EPF10K30EFI484-3
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 220 24576 1728 484-BBGA |
|---|---|
| Quantity | 1,022 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 220 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 119000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K30EFI484-3 – FLEX-10KE Field Programmable Gate Array, 1,728 logic elements, 220 I/O
The EPF10K30EFI484-3 is a FLEX-10KE FPGA optimized for system-level integration and in-field reconfigurability. Built around an embedded array architecture with dedicated logic resources and on-chip RAM, it targets industrial and embedded designs that require flexible I/O, embedded memory, and reprogrammable logic.
With 1,728 logic elements, 24,576 bits of embedded RAM and support for up to 220 user I/O pins, this device is suited for applications that need mid-range logic density, multi-voltage I/O interfacing, and robust packaging for surface-mount assembly.
Key Features
- Core Logic 1,728 logic elements and typical device architecture derived from the FLEX 10KE family providing up to 119,000 maximum system gates for mid-range programmable logic designs.
- Embedded Memory (EABs) Total RAM: 24,576 bits with embedded array blocks (EABs) and dual-port capability supporting up to 16-bit width per EAB for efficient on-chip storage and megafunction implementation.
- I/O Flexibility 220 user I/O pins with MultiVolt I/O capability (drive/receive 2.5 V, 3.3 V or 5.0 V devices) and per-pin features such as programmable slew-rate control, open-drain option, clamp-to-VCCIO selection, and pull-up during configuration.
- Configuration & Test In-circuit reconfigurability via external configuration devices and JTAG boundary-scan support for device programming and board-level test without consuming additional user logic.
- Clocking & Performance Built-in low-skew clock distribution, up to six global clock signals, and options such as ClockLock™/ClockBoost™ to manage clock delay and skew.
- Dedicated Arithmetic & Routing Dedicated carry and cascade chains plus FastTrack® continuous routing for deterministic interconnect delays and efficient implementation of adders, counters and high-fan-in functions.
- Power & Supply Operates with a nominal internal supply in the 2.375 V to 2.625 V range, designed for low-power operation within that supply envelope.
- Package & Environmental Surface-mount 484-BBGA package (supplier package: 484-FBGA, 23 × 23 mm) and industrial operating temperature range of −40 °C to 85 °C. RoHS compliant.
Typical Applications
- System-on-a-Programmable-Chip (SOPC) Integrate memory, custom logic and peripheral functions into a single, reconfigurable device for compact embedded systems.
- Industrial Control & Automation Mid-density logic and robust temperature rating make the device suitable for industrial controllers, I/O aggregation and protocol bridging.
- Embedded Memory Functions Use embedded array blocks for dual-ported buffers, small on-chip data stores, and megafunctions that reduce external memory requirements.
- High-Performance I/O Interfaces Multi-voltage I/O and programmable pin features simplify interfacing to mixed-voltage peripherals and legacy buses.
Unique Advantages
- Integrated memory and logic: Embedded RAM and six EABs provide on-chip storage for megafunctions, reducing external component count.
- Flexible I/O strategy: 220 user I/O pins with MultiVolt support and per-pin configuration options streamline mixed-voltage board designs.
- Field reprogrammability: In-circuit reconfigurability and JTAG enable updates and board-level testing without redesigning hardware.
- Deterministic routing and arithmetic support: FastTrack routing plus dedicated carry/cascade chains speed implementation of arithmetic and high-fan-in logic.
- Industrial readiness: Surface-mount BBGA packaging and −40 °C to 85 °C operating range support deployment in industrial applications.
Why Choose EPF10K30EFI484-3?
The EPF10K30EFI484-3 combines mid-range logic density with embedded RAM and extensive I/O flexibility, making it a practical choice for engineers building reconfigurable embedded systems and industrial controllers. Its support for in-circuit reconfiguration and JTAG-based testability simplifies firmware updates and board validation.
Designed for engineers who need a balance of integration, configurable I/O and industrial temperature performance, this FLEX-10KE device delivers scalable functionality within a compact 484-BBGA footprint and a proven family feature set.
Request a quote or submit an inquiry to check pricing and availability for EPF10K30EFI484-3 and to discuss how this device can fit into your next design.

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