EPF10K30RC208-3N

The EPF10K30RC208-3N is an Intel FLEX 10K embedded programmable logic device offering a balanced mix of logic, embedded memory and I/O for system-level integration. As a FLEX 10K family device, it provides an embedded array for megafunctions alongside a general-purpose logic array to enable System-on-a-Programmable-Chip (SOPC) integration and custom logic implementations.

With 1,728 logic elements, approximately 12,288 bits of embedded RAM, support for in-circuit reconfigurability and on-chip test via JTAG, this device targets designs that require moderate logic density, on-chip memory, and flexible I/O in a 208-BFQFP exposed-pad surface-mount package.

Key Features

• Logic Capacity — 1,728 logic elements provide the programmable logic resources needed for glue logic, control functions and medium-complexity programmable designs.
• Embedded Memory — Approximately 12,288 bits of on-chip RAM (embedded array blocks) for FIFOs, buffers and small data storage without consuming general logic resources.
• I/O Count & Voltage — Up to 147 user I/Os and a specified voltage supply range of 4.75 V to 5.25 V to support 5.0-V system domains.
• System Integration — Built-in JTAG boundary-scan for in-system test and support for in-circuit reconfigurability via external configuration devices, intelligent controllers or JTAG.
• Clock & Interconnect — Features from the FLEX 10K family such as low-skew clock distribution, ClockLock/ClockBoost options, and the FastTrack interconnect architecture to support predictable routing and clocking strategies.
• Dedicated Arithmetic Chains — Dedicated carry and cascade chains for efficient implementation of adders, counters and high fan-in logic functions.
• Programmable I/O Behavior — Per-pin tri-state control, open-drain option and programmable output slew-rate control to help manage signal integrity and interface requirements.
• Package & Mounting — 208-BFQFP with exposed pad (supplier package: 208-RQFP 28×28) in a surface-mount form factor for board-level integration.
• Commercial Grade & Environmental — Rated for 0 °C to 70 °C operating temperature and RoHS compliant.
• Logic Density Indicator — Typical/maximum system gate count consistent with the FLEX 10K family (product listing indicates 69,000 gates for this device class).

Typical Applications

• Embedded Control & Glue Logic — Implement custom control paths, protocol bridging and board-level glue logic using the device’s logic elements and flexible I/O.
• On-chip Data Buffers & FIFOs — Use the embedded RAM blocks to build small FIFOs, frame buffers or temporary data storage without external SRAM.
• Prototyping & System Integration — Rapidly prototype SOPC-style functions and megafunctions that combine memory and logic on a single programmable device.
• Interface & Timing Functions — Implement clock distribution, bus interface glue and timing-critical arithmetic using dedicated carry/cascade chains and low-skew clock trees.

Unique Advantages

• Integrated Memory and Logic: Approximately 12,288 bits of embedded RAM combined with 1,728 logic elements reduce the need for external memory components for many mid-range functions.
• Flexible I/O for 5 V Systems: 147 user I/Os and a 4.75 V–5.25 V supply range make the part suitable for designs operating in 5.0-V domains.
• In-System Reconfigurability: Supports in-circuit reconfiguration and JTAG boundary-scan for streamlined firmware updates and board-level testability.
• Performance-Oriented Interconnect: FastTrack routing, dedicated carry and cascade chains enable efficient implementation of arithmetic and high-fan-in logic with predictable timing.
• Board-Level Packaging: 208-BFQFP with exposed pad and surface-mount compatibility simplifies thermal conduction and PCB assembly for compact designs.
• Commercial Temperature Rating: Specified 0 °C to 70 °C operating range for standard commercial applications.

Why Choose EPF10K30RC208-3N?

The EPF10K30RC208-3N delivers a balanced combination of logic resources, embedded RAM and flexible I/O in a compact 208-pin package—making it a practical choice for mid-density programmable designs that benefit from on-chip memory and in-system reconfigurability. Its feature set from the FLEX 10K family—dedicated arithmetic chains, low-skew clocking and FastTrack interconnect—supports implementations that require predictable routing and efficient arithmetic/logical functions.

This device fits designs that need a commercial-grade, 5.0-V compatible programmable device with moderate logic and memory capacity, packaged for surface-mount assembly. It is well suited for engineers building prototype systems, control logic, interface bridges and memory-accelerated functions where on-chip integration reduces BOM and simplifies board design.

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