EPF10K30ETC144-1

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 102 24576 1728 144-LQFP

Quantity 481 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K30ETC144-1 – FLEX-10KE® Field Programmable Gate Array (FPGA) IC, 1,728 Logic Elements, 24,576-bit RAM, 144-LQFP

The EPF10K30ETC144-1 is a FLEX 10K family FPGA from Intel designed for embedded programmable-logic applications. It combines general-purpose logic with on-chip embedded memory to support system-on-a-programmable-chip (SOPC) integration and megafunction implementation.

With 1,728 logic elements, 24,576 bits of embedded RAM and 102 user I/O pins in a 144-LQFP surface-mount package, this device targets embedded designs that require moderate logic density, dedicated I/O and reconfigurable functionality within a commercial temperature range.

Key Features

  • Logic Capacity — 1,728 logic elements provide the core programmable resources for implementing custom logic, state machines and glue logic.
  • On-chip Memory — Approximately 24,576 bits of embedded RAM support buffers, FIFOs and small data stores without external memory.
  • I/O — 102 user I/O pins enable flexible interfacing to peripherals, sensors and external logic in a compact package.
  • Family System Features — FLEX 10K family capabilities include built-in JTAG boundary-scan test circuitry, FastTrack interconnect for predictable routing delays, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and low-skew global clock resources.
  • Configuration and Clock Options — In-circuit reconfigurability via external configuration devices or the JTAG port, plus ClockLock/ClockBoost options for reduced clock skew and clock multiplication (family-level features).
  • Power and Compliance — Device supply range listed as 2.375 V to 2.625 V for this part; the product is RoHS compliant.
  • Package and Mounting — 144-LQFP surface-mount package provides a compact footprint for board-level integration (commercial grade).
  • Operating Range — Rated for commercial operation from 0 °C to 70 °C.

Typical Applications

  • Embedded Control — Implement control logic, state machines and interface bridging for embedded products using the device's logic elements and on-chip RAM.
  • Prototyping and Development — Rapidly evaluate and iterate digital designs with in-circuit reconfigurability and JTAG access for debug and boundary-scan testing.
  • Peripheral and Interface Glue — Use the available I/O and dedicated arithmetic/cascade chains to implement protocol adaptation, bus interfacing and peripheral control.
  • Memory-Accelerated Functions — Leverage the embedded RAM to implement FIFOs, buffers and small data structures for real-time data handling.

Unique Advantages

  • Balanced Logic and Memory: Combines 1,728 logic elements with approximately 24,576 bits of embedded RAM to implement mixed logic-plus-memory functions without immediate external memory.
  • Compact I/O Count in Small Package: 102 user I/O pins in a 144-LQFP package enable rich connectivity while preserving PCB area.
  • Built-in Test and Reconfiguration: Integrated JTAG boundary-scan support simplifies board test and in-system reprogramming without consuming device logic.
  • Dedicated Arithmetic and Routing Support: Carry and cascade chain resources plus FastTrack interconnect facilitate efficient implementation of adders, counters and high-fan-in logic with predictable routing delays.
  • Commercial Temperature and RoHS Compliance: Commercial-grade rating (0 °C to 70 °C) and RoHS compliance support standard embedded product lifecycles and regulatory requirements.

Why Choose EPF10K30ETC144-1?

The EPF10K30ETC144-1 is positioned for designers needing a reconfigurable, moderately dense FPGA with embedded RAM and ample I/O in a compact surface-mount package. Its combination of logic elements, on-chip memory and family-level system features—such as JTAG support, dedicated arithmetic chains and predictable interconnect—make it suitable for embedded control, interface logic and prototyping applications within the commercial temperature range.

For teams focused on integrating megafunctions and accelerating time-to-market, this FLEX 10K device offers reprogrammability, testability and a balance of resources to support scalable designs while maintaining board-level efficiency and regulatory compliance.

Request a quote or submit an inquiry for EPF10K30ETC144-1 to receive pricing and availability information for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up