultiVolt I/O options described for the FLEX 10KE family, enabling direct interfacing with multiple supply-voltage domains.
  • Packaging & Mounting  256‑BGA (256‑FBGA, 17×17) surface-mount package for high-density board integration and reliable solder attachment.
  • Power and Voltage  Operates with an internal supply in the specified range of 2.375 V to 2.625 V for device core and system integration.
  • Industrial Temperature Grade  Specified operating temperature from −40 °C to 85 °C suitable for industrial-class deployments.
  • System-Level Features  Family-level features include in-circuit reconfigurability, JTAG boundary-scan test support, low-skew clock distribution and dedicated carry/cascade chains to accelerate arithmetic and wide-fan-in logic functions.
  • Compliance & Environmental  RoHS compliant, simplifying regulatory and supply-chain considerations for lead-free manufacturing.

Typical Applications

  • Industrial Control  Implement custom control logic, deterministic I/O handling and local data buffering using on-chip RAM and logic elements within an industrial temperature range.
  • Interface Bridging  Use the device’s flexible I/O and embedded memory to create protocol bridges, level translation and signal aggregation between subsystems.
  • Embedded Subsystems  Integrate megafunctions and small on-chip memories to consolidate peripheral logic and reduce board-level BOM in embedded products.
  • PCI-Compatible Designs  Leverage family-level PCI Local Bus support for 3.3‑V operation in applications that require bus interfacing or legacy PCI connectivity.

Unique Advantages

  • Balanced mid-density resources: Combines 1,728 logic elements and 24,576 RAM bits to support compact logic and memory requirements without overprovisioning.
  • Flexible I/O in a compact package: 176 user I/Os in a 256‑BGA footprint enable high pin-count designs in space-constrained boards.
  • Industrial-ready thermal range: Specified −40 °C to 85 °C operation for deployment in industrial environments.
  • On-board reconfigurability and test support: Built-in JTAG boundary-scan and in-circuit reconfiguration options ease manufacturing test and field updates.
  • Regulatory-friendly: RoHS compliance supports lead-free process flows and environmental requirements.

Why Choose EPF10K30EFI256-3?

The EPF10K30EFI256-3 positions itself as a practical FPGA choice for engineers who need mid-range logic capacity, embedded memory and extensive I/O in an industrial-grade package. Its combination of 1,728 logic elements, 24,576 bits of RAM and 176 user I/Os offers a focused balance of performance and integration for embedded subsystems, interface logic and control applications.

Designed for systems where board space, reconfigurability and deterministic interfacing matter, this FLEX‑10KE device benefits from family-level features such as dual-port EABs, clock distribution options and boundary-scan support—providing a clear upgrade path within the FLEX‑10KE family and compatibility with established FPGA development flows.

Request a quote or submit a purchase inquiry to check availability, lead time and volume pricing for the EPF10K30EFI256-3.

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