EPF10K40RC240-3

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 16384 2304 240-BFQFP Exposed Pad

Quantity 1,928 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs288Number of Logic Elements/Cells2304
Number of Gates93000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits16384

Overview of EPF10K40RC240-3 – FLEX-10K FPGA, 2,304 logic elements, 189 I/O, 240-BFQFP

The EPF10K40RC240-3 is a FLEX-10K embedded programmable logic device optimized for system-level integration of logic and memory functions. Built on the FLEX 10K architecture, this device combines a logic array with embedded memory blocks to support megafunctions and System-on-a-Programmable-Chip (SOPC) implementations.

With 2,304 logic elements, approximately 16,384 bits of embedded RAM, 189 user I/Os and a 240-pin BFQFP exposed pad package, the EPF10K40RC240-3 targets commercial designs that require mid-range gate density, reconfigurability and a 5.0 V supply operating window.

Key Features

  • Logic Capacity  2,304 logic elements and 288 logic array blocks for implementing medium-complexity digital designs.
  • Embedded Memory  Approximately 16,384 bits of on-chip RAM to support local buffering and megafunctions without reducing logic capacity.
  • Gate Count  Up to 93,000 maximum system gates, enabling substantial integration of logic and memory on a single device.
  • I/O  189 user I/O pins to support diverse peripheral and bus connections in board-level designs.
  • Package  240-BFQFP exposed pad (supplier package: 240-RQFP, 32×32) for surface-mount assembly and thermal/power routing.
  • Power and Voltage  Operates from 4.75 V to 5.25 V supply range consistent with 5.0-V device operation.
  • Temperature and Grade  Commercial grade operation with an ambient range of 0 °C to 70 °C.
  • Configuration and Test  In-circuit reconfigurability and built-in JTAG boundary-scan support (IEEE 1149.1) for programming and board-level test without consuming device logic.
  • Interconnect and Arithmetic Support  FastTrack routing architecture plus dedicated carry and cascade chains for efficient implementation of arithmetic and high-fan-in logic functions.
  • I/O Control  Per-pin output enable control, open-drain option and programmable slew-rate control for flexible signal interfacing and reduced switching noise.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • System Integration / SOPC  Integration of custom logic and embedded memory blocks for compact System-on-a-Programmable-Chip designs and megafunction implementation.
  • PCI and Bus Interfaces  Mid-range bus interface logic and glue logic for systems that require reconfigurable peripheral control and protocol handling.
  • Control and Signal Processing  On-board control logic, state machines and moderate signal-processing functions that benefit from embedded RAM and dedicated arithmetic chains.
  • Prototyping and Reconfigurable Modules  Rapid hardware prototyping or reconfigurable modules where in-circuit reconfigurability and JTAG programming streamline development and test.

Unique Advantages

  • Balanced integration: Combines 2,304 logic elements with embedded memory so designers can implement control, buffering and megafunctions on a single device.
  • High I/O count: 189 user I/Os enable flexible board-level interfacing without adding external I/O expanders.
  • Configurable I/O behavior: Per-pin output enable, open-drain option and programmable slew-rate provide signal integrity and interfacing flexibility.
  • Test and reconfiguration: Built-in JTAG boundary-scan and in-circuit reconfigurability simplify bring-up, debug and field updates.
  • Package and thermal routing: 240-pin BFQFP with exposed pad supports compact surface-mount layouts and board-level thermal considerations.
  • Standards-based design support: Family features such as dedicated carry/cascade chains and FastTrack interconnect align with automated place-and-route tool flows.

Why Choose EPF10K40RC240-3?

The EPF10K40RC240-3 positions itself as a mid-range FLEX 10K device combining a practical balance of logic density, embedded RAM and high I/O count in a 240-pin BFQFP package. Its on-chip memory, dedicated arithmetic resources and reconfigurability make it well suited for designs that require consolidation of control logic, buffering and interface glue into a single programmable device.

Designed for commercial applications that operate on a 5.0 V supply and within 0 °C to 70 °C, this device delivers reprogrammable hardware flexibility with RoHS compliance and board-friendly packaging for streamlined integration and development.

Request a quote or submit a purchase inquiry for EPF10K40RC240-3 to get pricing and availability details tailored to your project needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up