EPF10K30RC240-4N

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 12288 1728 240-BFQFP Exposed Pad

Quantity 661 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30RC240-4N – FLEX-10K FPGA, 1728 Logic Elements, 240-BFQFP

The EPF10K30RC240-4N is a member of the FLEX 10K family of field-programmable gate arrays (FPGAs). This commercial-grade, surface-mount device integrates 1,728 logic elements and 12,288 bits of embedded RAM to implement mid-density programmable logic and system functions.

Designed for applications that require flexible I/O and moderate embedded memory, the part delivers up to 189 user I/O pins in a 240-pin BFQFP exposed-pad package and operates from a 4.75 V to 5.25 V supply across a 0 °C to 70 °C commercial temperature range.

Key Features

  • Core Logic  1,728 logic elements (LEs) organized into 216 logic array blocks (LABs), providing a programmable fabric for control, glue logic, and custom processing functions.
  • Embedded Memory  Approximately 12.3 Kbits of on-chip RAM (12,288 total RAM bits) for FIFOs, small buffers, and state storage without consuming logic elements.
  • I/O Capacity  Up to 189 user I/O pins, enabling broad connectivity for peripherals, buses, and mixed-signal front ends in a single device.
  • Gate Density  Typical device gate count of 69,000 system gates (logic and RAM), supporting complex logic implementations within a mid-density FPGA class.
  • Power and Supply  Designed for a 4.75 V to 5.25 V supply range, suitable for 5.0-V system environments.
  • Package and Mounting  240-BFQFP with exposed pad and surface-mount footprint (supplier package listed as 240-RQFP 32×32), providing thermal path and reliable board attachment.
  • Configuration and Test  Family-level features include in-circuit reconfigurability and JTAG boundary-scan test support for system-level configuration and board debug (FLEX 10K family capability).
  • Commercial Temperature Grade  Rated for operation from 0 °C to 70 °C to match typical commercial electronics environments.
  • Compliance  RoHS-compliant material status for environmental and regulatory alignment.

Typical Applications

  • Interface and Glue Logic  Use the device to consolidate bus interfacing, protocol translation, and custom peripheral adaptation where a high count of I/Os and flexible logic are required.
  • Embedded Control  Implement custom control state machines, motor or sensor controllers, and system timing logic using the integrated LEs and on-chip RAM.
  • Prototyping and Evaluation  Suitable for development platforms and proofs-of-concept that need reprogrammable silicon with moderate gate and memory resources.
  • Consumer and Commercial Electronics  Integrate display control, user interface logic, and subsystem glue in cost-sensitive commercial devices operating within the specified temperature and voltage ranges.

Unique Advantages

  • Balanced Mid-Density Capability:  Combines 1,728 logic elements with 12,288 bits of embedded RAM to support both logic and small-memory megafunctions in a single device.
  • High I/O Count:  189 user I/Os enable broad system connectivity and minimize the need for external interface components.
  • 5 V System Compatibility:  Native 4.75 V to 5.25 V supply range aligns with 5.0-V system architectures, simplifying power design in legacy or mixed-voltage environments.
  • Surface-Mount BFQFP with Exposed Pad:  The 240-pin package provides a compact footprint with an exposed pad for improved board-level thermal performance and mechanical stability.
  • Family-Level Development Support:  As part of the FLEX 10K family, the device benefits from family features such as JTAG boundary-scan and in-circuit reconfiguration options for development and production workflows.
  • RoHS Compliance:  Meets RoHS requirements for lead-free manufacturing environments.

Why Choose EPF10K30RC240-4N?

The EPF10K30RC240-4N offers a practical balance of programmable logic, embedded memory, and I/O density for commercial applications that require reconfigurable hardware without the complexity of higher-density FPGAs. Its 240-pin BFQFP exposed-pad package and 5 V supply compatibility make it straightforward to integrate into existing commercial system designs.

This part is well suited to engineers building mid-range embedded systems, interface logic, and development platforms who need reliable, reprogrammable silicon backed by the FLEX 10K family feature set and commercial-grade operating parameters.

Request a quote or submit an inquiry to receive pricing, availability, and technical support information for EPF10K30RC240-4N.

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