EPF10K30ETC144-2N

The EPF10K30ETC144-2N is a commercial-grade FPGA from Intel's FLEX 10K family designed for embedded programmable logic and system-level integration. It combines a logic array with embedded memory to implement custom logic, megafunctions, and on-chip buffering within a compact 144‑lead LQFP surface-mount package.

This device targets applications that require moderate logic density with on-chip RAM and flexible I/O, offering 1,728 logic elements, 216 LABs, 24,576 bits of embedded memory, and 102 user I/Os. It is RoHS compliant and specified for operation from 0 °C to 70 °C with a supply voltage range of 2.375 V to 2.625 V.

Key Features

• Core Logic 1,728 logic elements organized across 216 LABs to implement combinational and sequential logic for custom functions.
• On‑chip Memory 24,576 bits of embedded RAM for local buffering, state storage, and use by megafunctions.
• I/O Capacity 102 user I/O pins to support multi‑signal interfaces and board-level connectivity in a single device.
• Gate Count 119,000 gates reported for estimating system-level gate equivalence and partitioning logic across the design.
• Package & Mounting 144‑lead LQFP (supplier package 144‑TQFP, 20×20) in a surface‑mount package for conventional PCB assembly.
• Power & Supply Specified supply voltage range of 2.375 V to 2.625 V to match target system rail requirements.
• Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
• Family-Level System Features FLEX 10K family architecture supports embedded programmability, in‑circuit reconfigurability options (including JTAG), and system-focused integration features documented at the family level.

Typical Applications

• SOPC and Embedded Systems Use the on-chip memory and logic array to integrate custom megafunctions and implement system-on-a-programmable-chip designs.
• Interface and Glue Logic Deploy as a flexible bridge or glue device to consolidate multiple interfaces and protocol adapting using the device’s 102 I/Os.
• Local Buffering and Data Handling Leverage 24,576 bits of embedded RAM for FIFOs, small buffers, and state storage close to logic blocks.
• Prototyping and Moderate-Density Designs Suitable for development boards and production designs that require moderate logic capacity with programmable reconfiguration.

Unique Advantages

• Balanced Logic and Memory 1,728 logic elements paired with 24,576 bits of embedded RAM provide a practical balance for designs needing both logic density and on-chip storage.
• Ample I/O for Integration 102 user I/Os enable consolidation of multiple signals and simplify board-level routing for compact designs.
• Compact, Surface‑Mount Packaging 144‑lead LQFP (20×20 TQFP footprint) supports high‑density PCB layouts while remaining compatible with standard SMT assembly.
• Commercial Temperature and RoHS Compliance Commercial operating range (0 °C to 70 °C) and RoHS compliance support mainstream electronics manufacturing and regulatory requirements.
• Family-Level Reconfigurability FLEX 10K family features include in-circuit reconfigurability and JTAG boundary-scan options, enabling flexible development and test strategies.

Why Choose EPF10K30ETC144-2N?

The EPF10K30ETC144-2N offers a practical combination of logic, embedded memory, and I/O suitable for embedded and system-integration tasks. Its FLEX 10K family architecture provides the programmability and system-level features needed to implement megafunctions and custom logic without adding discrete memory or glue components.

This commercial-grade, RoHS-compliant FPGA in a 144‑lead LQFP package is well suited for designs that require mid-range logic capacity, local RAM resources, and a flexible I/O count while maintaining standard PCB assembly practices and supply-voltage compatibility with the specified 2.375 V to 2.625 V range.

If you would like pricing, lead time, or a formal quote for EPF10K30ETC144-2N, request a quote or submit an RFQ and our team will respond with the information you need.