EPF10K30EFC484-2X

The EPF10K30EFC484-2X is a FLEX 10K family FPGA from Intel, delivered in a 484-ball BGA surface-mount package. It provides embedded programmable logic resources and on-chip memory suitable for system-level integration and custom logic implementations in commercial-grade applications.

This device combines 1,728 logic elements with 24,576 bits of embedded RAM, 220 user I/O pins, and a compact 484-FBGA (23 × 23) footprint, enabling designers to implement moderate-density logic, memory and I/O functions within a single programmable device.

Key Features

• Logic Capacity — 1,728 logic elements distributed across 216 logic array blocks, enabling implementation of custom combinational and sequential logic.
• Embedded Memory — 24,576 bits of on-chip RAM for data buffering, small lookup tables, and temporary storage without external memory.
• I/O — 220 user I/O pins for flexible interfacing to peripherals, sensors, and external logic.
• Package & Mounting — 484-BBGA / 484-FBGA (23×23) fine-pitch BGA in a surface-mount form factor for board-space efficient placement.
• Power Supply — Operates from a supply range of 2.375 V to 2.625 V as specified for this device.
• Operating Range — Commercial-grade device rated for 0 °C to 70 °C ambient operation.
• Design-for-Test — Series-level support for JTAG boundary-scan test (IEEE 1149.1) is included in the FLEX 10K family.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Control & Glue Logic — Implement custom control functions and protocol conversion between on-board subsystems using the device’s logic elements and I/O resources.
• Interface Bridging — Use the 220 I/O pins to connect and adapt multiple peripheral interfaces or aggregate signals for downstream processors.
• On-board Memory Acceleration — Leverage the 24,576 bits of embedded RAM for small FIFO buffers, lookup tables, and temporary data storage to reduce external memory requirements.
• Prototyping and System Integration — Suitable for commercial development platforms where reprogrammable logic is required for system-level validation and iteration.

Unique Advantages

• Balanced Logic and Memory — 1,728 logic elements paired with 24,576 bits of embedded RAM provide a practical balance for mid-density designs that require both logic and local storage.
• High I/O Count — 220 user I/O pins allow direct connection to numerous peripherals and signals, reducing the need for external GPIO expanders.
• Compact BGA Package — The 484-FBGA (23×23) package delivers a high-pin-count solution in a board-area efficient form factor for space-constrained designs.
• Commercial Temperature Rating — Specified operation from 0 °C to 70 °C meets the requirements of standard commercial applications and environments.
• RoHS Compliance — Meets RoHS requirements for lead-free assembly processes and regulatory conformity.

Why Choose EPF10K30EFC484-2X?

EPF10K30EFC484-2X positions itself as a mid-density FLEX 10K FPGA option that combines a practical complement of logic elements, on-chip RAM, and a high I/O count in a compact BGA package. Its commercial temperature rating and RoHS compliance make it a suitable choice for mainstream embedded designs where board space, I/O flexibility, and reprogrammability are important.

This device is well suited to designers and development teams implementing board-level logic consolidation, interface bridging, or prototype systems that benefit from reconfigurable hardware and modest embedded memory resources. The FLEX 10K family-level features such as JTAG boundary-scan and embedded array support further support system-level integration and testability.

If you would like pricing, availability, or to request a quote for EPF10K30EFC484-2X, please submit a quote request or contact sales to obtain further purchasing information and lead-time details.