EPF10K30RI208-4N

IC FPGA 147 I/O 208RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP Exposed Pad

Quantity 6 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-RQFP (28x28)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case208-BFQFP Exposed PadNumber of I/O147Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30RI208-4N – FLEX-10K® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP Exposed Pad

The EPF10K30RI208-4N is a member of the FLEX 10K embedded programmable logic device family. It combines an embedded array and a general-purpose logic array to deliver a versatile FPGA optimized for mid-density system integration and on-chip memory-intensive functions.

Designed for industrial-grade applications, this device provides a balance of logic density, embedded RAM, and I/O capacity for tasks such as system-level glue logic, custom peripherals, and compact SOPC-style integration where a 5 V supply environment is required.

Key Features

  • Logic Capacity  1,728 logic elements and 216 logic array blocks (LABs) provide mid-range programmable logic suitable for moderate-complexity designs.
  • Embedded Memory  Approximately 12,288 bits of on-chip RAM enable implementation of small buffers, state storage, and megafunctions without external memory.
  • I/O and Gate Count  147 user I/O pins and 69,000 gates support a variety of peripheral interfaces and glue logic functions.
  • Supply Voltage  Operates from 4.5 V to 5.5 V, making it suitable for 5.0-V system environments.
  • Package and Mounting  208-BFQFP with exposed pad (surface-mount) and supplier device package listed as 208-RQFP (28×28) for compact board integration and thermal conduction through the exposed pad.
  • Industrial Temperature Range  Rated for operation from −40 °C to 85 °C for deployment in industrial applications.
  • Family-Level System Features  As part of the FLEX 10K family, the device benefits from embedded-array megafunction support, JTAG boundary-scan (IEEE 1149.1), and system-level architecture intended for SOPC-style integration.
  • Standards and Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Use as programmable logic for motor control interfaces, I/O aggregation, and custom control sequencing within industrial systems operating at 5 V.
  • System Integration (SOPC)  Implement on-chip megafunctions and glue logic to consolidate peripherals and simplify board-level design.
  • Peripheral Bridging  Provide custom protocol translation, buffering, and timing adaptation between legacy or bespoke interfaces and modern system buses.
  • User Interface and Embedded Logic  Drive control logic, front-panel interfaces, and small state machines that benefit from on-chip RAM and reconfigurable logic.

Unique Advantages

  • Balanced Logic and Memory: The combination of 1,728 logic elements and ~12,288 bits of embedded RAM lets you implement both control logic and local data storage without external components.
  • 5 V System Compatibility: A 4.5–5.5 V supply range enables straightforward integration into existing 5.0-V platforms.
  • Industrial-Grade Operating Range: Rated −40 °C to 85 °C to meet many industrial environmental requirements.
  • Compact, Thermally Aware Packaging: 208-BFQFP with exposed pad supports surface-mount assembly and improved thermal performance in space-constrained designs.
  • Family-Level Development Ecosystem: Part of the FLEX 10K family, benefiting from the family’s documented support for embedded megafunctions, JTAG boundary-scan, and available development tools.

Why Choose EPF10K30RI208-4N?

The EPF10K30RI208-4N delivers a practical blend of logic density, embedded memory, and I/O in an industrial-temperature, 5 V-capable package. It is well suited for designers who need mid-range programmable logic to consolidate functions, implement custom peripherals, or integrate megafunctions on a single device.

With its FLEX 10K family heritage and RoHS compliance, this device offers a clear path for industrial applications that require reliable operation across temperature extremes, compact packaging with an exposed pad for thermal management, and the memory resources to support on-chip data handling.

Request a quote or submit a purchase inquiry to evaluate EPF10K30RI208-4N for your next design project.

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