EPF10K30EQI208-2
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP |
|---|---|
| Quantity | 1,925 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 119000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K30EQI208-2 – FLEX-10KE FPGA, 1,728 Logic Elements, 24,576 RAM bits, 147 I/O, 208-BFQFP
The EPF10K30EQI208-2 is a FLEX-10KE family field programmable gate array (FPGA) from Intel designed for medium-density embedded logic tasks. It integrates 1,728 logic elements and approximately 24,576 bits of embedded RAM to implement custom logic, buffering, and control functions for industrial and embedded applications.
With 147 user I/O pins, support for in-system configuration options from the FLEX 10K family, and a compact 208-pin BFQFP package, this device targets designs that require moderate logic capacity, on-chip memory, and robust operating conditions.
Key Features
- Logic Capacity 1,728 logic elements distributed across 216 logic array blocks (LABs) to implement combinational and sequential logic functions.
- On-chip Memory Approximately 24,576 bits of embedded RAM for FIFOs, small buffers, and register storage without consuming general logic resources.
- I/O and System Gates 147 user I/O pins and approximately 119,000 typical gates providing flexible interfacing and substantial system logic density.
- Package and Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28×28) with surface-mount mounting type for standard PCB assembly.
- Power Device supply specified at 2.375 V to 2.625 V, enabling defined core power planning in system designs.
- Operating Range Industrial-grade operating temperature range of −40 °C to 85 °C for reliable operation in extended-temperature environments.
- RoHS Compliance RoHS compliant for restriction of hazardous substances in manufacturing and procurement.
- Series-Level Capabilities As part of the FLEX 10K family, the device benefits from series features such as JTAG boundary-scan support, embedded array blocks for efficient memory and specialized functions, and flexible interconnect structures (series-level descriptions).
Typical Applications
- Embedded Control Custom control logic and glue functions where medium-density programmable logic and on-chip RAM simplify board-level design.
- Interface Bridging Protocol conversion and peripheral interfacing using the device’s 147 I/O pins and reconfigurable logic resources.
- Prototyping and Development Hardware prototyping and proof-of-concept implementations that require reprogrammability and in-system configuration options available in the FLEX 10K family.
- Industrial Electronics Control and monitoring modules operating across a −40 °C to 85 °C temperature range where consistent behavior and device robustness are needed.
Unique Advantages
- Balanced Logic and Memory: 1,728 logic elements combined with ~24,576 bits of embedded RAM enable compact implementations of state machines, buffers, and data-path logic without extensive external RAM.
- High I/O Count: 147 user I/Os allow direct connection to multiple peripherals and interfaces, reducing the need for external interface components.
- Industrial Temperature Rating: Guaranteed operation from −40 °C to 85 °C supports deployment in temperature-variable environments.
- Compact, Surface-Mount Package: 208-BFQFP (208-PQFP, 28×28) provides a space-efficient footprint for PCB designs and standard surface-mount assembly.
- RoHS Compliant: Meets environmental sourcing requirements for regulated substances.
- Series-Level System Features: Access to FLEX 10K family capabilities such as JTAG boundary-scan and embedded array blocks for megafunction implementation supports system integration and testability.
Why Choose EPF10K30EQI208-2?
The EPF10K30EQI208-2 positions itself as a practical, mid-range FPGA option for designs requiring a balance of logic resources, embedded memory, and a substantial number of I/Os in a conventional PQFP footprint. Its industrial temperature range and RoHS compliance make it suitable for long-lived embedded applications and production environments where reliability and regulatory compliance matter.
Designers seeking a reprogrammable, medium-density device backed by the FLEX 10K family capabilities will find this part appropriate for control logic, interface bridging, and prototyping projects that benefit from integrated RAM and flexible I/O.
If you would like pricing, availability, or to request a formal quote for the EPF10K30EQI208-2, submit a product inquiry or request a quote from your preferred distributor or procurement channel.

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