EPF10K30RC240-3N

The EPF10K30RC240-3N is an Intel FLEX-10K family embedded programmable logic device (FPGA/PLD) in a 240‑BFQFP exposed-pad surface-mount package. It provides a balanced combination of logic resources, on‑chip memory and I/O density for commercial-temperature system designs.

Designed for system-level integration, the device offers 1,728 logic elements across 216 logic array blocks with 12,288 bits of embedded RAM and 189 user I/O pins, making it suitable for mid-range custom logic, interface adaptation and embedded memory functions in 5 V system environments.

Key Features

• Logic Resources  1,728 logic elements organized into 216 logic array blocks (LABs) to implement medium-density combinational and sequential logic.
• Embedded Memory  Six embedded array blocks (EABs) providing a total of 12,288 bits of on-chip RAM for small buffers, FIFOs and lookup tables.
• I/O and Gate Capacity  189 user I/O pins and 69,000 gates to support multi‑interface designs and moderate system complexity.
• Supply Voltage  Operates from 4.75 V to 5.25 V, suitable for 5.0 V system integration.
• Package & Mounting  240‑BFQFP with exposed pad; supplier device package listed as 240‑RQFP (32×32). Surface-mount mounting type for PCB assembly.
• Commercial Temperature Grade  Specified operating temperature range of 0 °C to 70 °C for commercial deployments.
• Configuration & Test  Supports in-circuit reconfigurability via external configuration device, intelligent controller or JTAG port as described in the FLEX-10K family documentation.
• Environmental  RoHS compliant to meet lead‑free regulatory requirements.

Typical Applications

• System Glue Logic  Implement custom bus arbitration, protocol bridging and board-level control logic where moderate gate count and many I/Os are required.
• Embedded Memory Functions  Local buffering, small FIFO queues and lookup tables using the on‑chip 12,288 bits of RAM to reduce external memory components.
• Peripheral Interface  Interface aggregation and signal conditioning across multiple peripherals using 189 user I/Os to simplify PCB routing and component count.
• Prototyping and Production  Rapidly iterate and deploy mid-density programmable designs that benefit from in‑circuit reconfigurability and standard surface-mount packaging.

Unique Advantages

• Balanced mid-range density: 1,728 logic elements and 69,000 gates provide ample resources for moderate-complexity designs without overspecifying device capacity.
• On-chip RAM reduces BOM: 12,288 bits of embedded memory across six EABs can replace small external SRAMs for local buffering and logic acceleration.
• High I/O count: 189 user I/Os enable multi-protocol interfacing and flexible signal routing on a single device.
• 5 V system compatibility: Defined 4.75–5.25 V operating range simplifies integration into legacy 5.0 V platforms.
• Thermal-friendly package: 240‑BFQFP with exposed pad supports effective PCB-level thermal management in surface-mount assemblies.
• RoHS compliant: Meets lead‑free environmental requirements for modern electronics production.

Why Choose EPF10K30RC240-3N?

The EPF10K30RC240-3N occupies a practical position in the FLEX-10K family for designers who need a mid-density programmable logic device with embedded RAM and substantial I/O capability. Its combination of 1,728 logic elements, 12,288 bits of on-chip RAM and 189 user I/Os supports a wide range of commercial applications where integration, configurability and 5 V compatibility are priorities.

Supported by the FLEX-10K family feature set (including in-circuit reconfigurability and JTAG access), this device is well suited to teams building adaptable, moderately complex designs that benefit from reduced external component count and straightforward PCB integration in a 240‑pin exposed‑pad package.

Request a quote or submit a purchase inquiry to get pricing and availability for the EPF10K30RC240-3N. Our team can provide lead-time information and help with ordering details.