EPF10K30EFC484-2

The EPF10K30EFC484-2 is a FLEX 10K family FPGA from Intel, delivered in a 484-ball BGA package with surface-mount mounting. It combines 1,728 logic elements with 24,576 bits of on-chip RAM and 220 user I/O pins to address medium-density programmable-logic requirements.

Built on the FLEX 10K embedded programmable logic device architecture, this device targets system-on-a-programmable-chip (SOPC) integration and embedded logic functions, offering on-chip memory and logic resources suitable for interface bridging, custom control logic, and embedded-function integration in commercial applications.

Key Features

• Logic Capacity — 1,728 logic elements and 119,000 gates provide a medium-density programmable fabric for custom logic implementation.
• Embedded Memory — 24,576 total RAM bits of embedded memory to support on-chip data buffering and storage for megafunctions and custom state machines.
• I/O Density — 220 user I/O pins to support multiple external interfaces and parallel connections.
• Package & Mounting — 484-BBGA (supplier package: 484-FBGA, 23×23) in a surface-mount format for compact board integration.
• Power — Core supply voltage specified at 2.375 V to 2.625 V.
• Commercial Temperature Grade — Rated for 0 °C to 70 °C operation for commercial applications.
• Standards and Family-Level Features — As a member of the FLEX 10K family, the device benefits from family capabilities such as embedded arrays for megafunctions, MultiVolt I/O interface support, JTAG boundary-scan, dedicated carry and cascade chains, and low-skew clock distribution (as described in the FLEX 10K family data sheet).
• Compliance — RoHS compliant.

Typical Applications

• Embedded Systems — Implement on-chip controllers, custom state machines, and SOPC integration using available logic elements and embedded RAM.
• Interface Bridging — Provide protocol adaptation and parallel/serial interface glue logic using abundant I/O and programmable logic.
• Prototyping and Development — Medium-density FPGA resource for validating designs and integrating megafunctions before final system deployment.
• Custom Logic Acceleration — Offload deterministic or parallel tasks to programmable logic blocks and on-chip RAM for responsive control and data handling.

Unique Advantages

• Balanced Integration: Combines 1,728 logic elements with 24,576 bits of embedded RAM to consolidate logic and memory on a single device, reducing external component count.
• High I/O Count: 220 user I/O pins enable flexible connectivity to peripherals, sensors, and host interfaces without immediate need for external multiplexing.
• Compact Package: 484-ball BGA (23×23) provides a space-efficient footprint for board-level integration while supporting high pin density.
• Commercial-Grade Thermal Range: Rated for 0 °C to 70 °C operation to match commercial electronic product requirements.
• Family-Level Ecosystem: Leverages FLEX 10K family architecture and associated design flows for megafunctions, JTAG configuration, and clock distribution options described in the family data sheet.
• Regulatory Compliance: RoHS compliance supports environmental and assembly requirements for commercial products.

Why Choose EPF10K30EFC484-2?

The EPF10K30EFC484-2 positions itself as a medium-density FLEX 10K FPGA solution for designers who need a blend of logic, embedded RAM, and plentiful I/O in a compact BGA package. With 1,728 logic elements, 24,576 bits of on-chip memory, and 220 user I/Os, it is well suited to commercial embedded applications, interface bridging, and system integration tasks that benefit from programmable logic and integrated memory.

Choosing this device provides access to the FLEX 10K family feature set described in the data sheet—support for embedded megafunctions, family-level I/O and clocking capabilities, and JTAG boundary-scan—backed by Intel’s FLEX 10K architecture and a RoHS-compliant manufacturing pedigree.

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