EPF10K50EFI484-3

The EPF10K50EFI484-3 is a FLEX 10KE embedded programmable logic device designed for system-level integration of memory and specialized logic functions. It combines a logic array with an enhanced embedded array block (EAB) architecture to implement megafunctions and custom logic in a single device.

Targeted at industrial applications, this device delivers up to 2,880 logic elements and approximately 40,960 bits of embedded RAM with up to 220 user I/O pins, offering a compact, reconfigurable building block for SOPC-style designs and I/O‑rich interfaces.

Key Features

• Logic Capacity — 2,880 logic elements (LEs) and up to 199,000 maximum system gates provide the programmable logic fabric for custom digital functions.
• Embedded Memory — Approximately 40,960 bits of total RAM via embedded array blocks (EABs), with dual-port capability and up to 16-bit width per EAB for efficient buffering and on-chip storage.
• I/O Flexibility — 220 user I/O pins with MultiVolt I/O capability to drive or be driven by 2.5‑V, 3.3‑V, or 5.0‑V devices; individual tri-state control, open-drain option, programmable slew-rate control, and clamp options on a per-pin basis.
• Configuration & Test — In-circuit reconfigurability via external configuration devices or JTAG; built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990.
• Clocking & Performance — Dedicated low-skew clock distribution trees, options for ClockLock and ClockBoost to reduce clock delay/skew and support clock multiplication, and support for multiple global clock and clear signals.
• Dedicated Arithmetic & Logic Chains — Dedicated carry and cascade chains for efficient implementation of adders, counters, comparators, and high‑fan‑in logic functions.
• Package & Supply — Surface-mount 484-BBGA package (supplier device package 484-FBGA, 23×23) with an internal operating supply range of 2.3 V to 2.7 V.
• Industrial Temperature Range — Rated for operation from -40 °C to 85 °C for industrial environments.

Typical Applications

• System Integration (SOPC) — Implement megafunctions, embedded memories, and glue logic to consolidate discrete components into a single programmable device.
• Interface Bridging & Buffers — Use the MultiVolt I/O and abundant I/O count to bridge voltage domains and provide buffering between subsystems with differing I/O voltages.
• On-chip Memory and Data Path Acceleration — Leverage the EABs’ dual-port capability for fast on-chip FIFOs, packet buffering, or other memory-intensive functions.
• Industrial Control & Signal Processing — Apply programmable logic and dedicated arithmetic chains for control algorithms, counters, and high‑fan‑in logic in industrial equipment.

Unique Advantages

• High Integration — Combines logic, embedded RAM, and flexible I/O in a single 484‑BBGA package to reduce board-level component count and simplify system design.
• Significant On‑Chip Memory — Approximately 40,960 bits of embedded RAM (EABs) enables local buffering and megafunction implementation without sacrificing logic capacity.
• Flexible I/O Voltage Support — MultiVolt I/O allows direct interfacing with 2.5‑V, 3.3‑V, and 5.0‑V devices, easing mixed-voltage system designs.
• Reconfigurability and Testability — In-circuit reconfigurability and built-in IEEE‑1149.1 JTAG support simplify development, updates, and board-level test strategies.
• Industrial Reliability — Rated for -40 °C to 85 °C operation and delivered in a robust surface-mount BGA package suitable for industrial deployments.
• Dedicated Logic Resources — Carry and cascade chains plus low‑skew clocking accelerate arithmetic and high‑fan‑in functions, improving performance for common digital tasks.

Why Choose EPF10K50EFI484-3?

The EPF10K50EFI484-3 provides a balanced combination of programmable logic density, embedded memory, and flexible I/O in an industrial-temperature FPGA package. Its EABs, dedicated arithmetic chains, and MultiVolt I/O capabilities make it well suited for designers consolidating memory and control functions into a single reconfigurable device.

Supported by development-system toolflows and standard test features, this FLEX‑10KE device is a practical choice for engineering teams building SOPC integrations, interface bridges, and on‑board buffering solutions that require in-field reconfiguration and robust industrial operation.

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