EPF10K30RC240-4N
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 12288 1728 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 661 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 69000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K30RC240-4N – FLEX-10K FPGA, 1728 Logic Elements, 240-BFQFP
The EPF10K30RC240-4N is a member of the FLEX 10K family of field-programmable gate arrays (FPGAs). This commercial-grade, surface-mount device integrates 1,728 logic elements and 12,288 bits of embedded RAM to implement mid-density programmable logic and system functions.
Designed for applications that require flexible I/O and moderate embedded memory, the part delivers up to 189 user I/O pins in a 240-pin BFQFP exposed-pad package and operates from a 4.75 V to 5.25 V supply across a 0 °C to 70 °C commercial temperature range.
Key Features
- Core Logic 1,728 logic elements (LEs) organized into 216 logic array blocks (LABs), providing a programmable fabric for control, glue logic, and custom processing functions.
- Embedded Memory Approximately 12.3 Kbits of on-chip RAM (12,288 total RAM bits) for FIFOs, small buffers, and state storage without consuming logic elements.
- I/O Capacity Up to 189 user I/O pins, enabling broad connectivity for peripherals, buses, and mixed-signal front ends in a single device.
- Gate Density Typical device gate count of 69,000 system gates (logic and RAM), supporting complex logic implementations within a mid-density FPGA class.
- Power and Supply Designed for a 4.75 V to 5.25 V supply range, suitable for 5.0-V system environments.
- Package and Mounting 240-BFQFP with exposed pad and surface-mount footprint (supplier package listed as 240-RQFP 32×32), providing thermal path and reliable board attachment.
- Configuration and Test Family-level features include in-circuit reconfigurability and JTAG boundary-scan test support for system-level configuration and board debug (FLEX 10K family capability).
- Commercial Temperature Grade Rated for operation from 0 °C to 70 °C to match typical commercial electronics environments.
- Compliance RoHS-compliant material status for environmental and regulatory alignment.
Typical Applications
- Interface and Glue Logic Use the device to consolidate bus interfacing, protocol translation, and custom peripheral adaptation where a high count of I/Os and flexible logic are required.
- Embedded Control Implement custom control state machines, motor or sensor controllers, and system timing logic using the integrated LEs and on-chip RAM.
- Prototyping and Evaluation Suitable for development platforms and proofs-of-concept that need reprogrammable silicon with moderate gate and memory resources.
- Consumer and Commercial Electronics Integrate display control, user interface logic, and subsystem glue in cost-sensitive commercial devices operating within the specified temperature and voltage ranges.
Unique Advantages
- Balanced Mid-Density Capability: Combines 1,728 logic elements with 12,288 bits of embedded RAM to support both logic and small-memory megafunctions in a single device.
- High I/O Count: 189 user I/Os enable broad system connectivity and minimize the need for external interface components.
- 5 V System Compatibility: Native 4.75 V to 5.25 V supply range aligns with 5.0-V system architectures, simplifying power design in legacy or mixed-voltage environments.
- Surface-Mount BFQFP with Exposed Pad: The 240-pin package provides a compact footprint with an exposed pad for improved board-level thermal performance and mechanical stability.
- Family-Level Development Support: As part of the FLEX 10K family, the device benefits from family features such as JTAG boundary-scan and in-circuit reconfiguration options for development and production workflows.
- RoHS Compliance: Meets RoHS requirements for lead-free manufacturing environments.
Why Choose EPF10K30RC240-4N?
The EPF10K30RC240-4N offers a practical balance of programmable logic, embedded memory, and I/O density for commercial applications that require reconfigurable hardware without the complexity of higher-density FPGAs. Its 240-pin BFQFP exposed-pad package and 5 V supply compatibility make it straightforward to integrate into existing commercial system designs.
This part is well suited to engineers building mid-range embedded systems, interface logic, and development platforms who need reliable, reprogrammable silicon backed by the FLEX 10K family feature set and commercial-grade operating parameters.
Request a quote or submit an inquiry to receive pricing, availability, and technical support information for EPF10K30RC240-4N.

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