EPF10K50EFC256-3N

IC FPGA 191 I/O 256FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 191 40960 2880 256-BGA

Quantity 509 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O191Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50EFC256-3N – FLEX-10KE Field Programmable Gate Array (FPGA) IC 191 I/O 40960 RAM 2880 Logic Elements 256-BGA

The EPF10K50EFC256-3N is a FLEX 10KE family FPGA IC providing embedded programmable logic and on-chip memory for commercial embedded designs. It combines 2,880 logic elements with 40,960 bits of embedded RAM and 191 user I/O pins in a compact 256‑ball BGA package to support system-level integration and configurable logic functions.

Built on the FLEX 10K architecture, the device supports features such as in-circuit reconfigurability and JTAG boundary-scan, enabling flexible development workflows and board-level testability for commercial applications.

Key Features

  • Programmable Logic Capacity — 2,880 logic elements provide the core resources for implementing custom logic, state machines, and glue logic.
  • Embedded Memory — 40,960 bits of on-chip RAM for data buffering, small lookup tables, and storage for user logic.
  • User I/O — 191 user-accessible I/O pins with per-pin control, enabling versatile interfacing to external devices and buses.
  • Power and Supply — Operates from a 2.3 V to 2.7 V supply range to match target system power rails.
  • Package & Mounting — 256‑ball FinePitch BGA (256‑FBGA, 17 × 17) in a surface-mount format for space-efficient PCB integration.
  • Commercial Temperature Grade — Specified for 0 °C to 70 °C operation, suitable for commercial-grade embedded systems.
  • Test & Configuration — Built-in JTAG boundary-scan (IEEE 1149.1) and support for in-circuit reconfigurability via external configuration devices or JTAG.
  • Clocking & Timing — FLEX 10K family features such as low-skew clock distribution, ClockLock and ClockBoost options, and multiple global clock/clear signals aid deterministic timing and clock management.
  • Series-Level Interconnect & Arithmetic Support — FastTrack interconnect, dedicated carry chains and cascade chains (FLEX 10K family features) facilitate efficient routing and fast arithmetic implementations.
  • RoHS Compliant — Conforms to RoHS environmental requirements for lead-free assembly.

Typical Applications

  • System Integration & SOPC Functions — Implement embedded megafunctions and memory-intensive logic for compact system-on-programmable-chip designs.
  • Configurable Interface Logic — Provide programmable glue logic and I/O interfacing where 191 user I/Os and per-pin control simplify board-level connectivity.
  • Prototyping and Development — In-circuit reconfigurability and JTAG support enable iterative development, debugging, and functional verification on prototypes.
  • Commercial Embedded Products — Suitable for commercial-grade embedded designs that require moderate logic capacity, on-chip RAM, and a compact BGA package.

Unique Advantages

  • Balanced Logic and Memory — 2,880 logic elements paired with 40,960 bits of embedded RAM provide a practical mix of programmable logic and on-chip storage for many embedded functions.
  • High I/O Density — 191 user I/O pins in a 256‑ball FBGA package allow complex external interfacing without a large package footprint.
  • Flexible Configuration and Test — JTAG boundary-scan and support for in-circuit reconfiguration streamline board bring-up, field updates, and manufacturing test.
  • Compact, Surface-Mount Package — 256‑FBGA (17 × 17) enables space-efficient PCB layouts while maintaining access to ample logic and memory resources.
  • Commercial Focus — Specified operating range (0 °C to 70 °C) and RoHS compliance match commercial product and manufacturing requirements.

Why Choose EPF10K50EFC256-3N?

The EPF10K50EFC256-3N is positioned for engineers who need a commercially graded, reconfigurable device that balances moderate logic capacity, embedded RAM, and rich I/O in a compact BGA package. Its FLEX 10K family features—like JTAG boundary-scan, low-skew clock distribution, and dedicated arithmetic/cascade resources—support efficient implementation of system-level functions without sacrificing board space.

This device is well suited for commercial embedded designs that require flexible in-field configuration, deterministic clocking options, and straightforward manufacturing testability, delivering long-term design flexibility through programmable logic.

Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for EPF10K50EFC256-3N.

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