EPF10K30EQC208-1X

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP

Quantity 131 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K30EQC208-1X – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP

The EPF10K30EQC208-1X is a FLEX-10KE family field programmable gate array (FPGA) designed for system-level integration of programmable logic and embedded memory. As part of the FLEX 10K embedded programmable logic device family, it combines a dedicated logic array and embedded array resources to implement megafunctions and general-purpose logic for mid-density FPGA applications.

Targeted at commercial embedded designs, this device provides 1,728 logic elements, 24,576 bits of on-chip RAM, and 147 user I/O pins in a 208-BFQFP surface-mount package, enabling compact, reconfigurable implementations of custom logic, memory functions, and I/O bridging.

Key Features

  • Logic Capacity: 1,728 logic elements and 216 LABs for implementing medium-complexity logic functions and state machines.
  • Embedded Memory: 24,576 total RAM bits of embedded memory to support on-chip buffers, FIFOs, and small data stores.
  • I/O Count: 147 user I/O pins to support multiple external interfaces and peripheral connections.
  • Gate Equivalent: Approximately 119,000 gates for combining logic and memory resources in system designs.
  • Supply and Operating Range: Core voltage supply 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 70 °C.
  • Package and Mounting: 208-BFQFP (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for compact board integration.
  • In-System Reconfigurability: Family-level support for in-circuit reconfigurability and on-chip JTAG boundary-scan (as described in the FLEX 10K family datasheet) to simplify programming and test without using device logic.
  • Architecture-Level Features: FLEX 10K family capabilities such as embedded arrays for megafunctions, dedicated carry and cascade chains, and low-skew clock distribution to support arithmetic, high-fan-in logic, and predictable timing.
  • Commercial Grade: Designed for commercial applications where standard temperature and supply conditions apply.

Typical Applications

  • Embedded System Integration: Implement custom control logic and on-chip memory for compact system-on-a-programmable-chip (SOPC) designs.
  • Interface Bridging: Use available I/O and logic resources to bridge peripherals and implement protocol converters or glue logic between subsystems.
  • Prototyping and Development: Rapidly iterate hardware functions and validate algorithms in a reconfigurable device with in-system programmability and JTAG support.
  • Custom Logic Acceleration: Offload targeted processing tasks or implement specialized finite-state controllers using the dedicated carry/cascade resources and embedded RAM.

Unique Advantages

  • Balanced Logic and Memory: 1,728 logic elements paired with 24,576 RAM bits provide a balanced resource mix for designs that need both logic density and on-chip storage.
  • High I/O Count in a Compact Package: 147 user I/Os in a 208-pin BFQFP enable multiple peripheral connections while preserving PCB space.
  • Reconfigurable In-System: Family support for in-circuit reconfigurability and JTAG boundary-scan simplifies development, debug, and field updates without consuming user logic.
  • Predictable Architecture: Dedicated carry and cascade chains and low-skew clock distribution (family features) help achieve consistent timing for arithmetic and high-fan-in functions.
  • Commercial Suitability: Specified commercial temperature range (0 °C to 70 °C) and surface-mount 208-BFQFP packaging make the device suitable for consumer and general embedded product designs.
  • Vendor Toolchain Support: The FLEX 10K family is supported by Altera development systems for design entry, place-and-route, and simulation (as documented in the family datasheet), enabling established tool flows.

Why Choose EPF10K30EQC208-1X?

The EPF10K30EQC208-1X positions itself as a flexible, mid-density FPGA option within the FLEX 10K family, combining 1,728 logic elements, substantial embedded RAM, and abundant I/O in a compact 208-BFQFP package. It is well suited to designers who need reconfigurable logic and on-chip memory for embedded control, interface logic, and prototype systems under commercial operating conditions.

Backed by FLEX 10K family architecture and tool support documented in the datasheet, this device offers a pragmatic balance of integration, reconfigurability, and established design flows for teams building reliable, updatable embedded solutions.

Request a quote or submit an inquiry to receive pricing, availability, and further technical assistance for EPF10K30EQC208-1X.

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