EPF10K30ETC144-3

The EPF10K30ETC144-3 is a FLEX-10KE family FPGA from Intel, delivered in a 144-pin LQFP/TQFP surface-mount package. It provides a balance of logic density, on-chip RAM, and I/O count for commercial embedded designs that require reconfigurable logic and system-level integration.

As a member of the FLEX 10K family, this device supports family-level features such as embedded arrays for megafunctions and standard boundary-scan test capability, enabling board-level integration and in-system configurability for a range of commercial applications.

Key Features

• Logic Capacity — 1,728 logic elements delivered for implementing custom combinational and sequential logic.
• On‑Chip Memory — 24,576 total RAM bits for embedded data storage and buffering without external RAM.
• I/O Resources — 102 user I/O pins to interface with peripherals, sensors, and external buses in a compact package.
• Gate Count — 119,000 gates available for system logic and megafunction implementation.
• Supply Voltage — Specified 2.375 V to 2.625 V supply range.
• Package & Mounting — 144‑pin LQFP package; supplier device package listed as 144‑TQFP (20×20); surface mount type for standard PCB assembly.
• Operating Range & Grade — Commercial-grade device with an operating temperature range of 0 °C to 70 °C.
• Standards & Test Support — FLEX 10K family devices include IEEE‑1149.1 JTAG boundary-scan test support for board-level test and in-system programming.
• RoHS Compliant — Meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Embedded control and logic: Implement custom state machines, control logic, and glue logic in commercial embedded products that benefit from reconfigurable hardware.
• Interface bridging and bus logic: Use the device’s I/O and programmable logic to implement protocol bridges, bus adapters, and peripheral interfaces.
• Prototyping and product development: Rapidly validate hardware functions and iterate designs using the FLEX 10K family’s reconfigurability and on-chip resources.
• Memory‑assisted functions: Leverage the device’s embedded RAM for buffering, small lookup tables, and temporary data storage within system logic.

Unique Advantages

• Balanced logic and memory: Combines 1,728 logic elements with 24,576 bits of on-chip RAM to implement both control logic and local data storage without immediate reliance on external memory.
• Compact package with ample I/O: 144‑pin surface-mount LQFP/TQFP package provides a practical footprint while offering 102 user I/O pins for system connectivity.
• Commercial temperature suitability: Rated 0 °C to 70 °C for commercial deployments where standard ambient conditions apply.
• In-system test and configuration: Family-level JTAG boundary-scan support enables board testability and in-circuit programming workflows.
• Regulatory-friendly manufacturing: RoHS compliance supports lead‑free assembly processes and environmental requirements.

Why Choose EPF10K30ETC144-3?

The EPF10K30ETC144-3 delivers a practical mix of programmable logic, embedded memory, and I/O in a compact commercial-grade package. It suits designers who need moderate logic density and on-chip RAM for embedded control, interface logic, and prototype platforms while maintaining standard surface-mount manufacturability.

Backed by the FLEX 10K family features such as boundary-scan test and embedded-array megafunction support, this part offers a path for system-level integration and iterative development with predictable board-level test and configuration options.

Request a quote or submit a pricing inquiry to check availability, lead time, and quantity pricing for EPF10K30ETC144-3.