EPF10K30RI240-4

The EPF10K30RI240-4 is a FLEX-10K family FPGA optimized for embedded logic and on-chip memory integration. Based on the FLEX 10K architecture, it combines a logic array and embedded memory to support system-level integration and specialized logic functions for industrial applications.

This device delivers a balance of logic capacity, I/O density and embedded RAM for designs that require on-chip storage, configurable logic, and robust interfacing within a surface-mount 240-BFQFP exposed-pad package.

Key Features

• Core Architecture FLEX 10K family architecture providing a logic array suitable for general programmable logic functions.
• Logic Capacity 1,728 logic elements, enabling implementation of moderate-complexity logic designs.
• Embedded Memory 12,288 bits of on-chip RAM for embedded storage and megafunction implementation.
• I/O and Interface Density 189 user I/O pins to support complex interfacing and parallel connections in system designs.
• Gate Density 69,000 system gates (reported) for mapping combined logic and memory resources.
• Power and Voltage Operates from a 4.5 V to 5.5 V supply range appropriate for 5.0-V systems.
• Package and Mounting 240-BFQFP exposed-pad package (supplier package: 240-RQFP 32×32) in a surface-mount form factor.
• Temperature and Grade Industrial grade operation with an operating temperature range of −40 °C to 85 °C.
• System and Test Features Built-in IEEE 1149.1 JTAG boundary-scan circuitry for board-level test and in-circuit configuration support, as described in the FLEX 10K family documentation.
• Environmental Compliance RoHS compliant.

Typical Applications

• System Integration / SOPC Implement embedded programmable logic and megafunctions where on-chip RAM and configurable logic are used to integrate multiple system functions on a single device.
• Embedded Control and Prototyping Use for developing and validating control logic and FPGA-based prototypes that require moderate logic capacity and on-chip memory.
• I/O Expansion and Interface Glue Logic Leverage 189 I/O pins for bridging, buffering, or custom interfacing between subsystems in industrial equipment.
• Memory-Backed Logic Functions Deploy embedded RAM for lookup tables, small data buffers, or specialized logic that benefits from on-chip storage.

Unique Advantages

• Balanced Logic and Memory 1,728 logic elements paired with 12,288 bits of RAM supports designs that need both programmable logic and on-chip storage without immediate dependence on external memory.
• High I/O Count 189 I/O pins accommodate dense peripheral connectivity and parallel interfaces in compact system designs.
• Industrial Temperature Range Rated for −40 °C to 85 °C operation for deployment in industrial environments.
• Surface-Mount Exposed-Pad Package 240-BFQFP exposed-pad package in a 32×32 footprint provides a high-pin-count, board-mountable solution.
• Board Test and Configuration Support IEEE 1149.1 JTAG boundary-scan circuitry supports board-level test and in-circuit configuration activities.
• Regulatory Compliance RoHS compliant for use in assemblies requiring restricted-substance conformance.

Why Choose EPF10K30RI240-4?

The EPF10K30RI240-4 is positioned for engineers who need a mature FLEX 10K architecture with a practical mix of logic elements, on-chip RAM, and high I/O density in an industrial-grade package. Its 1,728 logic elements and 12,288 bits of embedded RAM make it suitable for embedded control, interface bridging, and system integration tasks where on-chip resources reduce external component count.

With an exposed-pad 240-BFQFP surface-mount package, 5 V supply compatibility, and JTAG boundary-scan support, this device offers a compact, testable platform for industrial designs that require configurable logic and reliable operation across a wide temperature range.

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