EPF10K50EFC256-3N
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 191 40960 2880 256-BGA |
|---|---|
| Quantity | 509 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 191 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50EFC256-3N – FLEX-10KE Field Programmable Gate Array (FPGA) IC 191 I/O 40960 RAM 2880 Logic Elements 256-BGA
The EPF10K50EFC256-3N is a FLEX 10KE family FPGA IC providing embedded programmable logic and on-chip memory for commercial embedded designs. It combines 2,880 logic elements with 40,960 bits of embedded RAM and 191 user I/O pins in a compact 256‑ball BGA package to support system-level integration and configurable logic functions.
Built on the FLEX 10K architecture, the device supports features such as in-circuit reconfigurability and JTAG boundary-scan, enabling flexible development workflows and board-level testability for commercial applications.
Key Features
- Programmable Logic Capacity — 2,880 logic elements provide the core resources for implementing custom logic, state machines, and glue logic.
- Embedded Memory — 40,960 bits of on-chip RAM for data buffering, small lookup tables, and storage for user logic.
- User I/O — 191 user-accessible I/O pins with per-pin control, enabling versatile interfacing to external devices and buses.
- Power and Supply — Operates from a 2.3 V to 2.7 V supply range to match target system power rails.
- Package & Mounting — 256‑ball FinePitch BGA (256‑FBGA, 17 × 17) in a surface-mount format for space-efficient PCB integration.
- Commercial Temperature Grade — Specified for 0 °C to 70 °C operation, suitable for commercial-grade embedded systems.
- Test & Configuration — Built-in JTAG boundary-scan (IEEE 1149.1) and support for in-circuit reconfigurability via external configuration devices or JTAG.
- Clocking & Timing — FLEX 10K family features such as low-skew clock distribution, ClockLock and ClockBoost options, and multiple global clock/clear signals aid deterministic timing and clock management.
- Series-Level Interconnect & Arithmetic Support — FastTrack interconnect, dedicated carry chains and cascade chains (FLEX 10K family features) facilitate efficient routing and fast arithmetic implementations.
- RoHS Compliant — Conforms to RoHS environmental requirements for lead-free assembly.
Typical Applications
- System Integration & SOPC Functions — Implement embedded megafunctions and memory-intensive logic for compact system-on-programmable-chip designs.
- Configurable Interface Logic — Provide programmable glue logic and I/O interfacing where 191 user I/Os and per-pin control simplify board-level connectivity.
- Prototyping and Development — In-circuit reconfigurability and JTAG support enable iterative development, debugging, and functional verification on prototypes.
- Commercial Embedded Products — Suitable for commercial-grade embedded designs that require moderate logic capacity, on-chip RAM, and a compact BGA package.
Unique Advantages
- Balanced Logic and Memory — 2,880 logic elements paired with 40,960 bits of embedded RAM provide a practical mix of programmable logic and on-chip storage for many embedded functions.
- High I/O Density — 191 user I/O pins in a 256‑ball FBGA package allow complex external interfacing without a large package footprint.
- Flexible Configuration and Test — JTAG boundary-scan and support for in-circuit reconfiguration streamline board bring-up, field updates, and manufacturing test.
- Compact, Surface-Mount Package — 256‑FBGA (17 × 17) enables space-efficient PCB layouts while maintaining access to ample logic and memory resources.
- Commercial Focus — Specified operating range (0 °C to 70 °C) and RoHS compliance match commercial product and manufacturing requirements.
Why Choose EPF10K50EFC256-3N?
The EPF10K50EFC256-3N is positioned for engineers who need a commercially graded, reconfigurable device that balances moderate logic capacity, embedded RAM, and rich I/O in a compact BGA package. Its FLEX 10K family features—like JTAG boundary-scan, low-skew clock distribution, and dedicated arithmetic/cascade resources—support efficient implementation of system-level functions without sacrificing board space.
This device is well suited for commercial embedded designs that require flexible in-field configuration, deterministic clocking options, and straightforward manufacturing testability, delivering long-term design flexibility through programmable logic.
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