EPF10K50EFC484-2

The EPF10K50EFC484-2 is a FLEX 10K family field programmable gate array (FPGA) device from Intel. It pairs a dedicated logic array with embedded memory and system-level features to support board-level and embedded digital designs requiring reconfigurable logic and on-chip RAM.

Targeted at commercial-grade applications, this surface-mount FPGA delivers a balanced mix of logic density, I/O capacity, and on-chip memory for system integration, rapid prototyping, and peripheral interface logic.

Key Features

• Logic Capacity  Provides 2,880 logic elements and 360 logic array blocks suitable for implementing custom digital logic and control functions.
• Embedded Memory  Includes a total of 40,960 bits of on-chip RAM for FIFOs, small buffers, and state storage without using external memory.
• I/O and Gate Count  Offers 220 user I/O pins and a gate-equivalent count of 199,000 to support complex connectivity and moderate gate-level requirements.
• Power and Supply  Operates from a 2.3 V to 2.7 V supply range, enabling designs aligned with specified system voltage requirements.
• Package and Mounting  Supplied in a 484-BBGA package (484-FBGA, 23×23), optimized for surface-mount PCB assembly and dense board layouts.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 70 °C for typical commercial applications.
• Configuration and Test  Implements in-circuit reconfigurability via external configuration devices or JTAG; includes JTAG boundary-scan circuitry for board-level test without consuming user logic.
• System-Level Features  Architecture supports embedded megafunction implementation and system-on-a-programmable-chip integration for designs that combine logic and specialized memory functions.
• Standards and Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Embedded System Integration  Implement system-level programmable logic and on-chip megafunctions where configurable digital functions and local memory reduce external component count.
• Peripheral and Interface Logic  Build custom protocol bridges, glue logic, and peripheral interfaces using available I/O and reconfigurable logic to adapt to evolving board requirements.
• Prototyping and Low- to Mid-Volume Products  Ideal for rapid prototyping and short-run products that benefit from reprogrammability and reduced NRE compared with fixed-function ASICs.
• Memory-Dependent Functions  Use the on-chip RAM for buffering, small tables, and state machines to minimize external memory dependencies and simplify board design.

Unique Advantages

• Balanced Logic-to-Memory Ratio  With 2,880 logic elements and 40,960 bits of embedded RAM, the device supports designs that need both combinational/sequential logic and local memory.
• Substantial I/O Count  220 user I/Os provide flexibility for multi-signal interfaces, peripherals, and board-level integration without extensive external multiplexing.
• Compact BGA Packaging  484-BBGA (23×23) package enables higher board density and reliable surface-mount assembly for space-constrained systems.
• Commercial-Grade Reliability  Designed for 0 °C to 70 °C operation to meet common commercial product requirements and standard manufacturing flows.
• Reconfigurability and Testability  In-circuit reconfiguration and JTAG boundary-scan support ease iterative development and simplify board-level test and diagnostics.
• Regulatory Alignment  RoHS compliance supports environmentally conscious manufacturing and component selection.

Why Choose EPF10K50EFC484-2?

The EPF10K50EFC484-2 offers a practical combination of logic density, embedded memory, and I/O capacity in a commercial-grade FLEX 10K FPGA package. It is well suited to designers seeking a reconfigurable solution that consolidates logic and memory on-chip while keeping board-level complexity manageable.

For teams developing embedded controllers, peripheral interfaces, or prototype systems, this FPGA delivers reprogrammability, boundary-scan testability, and a compact BGA footprint—providing scalability and deployment flexibility within commercial temperature environments.

Request a quote or submit a purchase inquiry to evaluate the EPF10K50EFC484-2 for your next board-level or embedded FPGA design project.