EPF10K50EFC256-1

The EPF10K50EFC256-1 is a FLEX-10KE series field programmable gate array (FPGA) supplied by Intel. It combines a dedicated logic array with embedded memory and flexible I/O to support system-level integration for commercial embedded designs.

With 2,880 logic elements, 40,960 bits of embedded RAM and 191 user I/O pins in a compact 256-BGA package, this device targets applications that require moderate logic density, on-chip memory and board-area efficient packaging.

Key Features

• Logic Capacity  2,880 logic elements and 360 LABs provide the programmable logic resources for medium-complexity designs; the part is specified with 199,000 gates.
• Embedded Memory  40,960 bits of on-chip RAM (approximately 0.041 Mbits) for FIFOs, small buffers and state storage without external memory.
• I/O and Interfaces  191 user I/O pins support flexible peripheral and board-level interfacing while offering individual output enable and programmable output characteristics as part of the FLEX 10K family architecture.
• Packaging and Mounting  256-BGA (256-FBGA, 17×17) surface-mount package optimizes board area while providing a high pin count in a compact footprint.
• Power and Voltage  Operates from a 2.3 V to 2.7 V supply range to match low-voltage system domains.
• Temperature and Grade  Commercial-grade device rated for 0 °C to 70 °C operating temperature.
• Reconfiguration and Test  FLEX 10K family features include in-circuit reconfigurability and built-in JTAG boundary-scan test support for device programming and board-level test.
• Standards and Compliance  RoHS-compliant to meet current lead-free manufacturing requirements.

Typical Applications

• Embedded Control and Glue Logic  Use the device to implement control state machines, address decoding and custom peripheral glue logic in commercial electronic equipment.
• Data Buffering and Small Memory Functions  Leverage the on-chip 40,960-bit RAM for FIFOs, small caches or packet buffering to reduce external memory BOM.
• Prototyping and Development  Suitable for board-level prototypes and proof-of-concept systems where reprogrammability and moderate logic density are required.
• Communications and Interface Bridging  Implement protocol adapters, parallel-to-serial bridges or custom I/O timing adjustments using the device’s flexible I/O resources.

Unique Advantages

• Balanced Logic and Memory:  2,880 logic elements paired with 40,960 bits of embedded RAM provide a compact solution for designs that need both logic and on-chip storage.
• High I/O Count in a Small Package:  191 user I/Os in a 256-BGA (17×17) package reduce PCB area while maintaining board-level connectivity.
• Low-Voltage Operation:  2.3 V–2.7 V supply compatibility supports integration into low-voltage system domains.
• Reconfigurability and Test Support:  In-system reconfiguration options and JTAG boundary-scan support simplify development, programming and manufacturing test flows.
• RoHS Compliance:  Meets lead-free manufacturing requirements for modern commercial electronics production.

Why Choose EPF10K50EFC256-1?

The EPF10K50EFC256-1 delivers a balanced mix of programmable logic, embedded RAM and I/O density in a compact 256-BGA package, well suited to commercial embedded systems that require reconfigurable logic and on-chip memory. Its combination of 2,880 logic elements, 40,960 bits of RAM and nearly 200,000 gate capacity provides designers with the resources to consolidate functions and reduce external components.

This device is appropriate for engineering teams building mid-complexity FPGA-based subsystems who value in-system reconfiguration, JTAG testability and a compact package footprint. Backed by FLEX 10K family documentation and design support, it provides a predictable platform for sustained development and production.

Request a quote or submit a procurement inquiry to receive pricing, availability and delivery information for EPF10K50EFC256-1.