EPF10K50EFC256-3

IC FPGA 191 I/O 256FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 191 40960 2880 256-BGA

Quantity 1,242 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O191Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50EFC256-3 – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 191 40960 2880 256-BGA

The EPF10K50EFC256-3 is a FLEX-10KE series field programmable gate array delivering a balance of logic density, on-chip memory, and flexible I/O for commercial embedded designs. It combines 2,880 logic elements with 40,960 bits of embedded RAM and up to 191 user I/O pins in a compact 256-pin BGA package.

Designed for system integration, prototyping, and mid-range programmable logic tasks, this device supports in-circuit reconfigurability and boundary-scan for board-level testability while operating from a 2.3 V to 2.7 V supply across a 0 °C to 70 °C commercial temperature range.

Key Features

  • Logic Capacity — 2,880 logic elements (LEs) providing programmable logic resources and a reported 199,000 gates for implementing custom digital functions.
  • Embedded Memory — 40,960 bits of on-chip RAM suitable for buffering, FIFOs, and small embedded data structures without external memory.
  • I/O and Interface Flexibility — Up to 191 user I/O pins with individual tri-state control options (family-level I/O flexibility noted in the FLEX 10K series).
  • Reconfiguration and Test — Supports in-circuit reconfigurability via external configuration devices, intelligent controllers, or JTAG port; includes JTAG boundary-scan circuitry for board test.
  • Dedicated Fabric Features — Series-level architecture includes dedicated carry and cascade chains and a FastTrack interconnect structure for predictable routing and arithmetic optimization.
  • Package and Mounting — Surface-mount 256-pin BGA; supplier device package listed as 256-FBGA (17×17) for compact board integration.
  • Power and Environmental — Operates from a 2.3 V to 2.7 V supply and is RoHS compliant; commercial grade with an operating range of 0 °C to 70 °C.

Typical Applications

  • Embedded System Integration — Use as a programmable glue logic and control element in mid-range embedded systems where a mix of logic density and on-chip RAM simplifies board design.
  • Prototyping and Development — Rapid hardware prototyping and iterative design flows that require in-circuit reconfiguration and JTAG-based debug and test capabilities.
  • Interface Bridging and Protocol Conversion — Implement custom interface logic and protocol translators leveraging the device’s substantial I/O count and programmable fabric.
  • Memory-Buffered Logic Functions — Small buffers, FIFOs, and state machines that benefit from the device’s 40,960 bits of embedded RAM to reduce external memory needs.

Unique Advantages

  • Balanced Logic and Memory — Combining 2,880 logic elements with 40,960 bits of embedded RAM lets designers implement both complex control logic and local storage on a single device, reducing BOM and board complexity.
  • High I/O Count in a Compact Package — Up to 191 user I/Os in a 256-pin FBGA (17×17) package enables dense connectivity while conserving PCB area.
  • In-Circuit Reconfigurability and Testability — Support for JTAG boundary-scan and external configuration enables efficient board-level testing and flexible deployment updates.
  • Commercial-Grade, RoHS Compliant — Suited for commercial applications requiring regulatory compliance for lead-free assembly and standard temperature operation.
  • Predictable Routing and Arithmetic Support — Family-level features such as FastTrack interconnect and dedicated carry/cascade chains help achieve consistent timing and efficient arithmetic implementations.

Why Choose EPF10K50EFC256-3?

The EPF10K50EFC256-3 positions itself as a practical choice for commercial embedded designs that need a mid-range FPGA with a balanced mix of logic, embedded RAM, and I/O capacity. Its 2,880 logic elements, 40,960 bits of on-chip RAM, and 191 I/Os in a 256-FBGA package provide designers with the resources to consolidate functions, reduce external components, and simplify board layouts.

This device fits design teams focused on rapid prototyping, system integration, and interface logic who value in-circuit reconfigurability, boundary-scan testability, and a compact, RoHS-compliant package backed by the FLEX 10K family architecture and capabilities.

Request a quote or contact sales to discuss availability, lead times, and pricing for EPF10K50EFC256-3.

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