EPF10K30EFI484-3

IC FPGA 220 I/O 484FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 220 24576 1728 484-BBGA

Quantity 1,022 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BBGANumber of I/O220Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits24576

Overview of EPF10K30EFI484-3 – FLEX-10KE Field Programmable Gate Array, 1,728 logic elements, 220 I/O

The EPF10K30EFI484-3 is a FLEX-10KE FPGA optimized for system-level integration and in-field reconfigurability. Built around an embedded array architecture with dedicated logic resources and on-chip RAM, it targets industrial and embedded designs that require flexible I/O, embedded memory, and reprogrammable logic.

With 1,728 logic elements, 24,576 bits of embedded RAM and support for up to 220 user I/O pins, this device is suited for applications that need mid-range logic density, multi-voltage I/O interfacing, and robust packaging for surface-mount assembly.

Key Features

  • Core Logic  1,728 logic elements and typical device architecture derived from the FLEX 10KE family providing up to 119,000 maximum system gates for mid-range programmable logic designs.
  • Embedded Memory (EABs)  Total RAM: 24,576 bits with embedded array blocks (EABs) and dual-port capability supporting up to 16-bit width per EAB for efficient on-chip storage and megafunction implementation.
  • I/O Flexibility  220 user I/O pins with MultiVolt I/O capability (drive/receive 2.5 V, 3.3 V or 5.0 V devices) and per-pin features such as programmable slew-rate control, open-drain option, clamp-to-VCCIO selection, and pull-up during configuration.
  • Configuration & Test  In-circuit reconfigurability via external configuration devices and JTAG boundary-scan support for device programming and board-level test without consuming additional user logic.
  • Clocking & Performance  Built-in low-skew clock distribution, up to six global clock signals, and options such as ClockLock™/ClockBoost™ to manage clock delay and skew.
  • Dedicated Arithmetic & Routing  Dedicated carry and cascade chains plus FastTrack® continuous routing for deterministic interconnect delays and efficient implementation of adders, counters and high-fan-in functions.
  • Power & Supply  Operates with a nominal internal supply in the 2.375 V to 2.625 V range, designed for low-power operation within that supply envelope.
  • Package & Environmental  Surface-mount 484-BBGA package (supplier package: 484-FBGA, 23 × 23 mm) and industrial operating temperature range of −40 °C to 85 °C. RoHS compliant.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC)  Integrate memory, custom logic and peripheral functions into a single, reconfigurable device for compact embedded systems.
  • Industrial Control & Automation  Mid-density logic and robust temperature rating make the device suitable for industrial controllers, I/O aggregation and protocol bridging.
  • Embedded Memory Functions  Use embedded array blocks for dual-ported buffers, small on-chip data stores, and megafunctions that reduce external memory requirements.
  • High-Performance I/O Interfaces  Multi-voltage I/O and programmable pin features simplify interfacing to mixed-voltage peripherals and legacy buses.

Unique Advantages

  • Integrated memory and logic: Embedded RAM and six EABs provide on-chip storage for megafunctions, reducing external component count.
  • Flexible I/O strategy: 220 user I/O pins with MultiVolt support and per-pin configuration options streamline mixed-voltage board designs.
  • Field reprogrammability: In-circuit reconfigurability and JTAG enable updates and board-level testing without redesigning hardware.
  • Deterministic routing and arithmetic support: FastTrack routing plus dedicated carry/cascade chains speed implementation of arithmetic and high-fan-in logic.
  • Industrial readiness: Surface-mount BBGA packaging and −40 °C to 85 °C operating range support deployment in industrial applications.

Why Choose EPF10K30EFI484-3?

The EPF10K30EFI484-3 combines mid-range logic density with embedded RAM and extensive I/O flexibility, making it a practical choice for engineers building reconfigurable embedded systems and industrial controllers. Its support for in-circuit reconfiguration and JTAG-based testability simplifies firmware updates and board validation.

Designed for engineers who need a balance of integration, configurable I/O and industrial temperature performance, this FLEX-10KE device delivers scalable functionality within a compact 484-BBGA footprint and a proven family feature set.

Request a quote or submit an inquiry to check pricing and availability for EPF10K30EFI484-3 and to discuss how this device can fit into your next design.

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