EPF10K30RI208-4

IC FPGA 147 I/O 208RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP Exposed Pad

Quantity 249 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-RQFP (28x28)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case208-BFQFP Exposed PadNumber of I/O147Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30RI208-4 – FLEX-10K Field Programmable Gate Array, 208-BFQFP Exposed Pad

The EPF10K30RI208-4 is an Intel FLEX-10K family FPGA offering embedded programmable logic for system-level integration. Built for industrial applications, it combines a dedicated logic array and embedded memory resources to implement custom logic, megafunctions and peripheral interfaces in a single device.

This device targets designs that require mid-range logic capacity with on-chip RAM and flexible I/O, delivering in-circuit reconfigurability, IEEE 1149.1 JTAG boundary-scan, and system-level features pulled directly from the FLEX-10K architecture.

Key Features

  • Logic Capacity — 1,728 logic elements across 216 logic array blocks (LABs), supporting approximately 69,000 gates of logic and routing resources.
  • Embedded Memory — 12,288 total RAM bits of on-chip memory for implementing buffers, FIFOs and other megafunctions without sacrificing logic capacity.
  • I/O and Interfaces — 147 user I/Os with programmable output slew-rate control, individual tri-state output enable, and open-drain option on each pin to support diverse interface requirements.
  • Supply and Power — Designed for a 4.5 V to 5.5 V supply range consistent with 5.0-V FLEX-10K devices.
  • Reconfiguration & Test — In-circuit reconfigurability via external configuration device or JTAG; built-in IEEE 1149.1 JTAG boundary-scan available without consuming device logic.
  • Clock and Arithmetic Support — Dedicated carry and cascade chains for fast arithmetic and high-fan-in logic; support for multiple global clocks and clock distribution features described in the FLEX-10K family.
  • Package & Mounting — 208-BFQFP exposed pad package (supplier package: 208-RQFP 28×28) in a surface-mount form factor suitable for industrial boards.
  • Environmental Range & Compliance — Industrial operating temperature of -40°C to 85°C and RoHS compliant.

Typical Applications

  • Embedded Control — Implement custom control logic and peripheral glue in industrial controllers using on-chip logic and memory resources.
  • System Integration / SOPC — Integrate megafunctions and specialized memory blocks to consolidate system components onto a programmable chip.
  • Peripheral & PCI Interfacing — Use the device’s FLEX-10K family system features and I/O flexibility for building PCI-compliant peripheral logic and bus interfaces.
  • Prototyping & Custom Logic — Rapidly iterate and validate custom algorithms and logic functions with in-circuit reconfigurability and JTAG access.

Unique Advantages

  • Balanced Logic and Memory: 1,728 logic elements paired with 12,288 bits of embedded RAM enable implementation of both control logic and data buffering on-chip, reducing external component count.
  • Industrial Temperature Rating: Rated for -40°C to 85°C operation, suitable for industrial environments where extended temperature range is required.
  • Flexible I/O Control: Programmable slew-rate, per-pin tri-state control and open-drain option provide adaptability for mixed-signal and mixed-voltage interface requirements.
  • Testability and Reconfiguration: Built-in IEEE 1149.1 boundary-scan and support for in-circuit reconfiguration simplify development, verification and field updates.
  • Compact Surface-Mount Package: 208-pin BFQFP with exposed pad provides a compact footprint and thermal interface for board-level integration.
  • RoHS Compliant: Meets lead-free environmental requirements for modern manufacturing processes.

Why Choose EPF10K30RI208-4?

The EPF10K30RI208-4 positions itself as a mid-range FLEX-10K FPGA that balances logic resources, embedded RAM and flexible I/O in an industrial-temperature, surface-mount package. It is well suited to designers needing on-chip memory for megafunctions, robust test and reconfiguration capabilities, and a compact 208-pin footprint.

For teams developing industrial controllers, system integration projects or PCI-related peripheral logic, this device offers a combination of programmable logic density, embedded memory, and system-level features from the FLEX-10K family to streamline BOM and support iterative development.

If you would like pricing, availability or to submit a quote request for EPF10K30RI208-4, please request a quote or contact our sales team with your quantity and delivery requirements.

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