EPF10K40RC240-3
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 16384 2304 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,928 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 288 | Number of Logic Elements/Cells | 2304 | ||
| Number of Gates | 93000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 16384 |
Overview of EPF10K40RC240-3 – FLEX-10K FPGA, 2,304 logic elements, 189 I/O, 240-BFQFP
The EPF10K40RC240-3 is a FLEX-10K embedded programmable logic device optimized for system-level integration of logic and memory functions. Built on the FLEX 10K architecture, this device combines a logic array with embedded memory blocks to support megafunctions and System-on-a-Programmable-Chip (SOPC) implementations.
With 2,304 logic elements, approximately 16,384 bits of embedded RAM, 189 user I/Os and a 240-pin BFQFP exposed pad package, the EPF10K40RC240-3 targets commercial designs that require mid-range gate density, reconfigurability and a 5.0 V supply operating window.
Key Features
- Logic Capacity 2,304 logic elements and 288 logic array blocks for implementing medium-complexity digital designs.
- Embedded Memory Approximately 16,384 bits of on-chip RAM to support local buffering and megafunctions without reducing logic capacity.
- Gate Count Up to 93,000 maximum system gates, enabling substantial integration of logic and memory on a single device.
- I/O 189 user I/O pins to support diverse peripheral and bus connections in board-level designs.
- Package 240-BFQFP exposed pad (supplier package: 240-RQFP, 32×32) for surface-mount assembly and thermal/power routing.
- Power and Voltage Operates from 4.75 V to 5.25 V supply range consistent with 5.0-V device operation.
- Temperature and Grade Commercial grade operation with an ambient range of 0 °C to 70 °C.
- Configuration and Test In-circuit reconfigurability and built-in JTAG boundary-scan support (IEEE 1149.1) for programming and board-level test without consuming device logic.
- Interconnect and Arithmetic Support FastTrack routing architecture plus dedicated carry and cascade chains for efficient implementation of arithmetic and high-fan-in logic functions.
- I/O Control Per-pin output enable control, open-drain option and programmable slew-rate control for flexible signal interfacing and reduced switching noise.
- Environmental Compliance RoHS compliant.
Typical Applications
- System Integration / SOPC Integration of custom logic and embedded memory blocks for compact System-on-a-Programmable-Chip designs and megafunction implementation.
- PCI and Bus Interfaces Mid-range bus interface logic and glue logic for systems that require reconfigurable peripheral control and protocol handling.
- Control and Signal Processing On-board control logic, state machines and moderate signal-processing functions that benefit from embedded RAM and dedicated arithmetic chains.
- Prototyping and Reconfigurable Modules Rapid hardware prototyping or reconfigurable modules where in-circuit reconfigurability and JTAG programming streamline development and test.
Unique Advantages
- Balanced integration: Combines 2,304 logic elements with embedded memory so designers can implement control, buffering and megafunctions on a single device.
- High I/O count: 189 user I/Os enable flexible board-level interfacing without adding external I/O expanders.
- Configurable I/O behavior: Per-pin output enable, open-drain option and programmable slew-rate provide signal integrity and interfacing flexibility.
- Test and reconfiguration: Built-in JTAG boundary-scan and in-circuit reconfigurability simplify bring-up, debug and field updates.
- Package and thermal routing: 240-pin BFQFP with exposed pad supports compact surface-mount layouts and board-level thermal considerations.
- Standards-based design support: Family features such as dedicated carry/cascade chains and FastTrack interconnect align with automated place-and-route tool flows.
Why Choose EPF10K40RC240-3?
The EPF10K40RC240-3 positions itself as a mid-range FLEX 10K device combining a practical balance of logic density, embedded RAM and high I/O count in a 240-pin BFQFP package. Its on-chip memory, dedicated arithmetic resources and reconfigurability make it well suited for designs that require consolidation of control logic, buffering and interface glue into a single programmable device.
Designed for commercial applications that operate on a 5.0 V supply and within 0 °C to 70 °C, this device delivers reprogrammable hardware flexibility with RoHS compliance and board-friendly packaging for streamlined integration and development.
Request a quote or submit a purchase inquiry for EPF10K40RC240-3 to get pricing and availability details tailored to your project needs.

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